Abstract:
본 발명은 트랜지스터 및 그 제조방법에 관한 것으로, 더욱 상세하게는 실리콘 기판 위에 탄소나노튜브(CNT)를 게이트로 이용하고 전기적으로 가상 소스/드레인을 형성함으로써, 상용 가능한 수 나노 미터의 채널 길이를 가지는 모스펫(MOSFET) 및 그 제조방법에 관한 것이다.
Abstract:
PURPOSE: A method for manufacturing a thin film transistor having a rounded gate is provided to prevent the generation of hump because an edge part of a gate electrode is rounded by an undercut phenomenon. CONSTITUTION: A first conductive film is evaporated on an insulation board(10). After the first conductive film is dry-etched, a wet-etching process is implemented for a constant time to form a gate(26). A gate insulation layer(40) is formed on the gate and the board. A semiconductor material is evaporated on the gate insulation layer. A source section(52), a drain section(54), and a channel section(56) are formed on the semiconductor material. A source electrode(72) and a drain electrode(74) are respectively formed on the source and the drain sections.
Abstract:
본 발명은 박막 트랜지스터의 제조방법에 관한 것으로, 더욱 상세하게는 습식 식각시 발생되는 언더컷 현상을 적극 이용하여 게이트 전극의 에지 부분을 라운딩된 형태로 제작함으로써, 험프(hump)의 발생을 방지하고 동시에 온전류(on current)를 향상시킬 수 있는 에지 부분이 라운딩된 게이트를 갖는 박막 트랜지스터의 제조방법에 관한 것이다.
Abstract:
PURPOSE: A 1T DRAM(Dynamic Random Access Memory) device which includes two gates in a depressed body, an operation method thereof, and a manufacturing method for the same are provided to independently apply negative voltage to the gate which is not overlapped with a drain, thereby significantly increasing data retention time. CONSTITUTION: A semiconductor body(32) is electrically isolated and depressed. A depressed part of the semiconductor body is arranged as a trench shape. A gate insulating film(52) is arranged in the depressed part of the semiconductor body. A first gate(62) and second gate(64) are filled in the depressed part of the semiconductor body. A source(72) and drain(74) are arranged with an N-type impurity doping layer.
Abstract:
PURPOSE: A tunneling field effect transistor having the FINFET structure of an independent dual gate and a fabrication method thereof are provided to increase the driving current without the loss of a separate area by forming a vertical dual gate structure which is electrically separated from both sides of a semiconductor pin. CONSTITUTION: A semiconductor substrate (10) includes a semiconductor pin (14) at a constant height. A p+ region (62) and an n+ region (64) are formed at both sides of the semiconductor substrate. The semiconductor pin is formed between the p+ region and the n+ region. A first gate (52) is formed between one side of the semiconductor pin and the n+ region. A second gate (54) is formed between the other side of the semiconductor pin and the p+ region. The material of the first gate is different from that of the second gate.
Abstract:
본 발명은 커패시터가 없는 1T 디램 소자와 그 동작방법 및 제조방법에 관한 것으로, 함몰된 바디에 두개의 게이트를 갖는 구조를 함으로써, GIDL 현상을 이용한 쓰기 동작이 가능하여 종래 소자의 신뢰성 문제를 해결할 수 있음은 물론 드레인과 겹치지 않는 게이트에 음의 전압을 독립적으로 인가할 수 있어 데이터 "0"의 보유시간을 획기적으로 늘릴 수 있게 된 효과가 있다.
Abstract:
PURPOSE: A two-bit resistance memory device using an inverted staggered thin film transistor structure is provided to improve integration by forming a source electrode and a drain electrode to be asymmetrical. CONSTITUTION: A gate electrode(10) is formed on an insulating substrate. A gate insulating layer(20) is formed on the gate electrode. An active layer(30) is formed on the gate insulating layer. A resistance variable layer(40) is formed on the active layer. A source electrode(50) and a drain electrode(60) are formed on the resistance variable layer.
Abstract:
PURPOSE: A transistor which uses carbon nano-tubes for a gate and a manufacturing method thereof are provided to electrically arrange a virtual source/drain with a second gate, thereby solving a problem according to a short channel effect. CONSTITUTION: A carbon nano-tube is arranged on the semiconductor substrate while placing a first insulating film(32) between the carbon nano-tube and the semiconductor substrate. A first gate(42) uses the carbon nano-tube. A second gate(62) is formed on the first gate by placing a second insulating film(52) between the first gate and the second gate. The second gate is formed by covering the first gate. An impurity doping layer(22,24) for source/drain contact is arranged on both sides of the semiconductor substrate by placing the second gate between the doping layer and the semiconductor substrate.