公开(公告)号：EP2734020A1

公开(公告)日：2014-05-21

申请号：EP12193249.5

申请日：2012-11-19

Applicant: ABB Technology AG

Inventor： Agostini, Bruno ,  Agostini, Francesco ,  Habert, Mathieu

IPC: H05K7/20 ,  H01L23/427 ,  F28D15/06 ,  F28D15/02

CPC classification number: H01L23/427 ,  F28D15/0266 ,  F28D15/06 ,  H01L2924/0002 ,  H05K7/20936 ,  H01L2924/00

Abstract: A cooling arrangement (1) for a multiplicity of electric devices (3) such as power semiconductor devices is proposed. The cooling arrangement (1) comprises a loop-type two-phase thermosyphon (5) comprising a multiplicity of evaporators (7), each evaporator (7) being in thermal contact with at least one of the electric devices (3), at least one condenser (9) and a plurality of inlet channels (11) and outlet channels (13). At least one controllable valve (23, 25) is arranged in at least one of the inlet channels (11) and outlet channels (13). The controllable valve is adapted for adjusting a local fluid pressure loss in the respective channel (11, 13). Due to the provision of such controllable valves, fluid flow of a coolant medium through each of the evaporators (7) may be controlled e.g. in dependence of actual heat loads occurring at the electric devices (3). Furthermore, while in conventional cooling arrangements lacking any controllable valves supply of coolant medium may be significantly influenced for example by stratification of liquid and vapor comprised in the two-phase coolant medium thereby resulting in instabilities of the cooling arrangement operation, the controllable valves (23, 25) provided in the proposed cooling arrangement may effectively suppress such negative influence of any density differences and stratifications, thereby enabling compensating any maldistributions of coolant medium throughout the stack (2) of evaporators (7) and electric devices (3) arranged in parallel to each other.

Abstract translation: 用于电气装置（3）的多个所述的冷却装置（1）：如功率半导体器件被提议。 所述冷却装置（1）包括一个环型两相热虹吸（5）包括蒸发器（7），每个蒸发器的多个（7）与所述电气设备的至少一个热接触（3），至少 一个冷凝器（9）和入口通道（11）和出口通道的多个（13）。 至少一个可控阀（23，25）在所述入口通道（11）和出口通道中的至少一个（13）被布置。 所述可控阀angepasst在respectivement通道（11，13）调节的局部流体压力损失。 由于调查可控阀的委托，通过每个（7）可以是例如控制蒸发器的冷却介质的流体流 在实际热负荷在电气设备（3）上发生的依赖性。 进一步，虽然在缺乏冷却剂介质的任何可控阀供给传统的冷却装置可以通过在两相冷却介质，从而在所述冷却装置的操作，所述可控阀的不稳定性所得到的包括液体和蒸气的分层的显着影响对于实施例（23 在拟议的冷却装置提供，25）可以有效地抑制测试的任何浓度差和分层的负面影响，从而使得能够补偿冷却介质的任何分布不均整个堆（2）的蒸发器（7）和电气设备（3）平行地配置 海誓山盟。

公开(公告)号：EP3115729A3

公开(公告)日：2017-03-08

申请号：EP16175015.3

申请日：2016-06-17

Applicant: ABB Technology AG

Inventor： Agostini, Bruno ,  Torresin, Daniele ,  Agostini, Francesco ,  Habert, Mathieu

IPC: F28D15/02 ,  H01L23/00 ,  H05K7/20

CPC classification number: F28D15/0266 ,  F28D7/0075 ,  F28D15/0233 ,  F28D15/04 ,  F28D2015/0216 ,  F28D2021/0028 ,  F28D2021/0029 ,  F28F3/025 ,  H01L23/3677 ,  H01L23/427 ,  H05K7/20936

Abstract: The invention relates to a heat exchanger (1) comprising a base plate (2) for receiving a heat load from one or more electric components (3), an evaporator (5) being in thermal contact with a surface of the base plate (2) for transferring said heat load into a first fluid in the evaporator channels (7), and a condenser (8) dissipating heat from the first fluid. In order to provide an efficient heat exchanger the heat exchanger comprises a collector space (16) receiving first fluid from the condenser (8'), and the collector space (16) which is located higher than the lower ends of the evaporator channels (7) is in fluid communication with lower ends of the evaporator channels (7) for passing first fluid received from the condenser (8) to the lower ends of the evaporator channels (7).

