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公开(公告)号：KR101480178B1
公开(公告)日：2015-01-09
申请号：KR1020110138667
申请日：2011-12-20
Applicant: 제일모직주식회사
CPC classification number: C09D163/00 , C08G59/621 , C08K3/36
Abstract: 본 발명은 특정 구조의 경화제를 포함하는 반도체 소자 밀봉용 에폭시 수지 조성물에 관한 것이다. 본 발명의 에폭시 수지 조성물은 유리전이 온도가 높고 경화 수축율이 낮아 휨 특성이 우수하고, 부착성 및 흡수율이 낮아 신뢰성이 좋으며, 할로겐계 난연제를 사용하지 않고도 우수한 난연성을 확보할 수 있어 환경 친화적이다.
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公开(公告)号：KR1020120074118A
公开(公告)日：2012-07-05
申请号：KR1020100136077
申请日：2010-12-27
Applicant: 제일모직주식회사
Abstract: PURPOSE: An epoxy resin composition for sealing semiconductor device and a semiconductor device using the same are provided to improve reliability, moldability, and fire retardance. CONSTITUTION: An epoxy resin composition for sealing semiconductor device comprises an epoxy resin, a hardener, a plasticizer, and inorganic filler. The plasticizer includes benzoate ester based compound. The benzoate ester based compound comprises a compound marked as chemical formula 1. In the chemical formula 1, A and B are independently indicate H or C1-4 alkyl group. 0.01-5 weight% of the plasticizer is included based on the whole composition. A flexural modulus(ASTM D-790, 25°C) of the epoxy resin composition is 2230 - 2300.
Abstract translation: 目的：提供用于密封半导体器件的环氧树脂组合物和使用其的半导体器件，以提高可靠性，成型性和阻燃性。 构成：用于密封半导体器件的环氧树脂组合物包括环氧树脂，硬化剂，增塑剂和无机填料。 增塑剂包括苯甲酸酯类化合物。 苯甲酸酯类化合物包含标记为化学式1的化合物。在化学式1中，A和B独立地表示H或C 1-4烷基。 基于整个组合物包括0.01-5重量％的增塑剂。 环氧树脂组合物的弯曲模量（ASTM D-790,25℃）为2230〜2300。
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公开(公告)号：KR1020110018606A
公开(公告)日：2011-02-24
申请号：KR1020090076151
申请日：2009-08-18
Applicant: 제일모직주식회사
Abstract: PURPOSE: An epoxy resin composition for encapsulating a semiconductor device is provided to ensure excellent warpage property and soldering resistance required for a lead-free soldering process. CONSTITUTION: An epoxy resin composition for encapsulating a semiconductor device comprises, based on 100 parts by weight of the epoxy resin composition, 3~14 parts by weight of epoxy resins represented by chemical formula 1; 2~12 parts by weight of hardeners represented by chemical formula 2; and 80~92 parts by weight of inorganic filler. In chemical formula 1, n and m are 0 or 1. In chemical formula 2, k is 1-7.
Abstract translation: 目的：提供用于封装半导体器件的环氧树脂组合物，以确保无铅焊接工艺所需的优异的翘曲性能和耐焊接性。 构成：用于封装半导体器件的环氧树脂组合物，以100重量份的环氧树脂组合物为基准，含有3〜14重量份的由化学式1表示的环氧树脂; 2〜12重量份由化学式2表示的硬化剂; 和80〜92重量份的无机填料。 在化学式1中，n和m为0或1.在化学式2中，k为1-7。
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公开(公告)号：KR101362887B1
公开(公告)日：2014-02-14
申请号：KR1020110048753
申请日：2011-05-23
Applicant: 제일모직주식회사
CPC classification number: H01L23/295 , C08G59/3218 , C08L63/04 , C09D163/04 , C09J163/04 , H01L2924/0002 , H01L2924/00
Abstract: 본 발명은 반도체 밀봉용 에폭시 수지 조성물 및 상기 수지 조성물을 사용하여 밀봉된 반도체 소자에 관한 것이다. 보다 구체적으로, 본 발명은 특정 구조의 에폭시 수지를 포함시켜, 난연제를 사용하지 않고도 우수한 난연성을 확보할 수 있어 환경 친화적이고, 유동성, 부착성 및 신뢰성이 좋은 반도체 밀봉용 에폭시 수지 조성물 및 상기 수지 조성물을 사용하여 밀봉된 반도체 소자에 관한 것이다.
