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    디스플레이 소자
    3.
    发明公开
    디스플레이 소자 审中-实审
    显示设备

    公开(公告)号：KR1020130068877A

    公开(公告)日：2013-06-26

    申请号：KR1020110136302

    申请日：2011-12-16

    Applicant: 삼성전자주식회사

    Inventor： 김영득 ,  조은석 ,  김지철 ,  최미나 ,  배세란

    IPC: G02F1/1333 ,  G02F1/1345

    CPC classification number: G02F1/133308 ,  G02F2001/13332 ,  H05K1/0203 ,  H05K1/0281 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/09909 ,  H05K2201/2036

    Abstract: PURPOSE: The efficiency for heat dissipation of semiconductor device mounted on the flexible circuit board is improved. CONSTITUTION: A display assembly comprises a flexible circuit board (140) mounted semiconductor device (145) on the first surface (140F). A chassis (200) covers side of the display assembly. The chassis contacts with the second side (140B) of the flexible printed circuit board. The support member (310) adheres to the first side of the flexible printed circuit board. The supporting member contacts to the display assembly.

    Abstract translation: 目的：提高安装在柔性电路板上的半导体器件的散热效率。 构成：显示组件包括在第一表面（140F）上安装的半导体器件（145）的柔性电路板（140）。 底架（200）覆盖显示组件的一侧。 底盘与柔性印刷电路板的第二侧（140B）接触。 支撑构件（310）粘附到柔性印刷电路板的第一侧。 支撑构件接触显示组件。

    보호층형성영역을 정의하는 댐을 구비한 반도체 패키지
    5.
    发明公开
    보호층형성영역을 정의하는 댐을 구비한 반도체 패키지 无效
    具有限定形成保护层的区域的半导体封装

    公开(公告)号：KR1020120036540A

    公开(公告)日：2012-04-18

    申请号：KR1020100098280

    申请日：2010-10-08

    Applicant: 삼성전자주식회사

    Inventor： 배세란 ,  최미나 ,  조은석 ,  황희정

    IPC: H01L23/16 ,  H01L23/28

    CPC classification number: H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L23/3107 ,  H01L23/3735 ,  H01L24/26

    Abstract: PURPOSE: A semiconductor package equipped with a dam is provided to prevent the damage of a semiconductor chip by eliminating constant resistance between the semiconductor chip and a heat radiation plate touched to the top of a protection layer. CONSTITUTION: A dam(110) is formed on a package substrate(170). The dam is formed in order to completely surround a semiconductor chip(150). The semiconductor chip is formed on the package substrate. A protective layer(130) is formed within a protective layer formation region of the package substrate. The protective layer absorbs heat created in the semiconductor chip and releases the heat. A heat radiation plate(190) is close with the protective layer. The dam comprises a plurality of sub dams. The plurality of sub dams is separately arranged around the semiconductor chip.

    Abstract translation: 目的：提供一种装有阻流板的半导体封装件，通过消除半导体芯片与接触保护层顶部的散热板之间的恒定电阻来防止半导体芯片的损坏。 构成：在封装衬底（170）上形成一个坝（110）。 为了完全包围半导体芯片（150），形成坝。 半导体芯片形成在封装基板上。 在封装基板的保护层形成区域内形成保护层（130）。 保护层吸收半导体芯片中产生的热量并释放热量。 散热板（190）与保护层接近。 大坝包括多个子坝。 多个子坝分开布置在半导体芯片周围。

    이미지 센서 칩 및 이를 포함하는 카메라 모듈
    6.
    发明公开
    이미지 센서 칩 및 이를 포함하는 카메라 모듈 无效
    图像传感器芯片和包含该图像的摄像机模块

    公开(公告)号：KR1020110135757A

    公开(公告)日：2011-12-19

    申请号：KR1020100055668

    申请日：2010-06-11

    Applicant: 삼성전자주식회사

    Inventor： 최미나 ,  최경세 ,  이희석 ,  김용훈 ,  황희정 ,  배세란

    IPC: H04N5/225

    CPC classification number: H04N5/2253

    Abstract: PURPOSE: An image sensor chip and a camera module including the same are provided to reduce a noise of a signal through an EMI(Electromagnetic Interference) shielding layer. CONSTITUTION: Light is inputted to an APS(Active Pixel Sensor)(11). A logic unit is located around the APS. An EMI shielding layer(13) is formed on the logic unit except on the APS. The EMI shielding layer includes soft magnetic materials or metal powder. The EMI shielding layer is opaque.