Abstract translation: 本发明涉及一种热交换器（1），其包括用于接收来自一个或多个电部件（3）的热负载的基板（2），与基板（2）的表面热接触的蒸发器（5） ），用于将所述热负载转移到蒸发器通道（7）中的第一流体中，以及冷凝器（8），其从第一流体中散热。 为了提供有效的热交换器，热交换器包括接收来自冷凝器（8'）的第一流体的收集器空间（16）和位于比蒸发器通道（7'）的下端更高的收集器空间（16） ）与蒸发器通道（7）的下端流体连通，用于将从冷凝器（8）接收的第一流体传送到蒸发器通道（7）的下端。

公开(公告)号：EP2587907A1

公开(公告)日：2013-05-01

申请号：EP12188563.6

申请日：2012-10-15

Applicant: ABB Technology AG

Inventor： Cottet, Didier ,  Agostini, Francesco ,  Gradinger, Thomas ,  Vögeli, Andreas

IPC: H05K7/20

CPC classification number: H05K7/20672 ,  F28D15/0266 ,  H02M7/003 ,  H02M2007/4835 ,  H05K7/20936

Abstract: The present invention relates to the cooling of electric and/or electronic components, in particular to a module (102) of an electric and/or electronic system. The module (102) comprising a guiding structure (615) and an inlet (614) for receiving a stream of cooling air and with an outlet (616) for releasing cooling air thereafter in an operating state of the module (102). The guiding structure (615) being provided for guiding the cooling air entering through the inlet (614) and leaving the module through the outlet (616) in an operating state of the module (102). The module (102) comprises a thermosiphon cooler (600) with an evaporator (604) and a condenser (602) for transferring a majority of a heat load to said cooling air in an operating state of the module (102). The evaporator (604) is tilted with respect to the condenser (602) wherein the condenser (602) is arranged such that a major portion of said cooling air flows through the condenser (602).

Abstract translation: 本发明涉及电气和/或电子部件的冷却，特别涉及电气和/或电子系统的模块（102）。 模块（102）包括用于接收冷却空气流的引导结构（615）和入口（614），并且具有用于在模块（102）的操作状态下释放冷却空气的出口（616）。 引导结构（615）被设置用于引导通过入口（614）进入的冷却空气并且在模块（102）的操作状态下使模块通过出口（616）。 模块（102）包括具有蒸发器（604）的热虹吸管冷却器（600）和用于在模块（102）的操作状态下将大部分热负荷转移到所述冷却空气的冷凝器（602）。 蒸发器（604）相对于冷凝器（602）倾斜，其中冷凝器（602）被布置成使得大部分的冷却空气流过冷凝器（602）。

公开(公告)号：EP3115728A3

公开(公告)日：2017-03-29

申请号：EP16175004.7

申请日：2016-06-17

Applicant: ABB Technology AG

Inventor： Agostini, Bruno ,  Torresin, Daniele ,  Agostini, Francesco ,  Riedel, Gernot ,  Habert, Mathieu

IPC: F28D15/02 ,  F28D15/04 ,  H01L23/427 ,  H05K7/20

CPC classification number: H05K7/20936 ,  B23P15/26 ,  F28D15/0266 ,  F28D15/043 ,  F28D15/046 ,  F28D2021/0029 ,  F28F21/084 ,  H01L23/3733 ,  H01L23/427 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20336

Abstract: This invention relates to a cooling apparatus comprising a base plate (10), an evaporator (1) and a condenser (14). In order to obtain a simple and efficient cooling apparatus the evaporator (1) is a porous aluminum evaporator having a capillary structure with pores and a plurality of larger sized evaporator channels extending through the evaporator (1) between a second end (8) and the first end (7) of the evaporator. A compensation chamber (2) extending along a second surface (16) of the evaporator (1) receives first fluid from the condenser (14) such that pores opening up into the second surface (16) of the evaporator (1) are provided with first fluid.

Abstract translation: 本发明涉及一种包括基板（10），蒸发器（1）和冷凝器（14）的冷却装置。 为了获得简单且高效的冷却装置，蒸发器（1）是具有毛细结构的多孔铝蒸发器，其具有毛细孔和多个较大尺寸的蒸发器通道，所述蒸发器通道在第二端（8）和第二端 蒸发器的第一端（7）。 沿着蒸发器（1）的第二表面（16）延伸的补偿室（2）接收来自冷凝器（14）的第一流体，使得通向蒸发器（1）的第二表面（16）的孔隙设置有 第一流体。

公开(公告)号：EP3115729A2

公开(公告)日：2017-01-11

申请号：EP16175015.3

申请日：2016-06-17

Applicant: ABB Technology AG

Inventor： Agostini, Bruno ,  Torresin, Daniele ,  Agostini, Francesco ,  Habert, Mathieu

IPC: F28D15/02 ,  H01L23/00 ,  H05K7/20

CPC classification number: F28D15/0266 ,  F28D7/0075 ,  F28D15/0233 ,  F28D15/04 ,  F28D2015/0216 ,  F28D2021/0028 ,  F28D2021/0029 ,  F28F3/025 ,  H01L23/3677 ,  H01L23/427 ,  H05K7/20936

Abstract: The invention relates to a heat exchanger (1) comprising a base plate (2) for receiving a heat load from one or more electric components (3), an evaporator (5) being in thermal contact with a surface of the base plate (2) for transferring said heat load into a first fluid in the evaporator channels (7), and a condenser (8) dissipating heat from the first fluid. In order to provide an efficient heat exchanger the heat exchanger comprises a collector space (16) receiving first fluid from the condenser (8'), and the collector space (16) which is located higher than the lower ends of the evaporator channels (7) is in fluid communication with lower ends of the evaporator channels (7) for passing first fluid received from the condenser (8) to the lower ends of the evaporator channels (7).

