Abstract:
Disclosed is an adhesive composition (I) characterized by containing a polyurethane polyurea resin (A) having a weight average molecular weight of 80,000-250,000 and an acid number of 3-25 mgKOH/g and an epoxy resin (B). The polyurethane polyurea resin (A) is obtained by reacting a urethane prepolymer (d) having an isocyanate group, a polyamino compound (e) and a monoamino compound (f) under the conditions stated below. The urethane prepolymer (d) having an isocyanate group is obtained by reacting a polyol compound (a), an organic diisocyanate (b) and a diol compound (c) having a carboxyl group. (i) The ratio between isocyanate groups of the urethane prepolymer (d) having an isocyanate group and amino groups of the polyamino compound (e) and the monoamino compound (f), namely amino groups/isocyanate groups is from 0.8/1 to 0.999/1 (molar ratio). (ii) The ratio of amino groups of the polyamino compound (e) in the 100 mol% of the total of the amino groups of the polyamide compound (e) and the amino groups of the monoamino compound (f) is 90.0-97.0 mol%.
Abstract:
폴리올 화합물(a), 유기 디이소시아네이트(b) 및 카르복실기를 갖는 디올 화합물(c)을 반응시켜 얻어지는 이소시아네이트기를 갖는 우레탄 프리폴리머(d)와, 폴리아미노 화합물(e) 및 모노아미노 화합물(f)을 하기의 조건으로 반응시켜 얻어지는, 중량 평균분자량이 80,000~250,000이고, 산가가 3~25 ㎎KOH/g인 폴리우레탄 폴리우레아 수지(A)와 에폭시 수지(B)를 함유하는 것을 특징으로 하는 접착제 조성물(I)을 개시한다. 여기에, (i) 이소시아네이트기를 갖는 우레탄 프리폴리머(d)의 이소시아네이트기와, 폴리아미노 화합물(e) 및 모노아미노 화합물(f)의 아미노기와의 비율이, 아미노기/이소시아네이트기=0.8/1~0.999/1(몰비)이고, 또한 (ii) 폴리아미노 화합물(e)의 아미노기와 모노아미노 화합물(f)의 아미노기와의 합계 100 몰% 중, 폴리아미노 화합물(e)의 아미노기의 비율이 90.0~97.0 몰%이다.
Abstract:
An electromagnetic-wave-shielding adhesive film which comprises a base film and a curable conductive adhesive layer (I), wherein the curable conductive adhesive layer (I) comprises: a polyurethane-polyurea resin (A) prepared by reacting a polyamino compound (e) with a urethane prepolymer (d) having an isocyanate group at an end and obtained by reacting a carboxylated diol compound (a), a polyol (b) which has a number-average molecular weight of 500-8,000 and is not a carboxylated diol compound, and an organic diisocyanate (c); an epoxy resin (B) having two or more epoxy groups; and a conductive filler.
Abstract:
PURPOSE: A photosensitive resin composition, a manufacturing method of cured products, photo solder resist ink, a dry film style photo solder resist, and a photosensitive resin are provided to enhance photosensitivity for an active energy ray. CONSTITUTION: A photosensitive resin composition comprises a photosensitive resin, an epoxy group-containing compound, a deblocking isocyanate group-containing compound, one or more a compound selected from a group consisting of beta-hydroxyalkyl amide group-containing compound and a blocking isocyanate group-containing compound, and a photopolymerization initiator. The photosensitive resin is a hydroxyl group containing photosensitive resin.
Abstract:
An electromagnetic-wave-shielding adhesive film which comprises a base film and a curable conductive adhesive layer (I), wherein the curable conductive adhesive layer (I) comprises: a polyurethane-polyurea resin (A) prepared by reacting a polyamino compound (e) with a urethane prepolymer (d) having an isocyanate group at an end and obtained by reacting a carboxylated diol compound (a), a polyol (b) which has a number-average molecular weight of 500-8,000 and is not a carboxylated diol compound, and an organic diisocyanate (c); an epoxy resin (B) having two or more epoxy groups; and a conductive filler.