    Abstract translation: 目的：提供一种图像传感器芯片和包括该图像传感器芯片的相机模块，以通过EMI（电磁干扰）屏蔽层来减少信号的噪声。 规定：光输入到APS（有源像素传感器）（11）。 一个逻辑单元位于APS周围。 在除了APS之外的逻辑单元上形成EMI屏蔽层（13）。 EMI屏蔽层包括软磁性材料或金属粉末。 EMI屏蔽层是不透明的。

    전기적인 신호라인과 방열 기능을 하는 방열판을 갖는 반도체 패키지 및 제조방법
    7.
    发明公开
    전기적인 신호라인과 방열 기능을 하는 방열판을 갖는 반도체 패키지 및 제조방법 审中-实审
    具有热丝电信号线和热扩散功能的半导体封装及其制造方法

    公开(公告)号：KR1020140094081A

    公开(公告)日：2014-07-30

    申请号：KR1020130006286

    申请日：2013-01-21

    Applicant: 삼성전자주식회사

    Inventor： 김지철 ,  황희정 ,  배세란 ,  신성호

    IPC: H01L23/36

    CPC classification number: H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

    Abstract: The present invention relates to a stack-type semiconductor package. A technical object to be solved is to provide a system-in-package (SIP) semiconductor package which electrically connects a lower semiconductor chip and an upper semiconductor chip using a heat spreading plate which comprises: a heat spreading layer, an insulating layer, and an electric signal layer or a package on package (PoP) semiconductor package which electrically connects an upper package and a lower package using a heat spreading plate which comprises a heat spreading layer, an insulating layer, and an electrical signal layer. The heat spreading plate has a complex function which realizes a heat spreading function and an electrical signal circuit, thereby obtaining a semiconductor package which has thin and excellent electrical properties.

    Abstract translation: 本发明涉及堆叠式半导体封装。 要解决的技术问题是提供一种使用散热板电连接下半导体芯片和上半导体芯片的系统级封装（SIP）半导体封装，其包括：散热层，绝缘层和 电信号层或封装（PoP）半导体封装，其使用包括散热层，绝缘层和电信号层的散热板电连接上封装和下封装。 散热板具有实现散热功能和电信号电路的复杂功能，从而获得具有薄且优异电性能的半导体封装。

    카메라 모듈
    9.
    发明公开
    카메라 모듈 无效
    相机模块

    公开(公告)号：KR1020110127913A

    公开(公告)日：2011-11-28

    申请号：KR1020100047425

    申请日：2010-05-20

    Applicant: 삼성전자주식회사

    Inventor： 최미나 ,  최경세 ,  배세란

    IPC: H04N5/225

    CPC classification number: H04N5/2253 ,  H01L2224/48091 ,  H04N5/2251 ,  H04N5/2257 ,  H01L2924/00014

    Abstract: PURPOSE: A camera module is provided to embody the miniaturization of the camera module by inserting a film package which includes a second chip into the inside of a case. CONSTITUTION: A lens unit(40) includes a lens(45). A first chip(30) includes an image area. Light in which is passed through the lens unit is emitted to the image area. A housing unit(50) surrounds the first chip side of the lens unit. A recess unit(55) is formed the one wall of the housing unit. A second chip(70) is settled within the recess unit.

    Abstract translation: 目的：提供相机模块以通过将包括第二芯片的胶片包装插入到壳体的内部来体现照相机模块的小型化。 构成：透镜单元（40）包括透镜（45）。 第一芯片（30）包括图像区域。 通过透镜单元的光被发射到图像区域。 壳体单元（50）围绕透镜单元的第一芯片侧。 凹部单元（55）形成在壳体单元的一个壁上。 第二芯片（70）安置在凹槽单元内。

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