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公开(公告)号：KR1020160062510A
公开(公告)日：2016-06-02
申请号：KR1020140165342
申请日：2014-11-25
Applicant: 삼성전자주식회사
IPC: H01L51/56
CPC classification number: H01L51/0011 , C23C14/042 , C23C14/50 , C23C14/54 , C23C14/12 , C23C14/548
Abstract: 유기막증착장치가제공된다. 상기유기막증착장치는, 기판상에유기층을형성하기위한유기층증착장치에있어서, 기판의형상을측정하는형상측정센서부, 기판을제1 방향으로이송하는캐리어, 기판으로증착물질을방사하는증착원, 기판과증착원사이에배치되고, 제1 방향과교차하는제2 방향으로배열된복수개의패턴슬릿을포함하는마스크, 기판과마스크사이의정렬오차를측정하고, 캐리어의제2 방향의진직도를측정하는카메라, 기판과마스크사이의정렬오차를측정하고, 캐리어의제1 및제2 방향과교차하는제3 방향의진직도를측정하는거리측정센서부및 측정된기판의형상및 측정된기판과마스크사이의정렬오차를토대로마스크의위치를제어하는마스크스테이지를포함하되, 증착원에의한증착공정은기판이캐리어에의해제1 방향으로이송되어마스크와거리측정센서부사이를통과할때 수행된다.
Abstract translation: 提供了一种用于沉积有机层的设备。 用于在基板上沉积用于形成有机层的有机层的装置包括测量基板的形状的形状测量传感器单元，沿第一方向传送基板的载体，将沉积材料分配到基板的沉积源， 设置在基板和沉积源之间的掩模，并且具有沿与第一方向相交的第二方向布置的多个图案狭缝，测量基板和掩模之间的对准误差的相机，以及测量载体的第二方向上的平直度 测量基板和掩模之间的对准误差的距离测量传感器单元，以及测量与载体的第一和第二方向相交的第三方向上的平直度;以及掩模台，其基于测量的形状 衬底和衬底与掩模之间的对准误差。 当基板在第一方向上被载体转移时通过沉积源进行沉积处理，以通过掩模和距离测量传感器单元之间。
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公开(公告)号：KR1020130019298A
公开(公告)日：2013-02-26
申请号：KR1020110081369
申请日：2011-08-16
Applicant: 삼성전자주식회사
CPC classification number: B41F5/00 , B41F13/0045 , B41F13/025 , B41F33/02 , B41J15/16 , B41P2213/90 , B65H23/1888 , B65H23/192 , B65H2301/442 , B65H2404/147 , B65H2406/112 , B65H2515/31 , B65H2515/32 , B65H2801/61 , B65H2220/01 , B65H2220/02
Abstract: PURPOSE: A roll-to-roll printing system is provided to transfer a flexible substrate with fluid running down after a process, in which the fluid of low viscosity such as a liquid crystal is utilized, by using a torque value of a nib roll driving motor. CONSTITUTION: A roll-to-roll printing system comprises a driven roll(130B), a pair of nib rolls(140B), a nib roll driving motor(142B), and a control device. The driven roll transmits power to a flexible substrate so that flexible substrate is transferred from an unwinding device to a rewinding device. The nib roll is mounted on both end portions of the driven roll, thereby pressurizing both end portions of the flexible substrate. The nib roll driving motor is connected to the nip roll in order to rotate-drive the nib roll. The control device receives the information of changes in a torque value of the nib roll driving motor. The tension of the flexible substrate is controlled by using the information.
