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公开(公告)号：KR101466798B1
公开(公告)日：2014-12-01
申请号：KR1020140060603
申请日：2014-05-20
Applicant: 삼성전자주식회사 , 연세대학교 산학협력단
CPC classification number: G05B19/41875 , G05B2219/32187 , G05B2219/32204 , G05B2219/32324 , G05B2219/45031 , H01L22/20 , Y02P90/20 , Y02P90/22
Abstract: 본 발명의 실시 예에 따른 제조 공정에서의 불량 설비 탐지 방법은: 제품의 공정 경로 데이터 및 공정 결과 데이터를 획득하는 단계; 상기 획득된 데이터들에 기초하여 상기 제품의 불량에 대한 복수의 설비들 각각의 기여도를 산출하는 단계; 상기 산출된 기여도에 기초하여 선택된 설비들에 대하여, 상기 제품의 불량에 기여하는 설비 및 경로의 누적 효과를 규칙으로 생성하는, 수정된 연관 규칙을 적용하는 단계; 그리고 상기 산출된 기여도 및 상기 수정된 연관 규칙에 기초하여 불량설비 판단 지수를 산출하는 단계를 포함할 수 있다. 본 발명의 실시 예에 따르면, 제조 공정에서의 제품 불량을 야기하는 혐의 설비를 효율적으로 탐지할 수 있다. 또한, 제조 공정의 수율을 증가시키는 최적의 경로를 탐색할 수 있다.
Abstract translation: 根据本发明的实施例的在制造过程中检测引起产品故障的设备的方法包括：获取产品的处理路线数据和处理结果数据; 根据获取的数据计算每个设备对产品故障的贡献率; 基于所计算的贡献率对所选择的设备应用校正的关联规则，以便定期地创建导致产品故障和路由的设备的累积效应; 以及基于所计算的贡献率和所述校正的关联规则来计算故障设备确定指标。 根据本发明的实施例，可以有效地检测在制造过程中引起产品故障的设备。 另外，可以检测提高产品收率的最佳途径。
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2.发明授权선행공정의 결과에 따라 최적의 후행공정장비 및/또는 후행공정조건을 가변적으로 적용하는 로트 디스패칭방법 및 이를 위한 시스템 有权/根据处理过程结果进行的变更处理设备和/或处理条件的变更方法及其设备
公开(公告)号：KR100311077B1
公开(公告)日：2001-11-02
申请号：KR1019990046227
申请日：1999-10-23
Applicant: 삼성전자주식회사
IPC: H01L21/66
CPC classification number: G05B19/41875 , G05B2219/32077 , G05B2219/32198 , G05B2219/32263 , G05B2219/45031 , Y02P90/12 , Y02P90/20 , Y02P90/22
Abstract: 반도체제조에있어서, 후행공정이선행공정의결과에영향을받는경우, 각로트에대한선행공정의결과에따라, 최적의후행공정장비및/또는후행공정조건을가변적으로적용하는로트디스패칭방법및 이를위한시스템이개시된다. 로트들에대한선행공정의공정결과와복수개의후행공정장비들의성능및/또는특성간의상관성의시스템적인분석결과에기초하여, 선행공정에서가공된각 로트를그의품질개선에최적인후행공정장비로디스패칭한다. 또한, 후행공정의공정조건은선행공정의각 품질등급에대등시켜다수개마련된다. 각공정조건은대응되는품질등급과목표품질간의오차를최소화할수 있는특성을갖는다. 디스패칭대기중인로트의품질을시스템적으로분석하여그 품질개선에최적인공정조건을적용하여후행공정을수행한다. 제품규격을만족하지만제품규격보다엄격한관리기준을만족하지않은로트들은전자의방법에따라처리하고, 관리기준을만족하는로트들은후자의방법에따라처리한다. 최적의공정장비와공정조건을적용하여후행공정이수행되므로선행공정에서발생한공정오차가후행공정에서더욱개선되어공정능력과수율향상을가져다준다.
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公开(公告)号：KR101720152B1
公开(公告)日：2017-03-27
申请号：KR1020100104245
申请日：2010-10-25
Applicant: 삼성전자주식회사
CPC classification number: G06Q30/0278 , G06Q10/20
Abstract: 공정의효율성이개선된랏의계측방법이제공된다. 이를위해본 발명은, 계측장비내에서단위시간당 피계측부재를처리할수 있는정도를나타내는계측능력을산출하는단계, 처리장비및 처리조건별로계측능력을할당하는단계, 및처리장비및 처리조건에의해처리된랏의계측율을산출하는단계를포함하는계측방법을포함한다.
