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公开(公告)号：KR1020090098216A
公开(公告)日：2009-09-17
申请号：KR1020080023454
申请日：2008-03-13
Applicant: 전자부품연구원
CPC classification number: H01L24/82 , H01L2224/04105 , H01L2224/19 , H01L2224/32245 , H01L2224/73267 , H01L2224/8203 , H01L2224/92144 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/18162 , H01L2224/18 , H01L2924/00012
Abstract: A substrate embedded chip and method of manufacturing the same are provided to reduce the reliability deterioration due to the difference of the coefficient of thermal expansion of chip and metal film. A plurality of penetration holes is formed in the metal film(100) pattern. The chip(200) having input-output terminal(210) is adhered to metal film patterns and is formed in the location corresponding to a plurality of penetration holes. The sealing agent(400) surrounds the chip and is formed at the upper part of the metal film. The pads(511,512,513) are connected to input-output terminals through a plurality of penetration holes. In the sealing agent, a plurality of penetration holes is formed. The sealing agent covers at least a part of heat radiating portion.
Abstract translation: 提供了基板嵌入式芯片及其制造方法，以减少由于芯片和金属膜的热膨胀系数的差异导致的可靠性劣化。 在金属膜（100）图案中形成多个贯通孔。 具有输入输出端子（210）的芯片（200）被粘附到金属膜图案并且形成在与多个穿透孔相对应的位置。 密封剂（400）围绕芯片并形成在金属膜的上部。 焊盘（511,512,513）通过多个贯穿孔连接到输入输出端子。 在密封剂中形成有多个贯通孔。 密封剂覆盖散热部分的至少一部分。
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公开(公告)号：KR101376765B1
公开(公告)日：2014-03-21
申请号：KR1020110146070
申请日：2011-12-29
Applicant: 전자부품연구원
IPC: H01L23/64
CPC classification number: H01L24/97 , H01L2224/16 , H01L2224/48091 , H01L2924/00014
Abstract: 본발명은인터포저나이와등가의기판을사용함이없이능동소자 IC나수동소자를몰딩하여패키지함으로써몰딩패키지의가격을낮추고사이즈를작게함은물론이고전기적인연결이확실하게이루어질수 있도록한 인터포저가필요없는몰딩패키지제조방법에관한것이다. 본발명의인터포저가필요없는몰딩패키지제조방법은금속박판위에능동소자나수동소자의단자가연결될부위를마스킹한상태에서솔더레지스트를도포하여접속단자를형성하는 (a) 단계; 상기접속단자에능동소자나수동소자를실장한상태에서본딩을수행하여상기접속단자와능동소자나수동소자를전기적으로연결하는 (b) 단계및 능동소자나수동소자를에워싸도록패키지용수지로몰딩을수행하는 (c) 단계를포함하여이루어진다. 전술한구성에서, 상기 (a) 단계이전에상기금속박판을점착성분을갖는캐리어에접합하는 (pa) 단계및 상기 (c) 단계이후에상기캐리어를제거하는 (d) 단계를더 구비한것을특징으로한다. 상기 (a) 단계에서형성된상기접속단자에금 도금을수행하는것을특징으로한다.
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公开(公告)号：KR1020130077389A
公开(公告)日：2013-07-09
申请号：KR1020110146070
申请日：2011-12-29
Applicant: 전자부품연구원
IPC: H01L23/64
CPC classification number: H01L24/97 , H01L2224/16 , H01L2224/48091 , H01L2924/00014
Abstract: PURPOSE: A method for manufacturing a molding package without an interposer is provided to electrically connect an IC chip to a main board by performing a molding process after the terminal of the IC chip is bonded to a metal plate. CONSTITUTION: A connection terminal is electrically connected to an IC chip (S30). The peripheral part of the IC chip is molded (S40). A carrier used as a temporary supporter is removed (S50). A through hole is formed on the upper part of a structure after a metal plate is laminated. An upper metal plate is connected to a lower metal plate by plating the through hole (S60). [Reference numerals] (AA) Start; (BB) End; (S10) Metal plate is combined with a carrier; (S20) Connection terminal is formed on a metal plate by a solder mask process; (S30) Connection terminal is electrically connected to an IC chip; (S40) Peripheral part of the IC chip is molded; (S50) Carrier used as a temporary supporter is removed; (S60) Through hole is formed on the upper part of a structure after a metal plate is laminated. An upper metal plate is connected to a lower metal plate by plating the through hole; (S70) Upper and lower metal plates are electrically connected
Abstract translation: 目的：提供一种用于制造没有插入件的成型封装件的方法，用于在将IC芯片的端子接合到金属板上之后，通过执行模制工艺将IC芯片与主板电连接。 构成：连接端子与IC芯片电连接（S30）。 模制IC芯片的外围部分（S40）。 用作临时支持者的载体被移除（S50）。 在金属板层叠之后，在结构的上部形成通孔。 上金属板通过电镀通孔连接到下金属板（S60）。 （附图标记）（AA）开始; （BB）结束; （S10）金属板与载体组合; （S20）通过焊接掩模工艺在金属板上形成连接端子; （S30）连接端子与IC芯片电连接; （S40）IC芯片的外围部分成型; （S50）移除用作临时支持者的载体; （S60）在层压金属板之后，在结构的上部形成通孔。 上金属板通过电镀通孔连接到下金属板; （S70）上下金属板电连接
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公开(公告)号：KR100963201B1
公开(公告)日：2010-06-16
申请号：KR1020080023454
申请日：2008-03-13
Applicant: 전자부품연구원
CPC classification number: H01L24/82 , H01L2224/04105 , H01L2224/19 , H01L2224/32245 , H01L2224/73267 , H01L2224/8203 , H01L2224/92144 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/18162 , H01L2224/18 , H01L2924/00012
Abstract: 본 발명은 칩 내장형 기판 및 그의 제조 방법에 관한 것으로, 금속박에 미리 관통홀들을 형성하여, 칩과 관통홀들의 정렬을 정밀 및 신속하게 할 수 있어, 칩 내장형 기판의 제조 수율을 향상시킬 수 있게 된다.
더불어, 본 발명은 칩의 열 팽창 계수와 금속박의 열팽창 계수 사이의 열팽창 계수를 갖는 물질로 금속박과 칩을 접착함으로써, 칩과 금속박의 열팽창 계수의 차이로 인한 신뢰성 저하를 감소시킬 수 있는 장점이 있는 것이다.
칩, 동박, 관통홀, 내장, 접착, 정렬Abstract translation: 提供了基板嵌入式芯片及其制造方法，以减少由于芯片和金属膜的热膨胀系数的差异导致的可靠性劣化。 在金属膜（100）图案中形成多个贯通孔。 具有输入输出端子（210）的芯片（200）被粘附到金属膜图案上，并且形成在对应于多个穿透孔的位置。 密封剂（400）围绕芯片并形成在金属膜的上部。 焊盘（511,512,513）通过多个贯穿孔连接到输入输出端子。 在密封剂中形成有多个贯通孔。 密封剂覆盖散热部分的至少一部分。
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