公开(公告)号：KR101232456B1

公开(公告)日：2013-02-12

申请号：KR1020110081845

申请日：2011-08-17

Applicant: 성균관대학교산학협력단

Inventor： 서수정 ,  임승규 ,  홍수연 ,  이원표 ,  이재윤 ,  이용우 ,  김진수 ,  나성훈 ,  이창형 ,  박은미

IPC: H01L21/683 ,  H01L21/60 ,  H01L23/48

Abstract: PURPOSE: A jig for filling a via hole, a via hole filling device, and a via hole filling method are provided to improve a process speed by mounting a first substrate and a second substrate on the upper and lower sides of a receiving space. CONSTITUTION: A body(110) includes a first receiving groove and a second receiving groove. A peripheral side of a first substrate(10) is received in the inner sidewall of the first receiving groove. The first substrate includes a via hole. A peripheral side of a second substrate(20) and the first receiving groove are received in the inner sidewall of a second receiving groove. A paste supply unit(120) supplies metal paste to the receiving space.

Abstract translation: 目的：提供用于填充通孔的夹具，通孔填充装置和通孔填充方法，以通过将第一基板和第二基板安装在接纳空间的上侧和下侧来提高加工速度。 构成：主体（110）包括第一接收槽和第二接收槽。 第一基板（10）的周边被容纳在第一接收槽的内侧壁中。 第一基板包括通孔。 第二基板（20）的外周侧和第一接收槽被容纳在第二接收槽的内侧壁中。 糊剂供给单元（120）将金属糊料供给到容纳空间。