公开(公告)号：KR1020010073065A

公开(公告)日：2001-07-31

申请号：KR1020010010501

申请日：2001-02-28

Applicant: 한국과학기술연구원

Inventor： 유명기 ,  홍경태 ,  정낙진 ,  이승우

IPC: H01L23/06

Abstract: PURPOSE: A method of manufacturing a metal case for optical transmission and reception module packaging is provided to form an airtight case by using a powder injection method and a sintering method without an additional mechanical process. CONSTITUTION: Iron, nickel, and cobalt powders for composing an ASTM F-15 alloy are mixed uniformly. A feedstock for injection is manufactured by mixing a high molecule binder such as a paraffin wax, polyethylene, and a stearic acid into the mixed powders. An injection mold is manufactured by using the feedstock. The injected molding body is removed by an n-hepthan solution. The remaining binders are removed by a thermal decompression process. A sintering process for the molding body is performed. A nickel plating process and a gold plating process are performed on the sintered body. A glass sealing(2) process is performed. A lid is combined with an upper portion(3) of the metal case.

Abstract translation: 目的：提供一种制造用于光学传输和接收模块包装的金属外壳的方法，通过使用粉末喷射法和烧结方法形成气密的外壳，而不需要额外的机械加工。 构成：用于组成ASTM F-15合金的铁，镍和钴粉末均匀混合。 通过将高分子粘合剂如石蜡，聚乙烯和硬脂酸混合到混合粉末中来制造注射用原料。 通过使用原料制造注射模具。 注射成型体通过正庚醇溶液除去。 剩余的粘合剂通过热减压方法除去。 进行成型体的烧结工序。 对烧结体进行镀镍处理和镀金工序。 进行玻璃密封（2）处理。 盖子与金属外壳的上部（3）组合。

公开(公告)号：KR100349036B1

公开(公告)日：2002-08-17

申请号：KR1019990002221

申请日：1999-01-25

Applicant: 한국과학기술연구원

Inventor： 유명기 ,  홍경태 ,  정낙진 ,  이승우

IPC: H05K1/00

Abstract: PURPOSE: An improved structure of an optical transmitting/receiving module packaging metal receptacle is provided to manufacture a metal receptacle of an optical transmitting/receiving module at the lower expense using a powder injection molding and a sintering. CONSTITUTION: A plurality of holes are formed at an inner bottom surface of a metal receptacle. A plurality of lead pins(1) are inserted and fixed into the holes of the metal receptacle. A printed circuit board support member(5) supports a printed circuit board to be located from a bottom surface of the metal receptacle by a predetermined height. The printed circuit board support member(5) has a circle. The printed circuit board is inserted into an upper side of each of the lead pins(1). An insulation tape is adhered to an outer bottom surface of the metal receptacle. The insulation tape is united with an external socket to improve insulation of the lead pins(1).

公开(公告)号：KR1019990068106A

公开(公告)日：1999-08-25

申请号：KR1019990002221

申请日：1999-01-25

Applicant: 한국과학기술연구원

Inventor： 유명기 ,  홍경태 ,  정낙진 ,  이승우

IPC: H05K1/00

CPC classification number: H05K1/0274 ,  H05K2201/10325 ,  H05K2203/0191

Abstract: 본발명은일반적인기계가공방법으로제조가어려운패키징구조를정밀성형이가능하면서실형상화를달성할수 있는분말사출성형과소결기술을적용하여달성하기위한것으로, 광송수신모듈패키징용금속용기에있어서, 상기금속용기내부밑면에개별소자들이올려져회로를구성하는인쇄회로기판을안정적으로지지할수 있도록, 별도의걸림턱을갖는네일(†) 모양의핀을금속용기밑에정렬된통공에삽입하거나, 상기금속용기내에별도의지지대를포함하고, 핀이일렬로위치하는상기금속용기의내부밑면의영역및 상기핀 열사이의중심부영역사이에높이차를제공함으로써, 상기밑면의통공을통하여제공되는핀과소켓사이의절연성이향상되는광송수신모듈패키징용금속용기및 외부소켓과핀의결합시패키징용기의밑면과소켓사이의절연성을향상시키기위해상기금속용기밑면에절연테이프를접착시키는구조를갖는광송수신용모듈패키징용금속용기와, ASTM F-15 합금조성의철, 니켈및 코발트분말을균일하게혼합한후, 이를고분자결합제와다시혼합하여사출용피드스톡을제조하고, 상기피드스톡을금형내로고압사출성형하고, 얻어진성형체로부터용매추출및 열분해법을사용하여상기고분자결합제를제거하고, 얻어진성형체를소결하는것으로이루어지는광송수신모듈패키징용금속용기의제조방법을제공한다.

公开(公告)号：KR100345877B1

公开(公告)日：2002-07-27

申请号：KR1020010010501

申请日：2001-02-28

Applicant: 한국과학기술연구원

Inventor： 유명기 ,  홍경태 ,  정낙진 ,  이승우

IPC: H01L23/06

Abstract: 본발명은일반적인기계가공방법으로제조가어려운패키징구조를정밀성형이가능하면서실형상화를달성할수 있는분말사출성형과소결기술을적용하여달성하기위한것으로, ASTM F-15 합금(Kovar) 조성의철, 니켈및 코발트분말로이루어지는원료분말을고분자결합제와혼합하여사출용피드스톡을제조하고, 상기피드스톡을금형내로고압사출성형하고, 얻어진성형체로부터용매추출및 열분해법을이용하여상기고분자결합제를제거하고, 얻어진성형체를소결하는것으로이루어지는광송수신모듈패키징용금속용기의제조방법을제공한다. 여기서, 상기원료분말은수 내지수십미크론의평균크기를갖으면서 99.9% 이상의순도를갖는철, 니켈및 코발트금속분말을균일혼합하여얻어지는것이바람직하고, 또한상기소결은수소분위기또는수소+아르곤분위기에서수행되는것이더욱바람직하다.