Abstract:
A thermoplastic resin composition is provided to ensure excellent ANTISTATIC performance, and to be suitable for a carrying tray used in a housing of electric and electronic appliances or a manufacturing process of electric and electronic appliances. An antistatic thermoplastic resin composition comprises a thermoplastic resin 100.0 parts by weight, an anionic antistatic agent 0.1-20 parts by weight and conductive metal oxide 0.1-20 parts by weight. The thermoplastic resin includes a polycarbonate resin 45-95 parts by weight and a rubber-modified vinyl-based graft copolymer 1-50 parts by weight based on the thermoplastic resin 100.0 parts by weight. The anionic antistatic agent is included in the amount of 0.1-10 parts by weight based on the thermoplastic resin 100.0 parts by weight.
Abstract:
PURPOSE: A positive and photosensitive and heat-resistant low dielectric composition is disclosed to solve known troubles such as an increase of dielectric constant caused from -OH, a reduction of heat-resistance, etc. and to enhance the photosensitivity. CONSTITUTION: A photosensitive and heat-resistant low dielectric composition contains a polyamide polymer including a specific carbonate branch chain represented by formula 1. The polyamide polymer is characterized in that it comprises a particular polyamide structure synthesized from quaternary aromatic diamine compounds including -OH or alkyloxy carbonyloxy group (-OCOOR) as an acid sensitive radical and dicarboxyl acid and its derivatives. The particular molecular structure leads the polyamide polymer to form a positive and photosensitive heat-resistant low dielectric composition when it is combined with light acid generating agent.
Abstract:
본 발명의 폴리카보네이트 수지 조성물은 (A) (A1) 선형 폴리카보네이트 수지 50∼90 중량%와 (A2) 분지형 폴리카보네이트 수지 10∼50 중량%로 이루어진 기초수지 100 중량부에 대하여, (B) 인산 에스테르 화합물 또는 이들의 혼합물 5∼20 중량부; (C) 환형 포스파젠 화합물 또는 이들의 혼합물 0.1 내지 10 중량부; 및 (D) 페닐기 치환 실록산 공중합체 0.1 내지 10 중량부를 포함한다. 상기 폴리카보네이트 수지 조성물은 유동성 및 내충격성이 우수하면서도, 높은 난연성 및 투명성을 갖는다. 폴리카보네이트, 인산 에스테르 화합물, 환형 포스파젠 화합물, 페닐치환 실록산 공중합체, 투명성, 난연성
Abstract:
본 발명은 열가소성 수지, 음이온계 대전 방지제, 및 전도성 금속 산화물을 포함하는 대전 방지성 열가소성 수지 조성물에 관한 것이다. 상기 열가소성 수지 조성물은 대전 방지 성능이 우수하여 여러 가지 제품의 성형에 사용될 수 있으며, 특히 전기전자 제품의 하우징, 또는 전기전자 제품의 제조공정에 사용되는 운반용 트레이에 적합하게 사용될 수 있다. 대전방지, 열가소성 수지, 폴리카보네이트 수지, 고무변성 비닐계 그라프트 공중합체, 스티렌계 수지, 나일론계 수지, 폴리페닐렌에테르 수지, 폴리페닐렌 설파이드계 수지, 비닐계 공중합체, 대전 방지제, 전도성 금속 산화물
Abstract:
A thermoplastic resin composition is provided to ensure mechanical strength, impact resistance and thermal stability and to prepare molded products of various electronics and automobiles. A thermoplastic resin composition comprises base resin 100.0 parts by weight, acid anhydride-modified polypropylene resin 1-5 parts by weight, rubber-modified vinyl-based graft 5-15 parts by weight, polyolefin-based thermoplastic rubber 1-20 parts by weight, epoxy-modified polystyrene resin 1-15 parts by weight and glass fiber 1-45 parts by weight. The base resin comprises polypropylene resin and polyphenylene ether resin.
Abstract:
PURPOSE: A novel polyamide polymer capable of preventing an increase of a dielectric constant by the remaining hydroxyl group and having high heat resistance by transforming a hydroxyl group produced by pyrolysis of acetal or a side chain of its cyclic derivatives by heating a patterned exposed section to a thermally stable benzoxazole group and photosensitive heat resistant insulator composition are provided, which are useful as a layer insulation film of a passivation layer of semiconductors, a buffer coat or composite multilayer PCP. CONSTITUTION: A polyamide polymer having an intrinsic viscosity of 0.1 to 2.5 dL/g contains the formula 1 as a repeating unit and a photosensitive heat resistant insulator composition contains 0.3 to 20% by weight of a photoacid generator based on the polyamide. A concentration of an acid sensitive group (-OR1 or -OR2) is 3 to 70%. The photoacid generator is a material for generating an acid by absorbing light in an area of long wavelength (more than 300nm) as compared to an absorbing area of polyamide
Abstract:
본 발명에 따른 폴리카보네이트 수지 조성물은 (A) 폴리카보네이트 수지 65~99 중량% 및 (B) 중량 평균 분자량이 5,000~30,000 g/mol인 (메타)아크릴산 에스테르계 중합체 1~35 중량%로 이루어지는 기초수지 100 중량부 및 (C) 난연제 1~50 중량부를 포함한다. 상기 폴리카보네이트 수지 조성물은 투명성 및 난연성이 뛰어날 뿐만 아니라, 내스크래치성 및 유동성이 우수하다.
Abstract:
본 발명에 따른 폴리카보네이트 수지 조성물은 (A) 폴리카보네이트 수지 100 중량부, (B) 방향족 비닐계 중합체 1∼15 중량부, (C) 인산 에스테르 화합물 또는 그 혼합물 5∼20 중량부 및 (D) 트리스(할로겐치환 페녹시)-s-트리아진 1∼12 중량부를 포함한다. 상기 폴리카보네이트 수지 조성물은 유동성 및 내충격성이 우수하면서도, 높은 난연성 및 투명성을 갖는다.
Abstract:
PURPOSE: A polycarbonate resin composition is provided to ensure excellent transparency, mechanical strength, heat resistance, and fluidity and to prevent the dropping in combustion. CONSTITUTION: A polycarbonate resin composition with excellent transparency and fire retardant characteristic includes (A) 100 parts by weight of a base resin including (A1) 50~90 weight% of a linear polycarbonate resin and (A2) 10~50 weight% of a branched polycarbonate resin, (B) 5~20 parts by weight of oligomeric phosphoric acid ester compounds or mixture thereof induced from bisphenol-A represented by chemical formula 1, (C) 0.1-10 parts by weight of cyclic phosphagen compounds represented by chemical formula 2, and (D) phenyl group-substituted siloxane copolymers represented by chemical formula 5.