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公开(公告)号：KR1020130071264A
公开(公告)日：2013-06-28
申请号：KR1020110138667
申请日：2011-12-20
Applicant: 제일모직주식회사
CPC classification number: C09D163/00 , C08G59/621 , C08K3/36
Abstract: PURPOSE: An epoxy resin composition is provided to have high glass transition temperature, to have low hardening contraction ratio, excellent package-bowing phenomenon, excellent adhesion and reliability, and flowability. CONSTITUTION: An epoxy resin composition includes an epoxy resin, hardener, curing accelerator, and inorganic filler. Te curing agent has a multifunctional novolak structure including a non-phenyl derivative represented by chemical formula 1. In chemical formula 1, the average value of n is 1-10. The epoxy resin composition additionally includes a non-halogen-based flame retardant. The equivalent ratio of hydroxyl group in the curing agent is 100-350 g/eq, and the melt viscosity of the curing agent at 150 °C is 0.08-3 poise. The amount of the curing agent represented by chemical formula 1 is 1-15 wt% with regard to the epoxy resin composition.
Abstract translation: 目的：提供具有高玻璃化转变温度，低硬化收缩率，优异的包装弯曲现象，优异的粘合性和可靠性以及流动性的环氧树脂组合物。 构成：环氧树脂组合物包括环氧树脂，硬化剂，固化促进剂和无机填料。 Te固化剂具有包括由化学式1表示的非苯基衍生物的多官能酚醛清漆结构。在化学式1中，n的平均值为1-10。 环氧树脂组合物另外包括非卤素阻燃剂。 固化剂中羟基的当量比为100-350g / eq，固化剂在150℃下的熔体粘度为0.08-3泊。 相对于环氧树脂组合物，由化学式1表示的固化剂的量为1-15重量％。
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Patent Agency Ranking
公开(公告)号：KR1020130067691A
公开(公告)日：2013-06-25
申请号：KR1020110134504
申请日：2011-12-14
Applicant: 제일모직주식회사
IPC: C08L79/08 , C08G73/10 , C09K19/56 , G02F1/1337
Abstract: PURPOSE: A liquid crystal alignment agent is provided to have excellent orientation safety and excellent texture, by having a liquid crystal-friendly structure. CONSTITUTION: A liquid crystal alignment agent includes a polymer selected from polyamic acids including a structure unit represented by chemical formula 1, polyimide including a structure unit represented by chemical formula 2, and combinations thereof. In chemical formula 1 and 2, each of X^1 and X^2 is the same as or different from each other, and is independently quadrivalent organic group derived from acid dianhydrides; each of Y^1 and Y^2 is the same as or different from each other, and is independently a divalent organic group derived from diamine.
Abstract translation: 目的：通过具有液晶友好的结构，提供液晶取向剂以具有优异的取向安全性和优异的质感。 构成：液晶取向剂包括选自包括由化学式1表示的结构单元的聚酰胺酸的聚合物，包含由化学式2表示的结构单元的聚酰亚胺及其组合。 在化学式1和2中，X 1和X 2两个彼此相同或不同，并且独立地为来自酸二酐的四价有机基团; Y 1和Y 2中的每一个彼此相同或不同，并且独立地是衍生自二胺的二价有机基团。
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公开(公告)号：KR1020120130655A
公开(公告)日：2012-12-03
申请号：KR1020110048752
申请日：2011-05-23
Applicant: 제일모직주식회사
Abstract: PURPOSE: An epoxy resin composition for encapsulating a semiconductor is provided to have good reliability and flowability while having excellent flexural property and to obtain excellent flame retardance without using a flame retardant. CONSTITUTION: An epoxy resin composition for encapsulating a semiconductor comprises an epoxy resin, a hardening agent, a hardening accelerator, and an inorganic filler. The epoxy resin is a polyfunctional novolac structured epoxy resin which comprises a biphenyl derivative indicated in chemical formula 1. In chemical formula 1, average value of n is 1-10. The comprised amount of the epoxy resin is 1-16 weight% based on the epoxy resin composition. The composition additionally comprises 0.5-10 weight% of the flame retardant.