公开(公告)号：EP2677261A1

公开(公告)日：2013-12-25

申请号：EP12172752.3

申请日：2012-06-20

Applicant: ABB Technology AG

Inventor： Agostini, Francesco ,  Fabbri, Matteo ,  Gradinger, Thomas

IPC: F28D15/02 ,  F28F3/14 ,  H01L23/427 ,  H05K7/20

CPC classification number: H05K7/20309 ,  F28D15/0266 ,  F28D15/0275 ,  F28F3/14 ,  H01L23/3672 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/20318 ,  H05K7/20936 ,  H01L2924/00

Abstract: A two-phase heat exchanger for cooling at least one electronic and/or electric component with an evaporator and a condenser is provided. The evaporator is adapted to transfer heat from the electronic and/or electric component to a working fluid. The condenser comprises a roll-bonded panel, which has a first channel which has a first connection port and a second connection port. The evaporator has a second channel and first connection openings and second connection openings. The first connection port of the first channel is connected to one first connection opening of the evaporator and the second connection port of the first channel is connected to one second connection opening of the evaporator and the working fluid is provided in order to convey heat by means of convection from the evaporator to the condenser by flowing from the second channel through the first connection opening or the second connection opening of the evaporator towards the first channel.

Abstract translation: 提供了一种用于用蒸发器和冷凝器冷却至少一个电子和/或电气部件的两相热交换器。 蒸发器适于将热量从电子和/或电气部件传递到工作流体。 冷凝器包括具有第一通道的辊式接合面板，该第一通道具有第一连接端口和第二连接端口。 蒸发器具有第二通道和第一连接开口和第二连接开口。 第一通道的第一连接端口连接到蒸发器的一个第一连接开口，并且第一通道的第二连接端口连接到蒸发器的一个第二连接开口，并且提供工作流体以便通过装置传送热量 通过从第二通道流过蒸发器的第一连接开口或第二连接开口朝着第一通道流动从蒸发器到冷凝器的对流。

公开(公告)号：EP2587906A1

公开(公告)日：2013-05-01

申请号：EP12188559.4

申请日：2012-10-15

Applicant: ABB Technology AG

Inventor： Cottet, Didier ,  Agostini, Francesco ,  Gradinger, Thomas ,  Vögeli, Andreas

IPC: H05K7/20

Abstract: The present invention relates to the cooling of electric and/or electronic components, in particular to an electric and/or electronic system (200) with a cabinet (400), which comprises a cabinet housing (406) comprising a first aperture for receiving a stream of cooling air. The cabinet housing (406) comprises a second aperture for releasing the cooling air thereafter in an operating state of the cabinet. At least two modules (102), each comprising a guiding structure with an inlet and an outlet are provided in the cabinet. The at least two modules (102) are arranged in the cabinet housing (406) such that a branch of the major portion of cooling air flowing through the first aperture of said cabinet housing (406) is enabled to flow into each module (102) via the inlet guided by the guiding structure through the dedicated module (102) to the outlet and thereafter through the second aperture out of the cabinet housing (406).

Abstract translation: 本发明涉及电气和/或电子部件的冷却，特别是涉及具有机柜（400）的电气和/或电子系统（200）的冷却，所述电气和/或电子系统（200）包括机壳外壳（406），所述机壳外壳包括用于接收 冷却空气流。 橱柜壳体（406）包括用于在机柜的操作状态之后释放冷却空气的第二孔。 在机柜中设置至少两个模块（102），每个模块（102）包括具有入口和出口的引导结构。 所述至少两个模块（102）布置在所述机壳壳体（406）中，使得流过所述机壳壳体（406）的所述第一孔的主要部分冷却空气的分支能够流入每个模块（102） 通过引导结构引导的入口通过专用模块（102）到出口，然后通过第二孔从机壳外壳（406）中取出。

公开(公告)号：EP3115728A2

公开(公告)日：2017-01-11

申请号：EP16175004.7

申请日：2016-06-17

Applicant: ABB Technology AG

Inventor： Agostini, Bruno ,  Torresin, Daniele ,  Agostini, Francesco ,  Riedel, Gernot ,  Habert, Mathieu

