반도체 레이저 소자 및 그 제조 방법
    2.
    发明公开
    반도체 레이저 소자 및 그 제조 방법 失效
    半导体激光器件及其制造方法

    公开(公告)号:KR1020070085251A

    公开(公告)日:2007-08-27

    申请号:KR1020077008334

    申请日:2005-12-06

    Abstract: Disclosed is a semiconductor laser device (1) comprising a substrate (3) having a major surface (3a), a photonic crystal layer (7) which is formed above the substrate (3) along the direction in which the major surface (3a) extends and contains an epitaxial layer (2a) composed of GaN and a low refractive index material (2b) having a refractive index lower than the epitaxial layer (2a), an n-type cladding layer (4) formed on the substrate (3), a p-type cladding layer (6) formed above the substrate (3), an active layer (5) interposed between the n-type cladding layer (4) and the p-type cladding layer (6) which emits light when carriers are injected thereinto, and a GaN layer (12) directly covering the photonic crystal layer (7). The semiconductor laser device can be manufactured without performing fusion bonding.

    Abstract translation: 公开了一种半导体激光装置(1),其包括具有主表面(3a)的基板(3),沿着主表面(3a)的方向形成在基板(3)上方的光子晶体层(7) 延伸并包含由GaN构成的外延层(2a)和折射率低于外延层(2a)的低折射率材料(2b),形成在基板(3)上的n型覆层(4) ,形成在所述基板(3)上方的p型覆层(6),插入在所述n型覆盖层(4)与所述p型覆盖层(6)之间的有源层(5),所述p型覆盖层在载体 以及直接覆盖光子晶体层(7)的GaN层(12)。 可以在不进行熔接的情况下制造半导体激光装置。

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