Abstract:
A semiconductor probe using an impact-ionization semiconductor device is provided to remarkably improve the limit of sensitivity of a resistive probe and easily adjust the quantity of charges capable of being detected by a probe by developing a new probe structure for easily adjusting the band energy of a source. One tilted surface of a probe is formed by an anisotropic etch process using a first etch mask pattern formed on a silicon substrate. After impurities are doped into the exposed substrate to form a first semiconductor electrode region(16), the first etch mask pattern is removed. A second etch mask pattern opposite to the direction of the first etch mask pattern is formed on the silicon substrate. Space layers are formed on the sidewalls of the second etch mask pattern. After the exposed silicon substrate is anisotropically etched to form an opposite tilted surface of the probe, the second etch mask pattern is removed. Impurities are doped into the exposed substrate to form a second semiconductor electrode region(18), and the second etch mask pattern is removed. A silicon oxide layer pattern is formed on the resultant structure by a known method. Space layers are formed on both sidewalls of the silicon oxide layer pattern. By using the space layer, a predetermined depth of the silicon substrate is etched by a photolithography process, and the space layer is removed. The first semiconductor electrode region can be a source terminal, and the second semiconductor electrode region can be a drain terminal.
Abstract:
A method of manufacturing an enhancement semiconductor probe and an information storage device using the same are provided to reduce a process variable in device performance and to increase reliability of mass production by anisotropic-wet-etching a silicon substrate using side-walls. A method of manufacturing an enhancement semiconductor probe comprises the steps of: forming a first etching mask pattern(110a) on a silicon substrate(100c) to form a tip part of the probe in a first direction and forming side-wall areas at two sides of the first etching mask pattern; anisotropic-etching the silicon substrate to form two inclined surfaces of the probe; forming source and drain areas(160,170,180,190) on the silicon substrate by injecting dopants, using the side-wall area as masks, and removing the side-wall areas; removing the first etching mask pattern; forming a second etching mask pattern to form a tip part of the probe in a second direction; forming space layers at two sides of the second etching mask pattern; and etching the silicon substrate by photographing and etching processes and removing the space layers.
Abstract:
PURPOSE: An electronic device and a firmware providing method thereof are provided to reduce a storage space of a component by connecting the component with a system bus based on a booting code without receiving firmware from a memory. CONSTITUTION: Components(240-1~240-n) perform functions of an electronic device. A common memory(230) stores firmware for the components. A system bus(210) connects the components with the common memory. When the electronic device is booted, a control unit(220) transmits the firmware corresponding to the components from the common memory to the components. When the electronic device is booted, the components are connected with the system bus by using a booting code. [Reference numerals] (210) System bus; (220) Main control unit; (230) Common memory unit; (240-1) First component; (240-n) n-th component
Abstract:
PURPOSE: An optical disc apparatus and optical disc read-in method which is applied to the same are provided to perform a read-in process even if a read-in area of an optical disc is damaged. CONSTITUTION: An optical pickup unit(110) reads out data which is recorded in an optical disk(10). In case information, which is recorded in a read-in area, is not able to be read out, the optical pickup unit reads out information which is recorded in a file system area. A control unit(120) performs read-in operation by using a file system.