Abstract translation: 目的：提供一种卷对卷打印系统，用于在使用液晶的低粘度流体（利用液晶）的流程中通过使用笔尖辊驱动 发动机。 构成：卷对卷式印刷系统包括从动辊（130B），一对笔尖辊（140B），笔尖辊驱动电机（142B）和控制装置。 从动辊将功率传递到柔性基板，使得柔性基板从退绕装置传送到重绕装置。 笔芯辊安装在从动辊的两端部，从而对柔性基板的两端部进行加压。 笔尖辊驱动电机连接到夹辊，以旋转驱动笔尖辊。 控制装置接收笔尖驱动电机的转矩值的变化信息。 通过使用该信息来控制柔性基板的张力。
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Patent Agency Ranking
公开(公告)号：KR101788171B1
公开(公告)日：2017-10-20
申请号：KR1020110081369
申请日：2011-08-16
Applicant: 삼성전자주식회사
CPC classification number: B41F5/00 , B41F13/0045 , B41F13/025 , B41F33/02 , B41J15/16 , B41P2213/90 , B65H23/1888 , B65H23/192 , B65H2301/442 , B65H2404/147 , B65H2406/112 , B65H2515/31 , B65H2515/32 , B65H2801/61 , B65H2220/01 , B65H2220/02
Abstract: 롤투롤인쇄시스템에서유연기판의장력제어를위해기존에사용하던로드셀이나댄서대신닙 롤구동모터의토크값을이용함으로써, 액정과같은낮은점성의액체를사용한공정이후에도액체의흐름현상없이유연기판을이송시킬수 있는롤투롤인쇄시스템을제안한다. 유연기판이언와인더에서리와인더로이송되도록유연기판에동력을전달하는드리븐롤; 드리븐롤의양단부위에장착되어유연기판의양단부를가압하는한 쌍의닙 롤; 닙롤을회전구동하기위해닙 롤에연결설치되는닙 롤구동모터; 닙롤 구동모터의토크값의변화정보를수신하고, 상기토크값의변화정보를이용하여상기유연기판의장력을제어하는제어장치를포함함으로써, 액체도포공정이후에액체의흐름현상및 공정면의훼손없이유연기판을이송시킬수 있다.
Abstract translation: 通过使用夹辊驱动马达的转矩值来代替传统的测力传感器或跳动器来控制卷对卷印刷系统中的柔性基板的张力，即使在使用诸如液晶的低粘性液体的处理之后， 我们提出一种可以喂纸的卷对卷打印系统。 将动力传递到所述柔性基板以从所述柔性基板卷绕机传递到所述回卷器的从动辊; 一对夹辊，安装在从动辊的两端以按压柔性衬底的两端; 一个与夹辊连接的夹辊驱动马达，用于旋转驱动夹辊; 本发明提供一种控制装置，该控制装置用于接收夹辊式驱动马达的转矩值的变化信息，并利用该转矩值的变化信息来控制柔性基板的张力， 这样可以运输柔性衬底。
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公开(公告)号：KR1020140106878A
公开(公告)日：2014-09-04
申请号：KR1020130021093
申请日：2013-02-27
Applicant: 삼성전자주식회사
CPC classification number: H01L24/81 , B23K1/0016 , B23K1/203 , H01L24/13 , H01L24/75 , H01L2224/131 , H01L2224/7501 , H01L2224/81024 , H01L2224/81191 , H01L2224/81815 , H05K3/3489 , H05K2203/0108 , H01L2924/00014 , H01L2924/014
Abstract: Disclosed are a flip chip packaging method, a flux head applied to the method, and a manufacturing method for the flux head. The flip chip packaging method according to an embodiment of the present invention comprises: a pre-fluxing step for priorly printing a flux on a pad of a printed circuit board (PCB); a flip chip mounting step for aligning a flip chip with the pad of the PCB and mounting a bump of the flip chip on the pad of the PCB; and a flip chip reflow step for bonding the bump of the flip chip with the pad of the PCB by the flux.
