Abstract:
A semiconductor probe having an embossed resistive tip and a method for fabricating the same are provided to prevent damage thereof by using low energy in an ion implantation process. A protrusive part(172) is protruded from a cantilever(170). An embossed resistive tip(130) is formed on the protrusive part. A first electrode region(132) and a second electrode region(134) are formed at both sides of the embossed resistive tip at the protrusive part. The cantilever is doped with a first impurity. The first electrode region, the second electrode region, and the embossed resistive tip are doped with a second impurity having polarity different from the polarity of the first impurity. The doping density of the embossed resistive tip is lower than that of the first and second electrode regions.
Abstract:
A method of manufacturing an enhancement semiconductor probe and an information storage device using the same are provided to reduce a process variable in device performance and to increase reliability of mass production by anisotropic-wet-etching a silicon substrate using side-walls. A method of manufacturing an enhancement semiconductor probe comprises the steps of: forming a first etching mask pattern(110a) on a silicon substrate(100c) to form a tip part of the probe in a first direction and forming side-wall areas at two sides of the first etching mask pattern; anisotropic-etching the silicon substrate to form two inclined surfaces of the probe; forming source and drain areas(160,170,180,190) on the silicon substrate by injecting dopants, using the side-wall area as masks, and removing the side-wall areas; removing the first etching mask pattern; forming a second etching mask pattern to form a tip part of the probe in a second direction; forming space layers at two sides of the second etching mask pattern; and etching the silicon substrate by photographing and etching processes and removing the space layers.
Abstract:
A semiconductor probe with a resistive tip of high resolution and a method of fabricating the same are provided to improve resolution of a resistive region by forming conductive regions at both sides of the resistive region. A semiconductor probe with a resistive tip of high resolution includes a cantilever(170), and first and second electrode regions(132,134). The cantilever is doped with first impurities, and has a resistive tip doped with second impurities having a polarity opposite to the first impurities at a low concentration and projects from its distal end. The first and second electrode regions are disposed at both sides of the resistive tip of the cantilever and doped with the second impurities. The resistive tip is a rectangular column with a diameter of 100nm or less. The diameter of resistive tip is 14-50nm.
Abstract:
A semiconductor probe using an impact-ionization semiconductor device is provided to remarkably improve the limit of sensitivity of a resistive probe and easily adjust the quantity of charges capable of being detected by a probe by developing a new probe structure for easily adjusting the band energy of a source. One tilted surface of a probe is formed by an anisotropic etch process using a first etch mask pattern formed on a silicon substrate. After impurities are doped into the exposed substrate to form a first semiconductor electrode region(16), the first etch mask pattern is removed. A second etch mask pattern opposite to the direction of the first etch mask pattern is formed on the silicon substrate. Space layers are formed on the sidewalls of the second etch mask pattern. After the exposed silicon substrate is anisotropically etched to form an opposite tilted surface of the probe, the second etch mask pattern is removed. Impurities are doped into the exposed substrate to form a second semiconductor electrode region(18), and the second etch mask pattern is removed. A silicon oxide layer pattern is formed on the resultant structure by a known method. Space layers are formed on both sidewalls of the silicon oxide layer pattern. By using the space layer, a predetermined depth of the silicon substrate is etched by a photolithography process, and the space layer is removed. The first semiconductor electrode region can be a source terminal, and the second semiconductor electrode region can be a drain terminal.
Abstract:
A semiconductor probe with a high-resolution tip and a method of fabricating the same are provided. The semiconductor probe includes: a cantilever doped with a first impurity; a resistive convex portion projecting from an end portion of the cantilever and lightly doped with a second impurity opposite in polarity to the first impurity; and first and second electrode regions formed on either side of the resistive convex portion and heavily doped with the second impurity.
Abstract:
A semiconductor probe and a manufacturing method thereof are provided to keep the resolution of a resistive region and improve sensitivity by forming easily a conductive region in spite of a narrow width of a resistive tip using a doping control layer. A semiconductor probe includes a cantilever(21) doped with first dopants, a resistive tip, a doping control layer and first and second electrode regions. The resistive tip is protruded from an end portion of the cantilever. The resistive tip is lightly doped with second dopants. The doping control layer(25) is formed at both sides of the resistive tip. The first and second electrode regions(22,23) are formed at a lower portion of the doping control layer and both sides of the resistive tip, respectively. The first and second electrode regions are heavily doped with the second dopants.
Abstract:
A semiconductor probe having a wedge shape resistive tip and a method of fabricating the semiconductor probe is provided. The semiconductor probe includes a resistive tip that is doped with a first impurity, has a resistance region doped with a low concentration of a second impurity having an opposite polarity to the first impurity, and has first and second semiconductor electrode regions doped with a high concentration of the second impurity on both side slopes of the resistive tip. The probe also includes a cantilever having the resistive tip on an edge portion thereof, and an end portion of the resistive tip has a wedge shape.
Abstract:
A method and an apparatus for calibrating the position of an image sensor, and a method for detecting position of an image sensor are provided to calibrate and detect the image sensor position in sub-pixel unit and to improve the position sensing accuracy without installing additional position sensor by means of a simplified algorithm using symmetry distribution characteristic of cross correlation related to the image sensor position. The first image information corresponding to the first position of image sensor is gained(210) and the second image information corresponding to the second position of an image sensor is gained(240). The cross correlation value between the first image information and the second image information is calculated(250). The symmetry characteristic of the calculated cross correlation value is investigated(260). In case of existence of the symmetry characteristic, the driving power value of the image sensor for moving distance between the first and the second position is established as the standard driving power value for moving the image sensor in one pixel(280). The position of the image sensor is calibrated by using the established driving power value(290). In case of absence of the symmetry characteristic, the second position is changed by controlling the driving power value(270).
Abstract:
A method for manufacturing a ferroelectric thin film and a method for manufacturing a ferroelectric recording medium are provided to increase recording density of the recording medium by forming uniform nano grains on the ferroelectric thin film. An amorphous TiO2 layer(12) is formed on a substrate(10). A PbO gas atmosphere(200) is formed on the TiO2 layer. The TiO2 layer is mixed with the PbO gas at a temperature between 400 and 800 °C. A PbTiO3 ferroelectric thin film is formed on the substrate. Nano grains with a size between 1 and 20 nm are formed on the PbTiO3 ferroelectric thin film. At least one of a reaction temperature and a reaction time of the TiO2 layer and the PbO gas and a flux of the PbO gas is controlled, such that the size of the nano grain and a stoichiometry of the PbTiO3 ferroelectric thin film are controlled.
Abstract:
A semiconductor probe having a wedge-shaped resistive tip, and a method of fabricating the same are provided to increase the resolution of a resistance area by forming highly doped electrode areas on both sides of the resistance area of the resistive tip. A semiconductor probe comprises a resistive tip(150), and a cantilever(170). The resistive tip, doped by the first impurity, comprises a resistance area(156) which is doped by the second impurity, having an opposite polarity to that of the first impurity, in low concentration on its top portion, and has first and second semiconductor electrode areas(152,154) doped by the second impurity in high concentration on its inclined portion. The cantilever has the resistive tip on its edge portion. The end portion of the resistive tip is wedge-shaped and the length of the end portion of the tip is in a range of 20nm to 2mum.