Abstract translation: 目的：提供用于封装半导体的环氧树脂组合物以具有优异的可靠性和流动性，同时具有优异的弯曲性能，并且在不使用阻燃剂的情况下获得优异的阻燃性。 构成：用于封装半导体的环氧树脂组合物包括环氧树脂，硬化剂，硬化促进剂和无机填料。 环氧树脂是包含化学式1所示的联苯衍生物的多官能酚醛清漆结构的环氧树脂。在化学式1中，n的平均值为1-10。 环氧树脂的含量相对于环氧树脂组合物为1-16重量％。 该组合物另外包含0.5-10重量％的阻燃剂。
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公开(公告)号：KR101309822B1
公开(公告)日：2013-09-23
申请号：KR1020110048752
申请日：2011-05-23
Applicant: 제일모직주식회사
Abstract: 본 발명은 반도체 소자 밀봉용 에폭시 수지 조성물 및 상기 수지 조성물을 사용하여 밀봉된 반도체 소자에 관한 것이다. 보다 구체적으로, 본 발명은 특정 구조의 에폭시 수지를 포함시켜, 휨 특성, 유동성, 부착성 및 신뢰성이 좋으며, 할로겐계 난연제를 사용하지 않고도 우수한 난연성을 확보할 수 있어 환경 친화적인 반도체 소자 밀봉용 에폭시 수지 조성물 및 상기 수지 조성물을 사용하여 밀봉된 반도체 소자에 관한 것이다.
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公开(公告)号：KR101266542B1
公开(公告)日：2013-05-23
申请号：KR1020090076151
申请日：2009-08-18
Applicant: 제일모직주식회사
Abstract: 본 발명은 반도체 소자를 밀봉하는데 사용하는 에폭시 수지 조성물에 관한 것으로, 본 발명에 따른 반도체 소자 밀봉용 에폭시 수지 조성물은 하기 화학식 1로 표시되는 에폭시 수지; 하기 화학식 2로 표시되는 경화제; 및 무기 충전제를 포함한다. 이와 같은 반도체 소자 밀봉용 에폭시 수지 조성물은 반도체 소자 패키지의 휨특성 및 무연 땜납 공정에서 요구되는 내땜납성을 향상시킬 수 있다.
[화학식 1]
[화학식 2]
반도체, 소자, 에폭시 수지, 휨, 땜납(Solder)-
公开(公告)号：KR1020110078819A
公开(公告)日：2011-07-07
申请号：KR1020090135722
申请日：2009-12-31
Applicant: 제일모직주식회사
CPC classification number: C08K3/10 , C08G8/00 , C08K3/36 , C08K5/17 , C08K5/3445 , C08K5/50 , C08K9/04 , C08K2201/011 , C08L63/00 , C08L2312/04
Abstract: PURPOSE: An epoxy resin composition for encapsulating a semiconductor element is provided to prevent electric short and/or short circuit by comprising a coloring agent with an excellent insulating property and fluidity, and to improve the moldability in the sealing of the semiconductor device. CONSTITUTION: An epoxy resin composition for encapsulating a semiconductor element comprises: titanium nitride black represented by chemical formula 1: TiN_xO_y; epoxy resins; hardeners; curing accelerators; and inorganic fillers. The titanium nitride black is coated with a phenol resin. In chemical formula 1, x is 0.01~3 and y is 1.5~10. The titanium nitride black coated with the phenol resin includes the titanium nitride black and the phenol resin in a weight ratio of 1~30 : 99~70.
Abstract translation: 目的：提供用于封装半导体元件的环氧树脂组合物，以通过包含具有优异的绝缘性和流动性的着色剂来防止电短路和/或短路，并且提高半导体器件的密封中的成型性。 构成：用于封装半导体元件的环氧树脂组合物包括：由化学式1表示的氮化钛黑：TiN_xO_y; 环氧树脂; 硬化剂; 固化促进剂; 和无机填料。 氮化钛黑被酚醛树脂涂覆。 在化学式1中，x为0.01〜3，y为1.5〜10。 用酚醛树脂涂覆的氮化钛黑以重量比1〜30：99〜70的方式包括氮化钛黑和酚醛树脂。
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