Abstract translation: 公开了倒装芯片封装方法，应用于该方法的焊剂头和用于焊剂头的制造方法。 根据本发明的实施例的倒装芯片封装方法包括：用于在印刷电路板（PCB）的焊盘上预先焊接焊剂的预熔剂步骤; 倒装芯片安装步骤，用于将倒装芯片与PCB的焊盘对准，并将倒装芯片的凸块安装在PCB的焊盘上; 以及倒装芯片回流步骤，用于通过焊剂将倒装芯片的凸块与PCB的焊盘接合。
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公开(公告)号：KR101413233B1
公开(公告)日：2014-06-30
申请号：KR1020070093667
申请日：2007-09-14
Applicant: 삼성전자주식회사
IPC: H01L21/027 , G03F7/20 , B82Y40/00
Abstract: 본 발명은 나노 임프린트 리소그래피 공정에 관한 것으로, 본 발명의 목적은 간단한 장비를 이용하여 몰드와 기판 사이에 정전기적 인력을 발생시킴으로써 잔류층을 최소화할 수 있는 나노 임프린트 리소그래피 공정을 제공함에 있다.
이를 위해 본 발명에 따른 나노 임프린트 리소그래피 공정은 기판 위에 레지스트를 도포하고; 몰드를 가압하여 상기 레지스트에 미세패턴을 임프린팅하고; 대전된 도체판을 상기 기판에 접촉시킨다.
나노 임프린트, 잔류층, 정전기력-
公开(公告)号：KR1020120008745A
公开(公告)日：2012-02-01
申请号：KR1020100069770
申请日：2010-07-20
Applicant: 삼성전자주식회사
IPC: G02F1/13 , H01L31/20 , H01L21/683
CPC classification number: G02F1/1303 , H01L21/6838 , H01L31/206 , H01L2224/95115
Abstract: PURPOSE: A roll to roll apparatus and a flexible substrate fixing method are provided to uniformly adhere to the front side of a flexible substrate without bending of a substrate. CONSTITUTION: A roll to roll apparatus(1) includes a base plate(10), an external vacuum chuck plate(20), an internal chuck plate(30), an external vacuum chuck(40), an internal vacuum chuck(50), and a guide roller. The external vacuum chuck plate includes the upper side of the base plate. The internal vacuum chuck plate is included in the center of the external vacuum chuck plate. The inside vacuum chuck is included in the lower side of the internal vacuum chuck plate. The pattern region of the flexible substrate is adsorbed.
Abstract translation: 目的：提供卷对卷装置和柔性基板固定方法，以均匀地粘附到柔性基板的前侧而不使基板弯曲。 卷绕装置（1）包括基板（10），外部真空吸盘板（20），内部夹盘板（30），外部真空吸盘（40），内部真空吸盘（50） ，和导辊。 外部真空吸盘包括基板的上侧。 内部真空夹盘包含在外部真空吸盘的中心。 内部真空吸盘包括在内部真空吸盘板的下侧。 柔性基板的图案区域被吸附。
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公开(公告)号：KR1020090028224A
公开(公告)日：2009-03-18
申请号：KR1020070093667
申请日：2007-09-14
Applicant: 삼성전자주식회사
IPC: H01L21/027 , G03F7/20 , B82Y40/00
CPC classification number: G03F7/0002 , B82Y40/00
Abstract: A nano imprint lithography process is provided to generate electrostatic attraction between the mold and the substrate and to minimize the residual layer. The resist(20) is coated on the substrate(30). The mold(10) is pressurized in the resist. The micro-pattern is imprinted in the resist. The charged conducting plate(40) is contacted with the substrate. The resist is hardened by the thermal scanning or the ultraviolet irradiation after the contact of the substrate. The substrate is earthed and the mold is formed from resist after the contact of resist.
Abstract translation: 提供纳米压印光刻工艺以在模具和衬底之间产生静电吸引力并使剩余层最小化。 抗蚀剂（20）被涂覆在基材（30）上。 模具（10）在抗蚀剂中被加压。 微型图案印在抗蚀剂中。 带电的导电板（40）与衬底接触。 抗蚀剂通过基板接触后的热扫描或紫外线照射而硬化。 基板接地后，抗蚀剂接触后由抗蚀剂形成模具。
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