Abstract:
PURPOSE: A transistor dielectric rupture type anti-fuse utilizing chisel or CHISHL, and program circuit having it are provided to program data under low voltage by destructing a dielectric adjacent to a drain of a transistor. CONSTITUTION: A substrate(15) has a first conductivity type. A source(13) and drain(14) have a second conductive type and are separated from a predetermined domain within a substrate. A dielectric(12) is formed between source and drain on the top of substrate. The transistor comprises a gate(11) formed on the top of the dielectric. The dielectric between the gate and the substrate which is adjacent to the drain is destroyed.
Abstract:
A floating-body memory and a method for fabricating the same are provided to reduce junction capacitance by arranging leakage shielding patterns between a floating body and first source/drain regions. A semiconductor substrate(11) includes a cell region and a peripheral region. A floating body memory cell is arranged on the cell region of the semiconductor substrate. A first floating body(22) is arranged on the peripheral region of the semiconductor substrate. A peripheral gate pattern(48) is arranged on the first floating body. A plurality of first source/drain regions(58,60) are arranged at both sides of the peripheral gate pattern. A plurality of first leakage shielding patterns(52P) are arranged between the first floating body and the first source/drain regions. The first source/drain regions contact with the first floating body.
Abstract:
본 발명은 바이폴라 접합 트랜지스터(바이폴라 접합 트랜지스터(BJT)) 동작을 사용하는 메모리 셀 구조들, 메모리 어레이들, 메모리 장치들, 메모리 제어기들, 및 메모리 시스템들이 공개한다. 이 장치는 복수개의 메모리 셀들을 구비하는 메모리 어레이 및 제어부를 구비하고, 복수개의 메모리 셀들 각각은 적어도 하나의 비트 라인, 적어도 하나의 소스 라인 및 적어도 하나의 워드 라인 각각에 연결된 제1 노드, 제2노드 및 게이트 노드를 구비하는 플로팅 바디 트랜지스터를 구비하고, 제어부는 적어도 하나의 소스 라인 및 적어도 하나의 비트 라인의 하나를 선택함에 의해서 리프레쉬 명령에 응답하여 리프레쉬 동작을 수행하도록 하고, 만일 제1 데이터가 선택된 라인에 연결된 메모리 셀에 저장되면, 바이폴라 접합 트랜지스터 동작에 의해서 유발되는 제1전류가 흐르게 된다.
Abstract:
A semiconductor memory device including capacitor-less dynamic memory cell, a dynamic memory cell for the same, and a memory system including the same are provided to reduce refresh operation time by supplying refresh control signals to all bit lines and all source lines at the same time. A memory cell array(50) writes/reads data 1 or data 0. A row control part(52) selects memory cells by controlling word lines(WL1-WLi) and source lines(SL1-SLi) in response to write signals(WR)/read signals(RD) and address signals(ADD), and refreshes the memory cells by controlling the source lines in response to refresh orders(REF). A column control part(54) prevents write/read operation of data in non-selected memory cells by controlling the bit lines in response to the write signals/the read signals and the address signals, writes/reads data 1 or data 0 from the selected memory cell, and refreshes the memory cells by controlling the bit lines(BL1-BLj) in response to the refresh orders.
Abstract:
A single transistor memory cell having insulation regions between a source/drain region and a bulk region and a manufacturing method thereof are provided to improve the data retention property of the memory cell by decreasing a junction area in the source/drain region. A single transistor memory cell includes an active semiconductor pattern(55a), a recessed region(R), first and second insulation regions(77s,77d), and a gate electrode(69g). The active semiconductor pattern includes a bulk region and a dopant region, which are sequentially laminated on a semiconductor substrate. The active semiconductor pattern is insulated from the semiconductor substrate. The recessed region penetrates the dopant region to separate the dopant region into a source region and a drain region. First and second sidewalls of the recessed region are adjacent to the source and drain regions, respectively. The first insulation region is applied between the source region and the bulk region to be apart from the first sidewall. The second insulation region is applied between the drain region and the bulk region to be apart from the second sidewall. The recessed region is filled with the gate electrode.
Abstract:
PURPOSE: A transistor, a method for forming the same and a semiconductor memory cell including the same are provided to reduce a gate induced drain leakage current by forming information storage element under space patterns which are located on a gate pattern and on the sidewall of the pattern. CONSTITUTION: A first semiconductor region(80) is formed on a semiconductor substrate(10). Gate patterns(90) are arranged on the first semiconductor region. Spacer patterns(78, 105) are arranged on the sidewall of the gate patterns. The first semiconductor region, a second semiconductor region and a third semiconductor region are successively arranged under the gate pattern and the spacer patterns and around the spacer patterns.
Abstract:
A method of fabricating one-transistor floating body dram is provided to improve electrical property by minimizing electrical interaction between the increased source area the drain region. A method of fabricating one-transistor floating body dram is comprised of the step: forming a semiconductor film, forming an isolation film, and forming a buried gap. A semiconductor substrate has a cell region and a peripheral area. A sacrificing layer is formed on the cell region and is not formed on the peripheral area of the substrate. A semiconductor film is formed on the sacrificing layer of the cell region and semiconductor substrate of the peripheral area. The isolation film is formed on the semiconductor film and sacrificing layer and restricts a floating body.
Abstract:
A one-transistor floating-body DRAM device and a method for manufacturing the same are provided to achieve excellent data retention by minimizing a contact surface between source/drain regions and a floating body through leakage shield patterns. A floating body(55) is arranged on a semiconductor substrate(51). A gate electrode(63) is arranged on the floating body. Source/drain regions(73) are arranged at both sides of the floating body. Leakage shield patterns(71') are arranged between the floating body and the source/drain regions. The floating body has an excess carrier storage region(55S). The source/drain regions are contacted to the floating body. The leakage shield patterns are aligned at an external side of the gate electrode. The leakage shield patterns are contacted to bottoms of the source/drain regions. The floating body is arranged between the source/drain regions and extended to lower portions of the leakage shield patterns.
Abstract:
A pattern recognition-type optical memory using light and a data processing device for recording/reading data are provided to read data from the memory by using light or to store data in the memory, and to form plural pattern types, thereby realizing multiple bits, consequently high integration is enabled while high-speed data processing is available. A light source(120) generates light to sense patterns formed in a pattern recognition-type optical memory(110) by using the light. An image detector(140) receives the light selectively passing through a substrate and a pattern layer formed on the substrate, detects an image corresponding to patterns formed on the substrate, and provides an image signal having different amounts of light by corresponding to pattern types of the image. A photoelectric converter(150) inputs the image signal to convert the image signal into an electric signal.
Abstract:
A semiconductor circuit is provided to improve the degree of integration and to improve characteristics of the semiconductor circuit itself by using an improved vertical transistor structure. A semiconductor circuit includes an amplifying transistor pair, a load portion, and a current source. The amplifying transistor pair includes two transistors. The amplifying transistor pair is used for amplifying a differential input signal and outputting the amplified differential input signal. The load portion is located at a portion between a first power source and the amplifying transistor pair. The current source is located between the amplifying transistor pair and a second power source. The current source is used as a current path between the first and the second power sources. Each transistor of the amplifying transistor pair includes a drain(341) of an upper portion and a source(343) of a lower portion.