Abstract:
Disclosed is a photocurable composition containing a photocurable material including at least one compound (A) represented by the general formula (1) below and a filler (B) having a refractive index of not less than 1.60. (1) (In the formula, R1- R3 independently represent a hydrogen atom or a methyl group; R4- R6 independently represent an unsubstituted or substituted, straight or branched chain alkylene group; R7 represents hydrogen or a monovalent organic group; and R8 represents a tetravalent aromatic group. In this connection, at least one of R7 and R8 contains a biphenyl skeleton.) Also disclosed is an antireflective film wherein a high-refractive-index hard coat layer composed of such a photocurable composition and a low-refractive-index layer having a refractive index of 1.20-1.50 are sequentially arranged on one side of a plastic base. ® KIPO & WIPO 2007
Abstract:
PURPOSE: A photosensitive resin composition, a manufacturing method of cured products, photo solder resist ink, a dry film style photo solder resist, and a photosensitive resin are provided to enhance photosensitivity for an active energy ray. CONSTITUTION: A photosensitive resin composition comprises a photosensitive resin, an epoxy group-containing compound, a deblocking isocyanate group-containing compound, one or more a compound selected from a group consisting of beta-hydroxyalkyl amide group-containing compound and a blocking isocyanate group-containing compound, and a photopolymerization initiator. The photosensitive resin is a hydroxyl group containing photosensitive resin.
Abstract:
Disclosed is a photosensitive resin composition containing a carboxyl group-containing photosensitive urethane resin (A), a photopolymerization initiator (B) and a photosensitive ethylenically unsaturated group-containing compound (C). This photosensitive resin composition is characterized in that the carboxyl group-containing photosensitive urethane resin (A) is a resin obtained by reacting a hydroxy group in a hydroxy group-containing urethane prepolymer (c) with an acid anhydride group in an acid anhydride group-containing compound (d). The hydroxy group-containing urethane prepolymer (c) is obtained by reacting a carboxyl group in a carboxyl group-containing urethane prepolymer (a), which is obtained by reacting a polymer polyol (e), a carboxylic acid compound (f) having two hydroxy groups in a molecule and a diisocyanate compound (g) as essential ingredients, with an epoxy group or an oxethane group in a compound (b) having an epoxy group or an oxethane group and an ethylenically unsaturated group. This photosensitive resin composition is excellent in sensitivity to an active energy ray and enables to form a fine pattern. A cured coating film of the photosensitive resin composition is excellent in flexibility, insulating property, adhesion, solder heat resistance, coating film resistance and flame retardance, and is thus suitably used for a photosolder resist.