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公开(公告)号：KR100928205B1
公开(公告)日：2009-11-25
申请号：KR1020070055071
申请日：2007-06-05
Applicant: 삼성전자주식회사
CPC classification number: G05B19/41875 , G05B2219/32181 , G05B2219/32191 , G05B2219/32201 , Y02P90/22
Abstract: 본 발명은 신뢰성을 증대 또는 극대화할 수 있는 반도체 제조설비 관리 시스템 및 그의 통계적 공정 관리방법을 개시한다. 그의 시스템은, 다양한 반도체 단위 공정이 수행되는 복수개의 단위 공정장치; 상기 복수개의 단위 공정장치에서 각 단위 공정이 완료된 웨이퍼의 패턴 특성을 계측하는 복수개의 계측 장치; 및 상기 복수개의 계측 장치에서 계측되는 상기 웨이퍼의 패턴 특성에 대응되는 복수개의 공정 변수에 의해 산출되는 티제곱(T
2 ) 통계량을 이용하여 상기 단위 공정의 이상 여부를 감지하는 호스트 컴퓨터를 포함함에 의해 스킵 룰이 적용되는 계측 공정을 비롯한 모든 단위 공정의 모니터링을 실현시킬 수 있기 때문에 신뢰성을 향상시킬 수 있다.
통계량, Q 통계량, 스킵(skip), 호스트(host), 컴퓨터Abstract translation: 半导体制造装置控制系统及其统计处理控制方法提高了可靠性。 一种半导体制造设备控制系统，包括：多个单元处理装置，用于执行各种半导体单元处理; 多个测量装置，用于测量在多个单元处理装置中的各个单元处理中完成的晶片的图案特性; 和主计算机，用于通过使用由与多个测量装置中测量的晶片的图案特性对应的多个过程变量计算出的T2统计量来感测单位过程的异常状态，由此实现包括 应用跳过规则的测量过程，从而提高可靠性。
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公开(公告)号：KR1020090006437A
公开(公告)日：2009-01-15
申请号：KR1020070069784
申请日：2007-07-11
Applicant: 삼성전자주식회사
Abstract: The processing method of the semiconductor manufacturing facilities is provided to perform the process management irrespective of the size of the sample by improving the existing multivariate SPC. The first step(S100) is for managing the specification of the managed parameter about process samples extracted from the predetermined processing unit to the reference viewpoint. The second step(S200) is for determining the abnormality about extracted process samples after the reference viewpoint and then determining the cause and resetting the reference.
Abstract translation: 提供半导体制造设备的处理方法，通过改进现有的多变量SPC来执行与样本大小无关的过程管理。 第一步骤（S100）用于管理关于从预定处理单元提取到参考视点的处理样本的管理参数的规范。 第二步骤（S200）用于确定在参考视点之后提取的处理样本的异常，然后确定原因并重置参考。
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Patent Agency Ranking
公开(公告)号：KR1020090095694A
公开(公告)日：2009-09-10
申请号：KR1020080020783
申请日：2008-03-06
Applicant: 삼성전자주식회사
IPC: H01L21/02
Abstract: A method for maintaining a statistical process used for a semiconductor manufacture equipment control system are provided to increase the reliability of a process management and maximize it by update a management limit time through QB statistical volume in real time. In a method for maintaining a statistical process used for a semiconductor manufacture equipment control system, measurement data corresponded to the property of a wafer from more than one measurement apparatus are collected(S10). The general statistics amount corresponding to a mean value and a distribution value of measurement data is calculated(S20). The distribution in a group is corresponded to the measurement data detected from a plurality of wafers. Measurement data are detected from a target wafer based on the several cassettes in which a plurality of wafers is mounted.
Abstract translation: 提供了一种用于维持用于半导体制造设备控制系统的统计过程的方法，以提高过程管理的可靠性，并通过实时通过QB统计量更新管理限制时间来最大化。 在用于维持用于半导体制造设备控制系统的统计处理的方法中，收集与来自多于一个测量装置的晶片的属性对应的测量数据（S10）。 计算对应于测量数据的平均值和分布值的一般统计量（S20）。 一组中的分布对应于从多个晶片检测的测量数据。 基于安装有多个晶片的多个盒，从目标晶片检测测量数据。
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公开(公告)号：KR1020090002106A
公开(公告)日：2009-01-09
申请号：KR1020070055071
申请日：2007-06-05
Applicant: 삼성전자주식회사
CPC classification number: G05B19/41875 , G05B2219/32181 , G05B2219/32191 , G05B2219/32201 , Y02P90/22
Abstract: A system for managing semiconductor fabricating equipments to increase or maximize reliability, and a statistical process management method thereof are provided to increase or maximize the reliability by managing process of all lots even if a part of variables are not measured. A plurality of unit process devices(10) perform various kinds of semiconductor unit processes. A plurality of measurers(20) measure pattern property of a wafer finishing each unit process in each process device. A host computer(30) detects abnormality of the unit process by using T-square statistics, which is calculated by a plurality of process parameters corresponding to the measured pattern property of the wager.
