Abstract:
PURPOSE: A phase change recording film having high electrical resistance and a sputtering target for forming a phase change recording film are provided to improve the characteristic of a phase change memory and reduce manufacturing costs by reducing a current for wiring and erasing operation. CONSTITUTION: A phase change memory is comprised of Ge of 17-25%, Sb of 17-25%, C of 0.5-6% and Te of the rest of them. After crystallization, measured non resistance is 5×10-2~5×101Ω·cm through four point prove inspection. Additionally, the phase change memory is comprised of the sum of Al and Si of 0.1%-13%, C of 0.2-8%, B of 0.2-12%, or the sum of Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu of 0.1-10%, and Te of the rest of them.
Abstract:
전기 저항이 높은 상변화 기록막 및 그 상변화 기록막을 형성하기 위한 스퍼터링 타겟을 제공한다. 원자% 로 Ge: 15~30%, Sb: 15~30% 를 함유하고, 추가로 (1) Al 및 Si 중의 1종 또는 2종을 합계로 0.1~13%, (2) C를 0.2~8%, (3) B를 0.2~12%, 혹은 (4) Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu 중의 1종 또는 2종 이상을 합계로: 0.1~10%, 로 이루어진 그룹 중 어느 하나를 함유하고, 잔부가 Te 및 불가피한 불순물로 이루어지는 조성을 갖는 전기 저항이 높은 상변화 기록막, 및 그 막을 형성하기 위한 스퍼터링 타겟.
Abstract:
PURPOSE: A phase change recording layer with high electric resistance and a sputtering target for forming the same are provided to reduce the property of a phase change type nonvolatile memory layer and reduce manufacturing costs by reducing a current in a record erasing operation. CONSTITUTION: A phase change recording layer has a variable electric resistance property. The phase change recording layer includes Ge of 17 to 25%, Sb of 17 to 25%, and C of 0.5 to 6%. The rest of the phase change recording layer is made of Te and impurities. The resistivity of the phase change recording layer by is 5 x 10^-2 to 5 x 10^1 Ω Cm.
Abstract:
PURPOSE: A phase change recording layer having a high electrical resistance and a sputtering target of forming the same are provided to decrease an electric current at the time of writing and erasing operation by increasing an electrical resistance of the same. CONSTITUTION: A phase change recording layer has a high electrical resistance. The phase change recording layer includes Ge of 15 to 30 atom percent, Sb of 15 to 25 atom percent, one or both of Al and Si of a total 0.1 to 13 atom percent, and the balance of Te and impurities. The phase change recording layer has a specific resistance, which is about 5*10¬-12 to 5*10¬1 ¥Ø*cm.