Abstract translation: 提供用于管理半导体制造设备以增加或最大化可靠性的系统及其统计过程管理方法，以通过管理所有批次的处理来增加或最大化可靠性，即使一部分变量未被测量。 多个单元处理装置（10）执行各种半导体单元处理。 多个测量器（20）测量在每个处理设备中完成每个单元处理的晶片的图案特性。 主计算机（30）通过使用由对应于下注的测量图案特性的多个处理参数计算出的T平方统计来检测单位处理的异常。
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8.发明公开선행공정의 결과에 따라 최적의 후행공정장비 및/또는 후행공정조건을 가변적으로 적용하는 로트 디스패칭방법 및 이를 위한 시스템 有权用于分配更多的后续处理设备的最佳方法和系统和/或根据先前过程的结果的后续处理条件
公开(公告)号：KR1020010038300A
公开(公告)日：2001-05-15
申请号：KR1019990046227
申请日：1999-10-23
Applicant: 삼성전자주식회사
IPC: H01L21/66
CPC classification number: G05B19/41875 , G05B2219/32077 , G05B2219/32198 , G05B2219/32263 , G05B2219/45031 , Y02P90/12 , Y02P90/20 , Y02P90/22
Abstract: PURPOSE: A method for dispatching a lot which variably adopts optimum subsequent processing equipment and/or subsequent process condition according to a result of a prior process is provided to dispatch respective lots processed in a preceding process with a subsequent process equipment optimum for improving the quality of the lot based upon a process result of the preceding process regarding the lots, capability of a plurality of subsequent process equipment and/or a systematic analysis result of relativity between characteristics. CONSTITUTION: Measured data of an inspection item regarding the respective second lots processed by the first process equipment before the first lot is accumulated in a computer system(100c). And, measured data of an inspection item regarding the respective second lots processed by one of a plurality of the second process equipment is consecutively accumulated in the computer system. The first process equipment generates a variation with reference to a target value of the inspection item regarding the first lot based upon the accumulated measurement data. The second process equipment compensates for the variation toward the target value of the inspection item. Process capability of the respective second process equipment is estimated. A dispatching priority regarding the plurality of second process equipment of the first lot is determined according to the process capability. The first lot is dispatched by one of the plurality of the second process equipment based upon the dispatching priority.
Abstract translation: 目的：提供一种根据先前方法的结果，可变地采用最佳后续处理设备和/或后续处理条件的批量方法，以便在以前的处理过程中处理的各批次与后续处理设备相匹配，以提高质量 基于上述处理的处理结果，关于批次，多个后续处理设备的能力和/或特征之间的相对性的系统分析结果。 构成：在计算机系统（100c）中积累了在第一批次之前由第一处理设备处理的关于第二批次的检查项目的测量数据。 并且，由计算机系统中连续累积关于由多个第二处理设备之一处理的相应第二批次的检查项目的测量数据。 第一处理设备基于累积的测量数据生成关于第一批次的检查项的目标值的变化。 第二工艺设备补偿对检验项目目标值的变化。 估计各个第二处理设备的处理能力。 根据处理能力确定关于第一批次的多个第二处理设备的调度优先级。 基于调度优先级，第一批次由多个第二处理设备之一调度。
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公开(公告)号：KR1020140113153A
公开(公告)日：2014-09-24
申请号：KR1020130028191
申请日：2013-03-15
Applicant: 삼성전자주식회사
CPC classification number: G06F17/18
Abstract: A method for a statistical equivalence test includes the steps of: collecting and preprocessing process data; testing statistical equivalence by considering a statistical tolerance for the collected process data; and finally determining the equivalence by referring to the common technology determination database of process engineers after the statistical equivalence test. Wherein, the common technology determination database of the process engineers is made up of equivalence determination reference values which are objectified by the statistical process of measured technology determination results after measuring the technology determination results of the process engineers to equivalence/difference/improvement levels.
Abstract translation: 统计等价测试方法包括以下步骤：收集和预处理过程数据; 通过考虑收集的过程数据的统计公差来测试统计等价性; 最后通过参考统计学等效性测试之后的过程工程师的公共技术确定数据库来确定等价性。 其中，过程工程师的共同技术决定数据库由等效/差异/改进水平测量工艺工程师的技术确定结果后，由测量技术测定结果的统计过程对象化的等效性确定参考值组成。
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公开(公告)号：KR1020120042528A
公开(公告)日：2012-05-03
申请号：KR1020100104245
申请日：2010-10-25
Applicant: 삼성전자주식회사
CPC classification number: G06Q30/0278 , G06Q10/20 , H01L21/67276 , H01L22/20
Abstract: PURPOSE: A measurement method and a measurement system using the same are provided to improve effectiveness of a process by calculating optimized measurement rate by considering product quality and productivity elements. CONSTITUTION: A processing device(100) processes a lot using various methods according to a plurality of process conditions. The process condition includes options for satisfying regulations according to a semiconductor agreement or a customer request. A measurement device(130) is comprised in order to perform a measurement process with respect to the processed lot. The measurement device measures a particle, a defect, a thickness, or a critical dimension of a wafer. The lot processed by the processing device is established as a measured member.
Abstract translation: 目的：通过考虑产品质量和生产要素，通过计算优化的测量速率，提供测量方法和使用其的测量方法，以提高过程的有效性。 构成：根据多个处理条件，处理装置（100）使用各种方法处理批次。 过程条件包括根据半导体协议或客户请求满足规定的选项。 包括测量装置（130）以便对处理的批次进行测量处理。 测量装置测量晶片的颗粒，缺陷，厚度或临界尺寸。 由处理装置处理的批次被建立为测量成员。
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