IPC: F28D15/02 ,  F28D15/04 ,  H01L23/427 ,  H05K7/20

CPC classification number: H05K7/20936 ,  B23P15/26 ,  F28D15/0266 ,  F28D15/043 ,  F28D15/046 ,  F28D2021/0029 ,  F28F21/084 ,  H01L23/3733 ,  H01L23/427 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20336

Abstract: This invention relates to a cooling apparatus comprising a base plate (10), an evaporator (1) and a condenser (14). In order to obtain a simple and efficient cooling apparatus the evaporator (1) is a porous aluminum evaporator having a capillary structure with pores and a plurality of larger sized evaporator channels extending through the evaporator (1) between a second end (8) and the first end (7) of the evaporator. A compensation chamber (2) extending along a second surface (16) of the evaporator (1) receives first fluid from the condenser (14) such that pores opening up into the second surface (16) of the evaporator (1) are provided with first fluid.

Abstract translation: 本发明涉及一种包括基板（10），蒸发器（1）和冷凝器（14）的冷却装置。 为了获得简单有效的冷却装置，蒸发器（1）是具有毛细结构的多孔铝蒸发器，其具有孔和多个较大尺寸的蒸发器通道，该蒸发器通道在第二端（8）和第二端 蒸发器的第一端（7）。 沿着蒸发器（1）的第二表面（16）延伸的补偿室（2）从冷凝器（14）接收第一流体，使得开口进入蒸发器（1）的第二表面（16）的孔设置有 第一流体。

公开(公告)号：EP2857783A1

公开(公告)日：2015-04-08

申请号：EP13187362.2

申请日：2013-10-04

Applicant: ABB Technology AG

Inventor： Agostini, Francesco ,  Torresin, Daniele ,  Agostini, Bruno ,  Habert, Mathieu ,  Moraschinelli, Francesco ,  Antoniazzi, Antonello

IPC: F28D15/02

CPC classification number: H05K7/20336 ,  F28D1/05391 ,  F28D15/0266 ,  F28D15/0275 ,  F28D2015/0216 ,  F28D2021/0029 ,  F28F1/022 ,  F28F1/325 ,  F28F3/12 ,  F28F9/0278 ,  H01L23/4012 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20927 ,  H01L2924/00

Abstract: The invention relates to a heat exchange device based on a pulsating heat pipe and a cooling arrangement with at least one heat exchange device. A technical objective of the invention is to improve the heat performance of a heat exchange device. The objective is achieved by a heat exchange device based on a pulsating heat pipe (1) comprising a plurality of pipes (9) to provide fluid paths between a first fluid distribution element (10) and a second fluid distribution element (11) of the heat exchange device (1), wherein each pipe (9) of the plurality of pipes (9) comprises a group of channels (12), wherein each of the first fluid distribution element (10) and the second fluid distribution element (11) comprises at least a plate (13) of a first type, wherein each plate (13) of the first type comprises openings (14) for providing an alignment functionality for the plurality of pipes (9); and wherein the first fluid distribution element (10) comprises a plate (15) of a second type, and wherein the plate (15) of the second type comprises openings (17) for providing fluid paths between the plurality of pipes (9), and wherein the plate (15) of the second type is positioned on a side of the plate (13) of the first type of plates of the first fluid distribution element (10) that is opposite to the second fluid distribution element (11).

Abstract translation: 本发明涉及一种基于脉动热管和具有至少一个热交换装置的冷却装置的热交换装置。 本发明的技术目的是提高热交换装置的热性能。 目的是通过一种基于包括多个管道（9）的脉动热管（1）的热交换装置实现，以在第一流体分配元件（10）和第二流体分配元件（11）之间提供流体路径 热交换装置（1），其中所述多个管道（9）中的每个管道（9）包括一组通道（12），其中所述第一流体分配元件（10）和所述第二流体分配元件（11） 至少包括第一类型的板（13），其中第一类型的板（13）包括用于为多个管道（9）提供对准功能的开口（14）。 并且其中所述第一流体分配元件（10）包括第二类型的板（15），并且其中所述第二类型的板（15）包括用于在所述多个管（9）之间提供流体路径的开口（17） 并且其中所述第二类型的板（15）位于与所述第二流体分配元件（11）相对的所述第一流体分配元件（10）的所述第一类型的板（13）的侧面上。

公开(公告)号：EP2701477A1

公开(公告)日：2014-02-26

申请号：EP12181155.8

申请日：2012-08-21

Applicant: ABB Technology AG

Inventor： Cottet, Didier ,  Agostini, Francesco ,  Cimino, Mikael ,  Velthuis, Rudi ,  Gradinger, Thomas ,  Kuhn, Erich ,  Grünig, Frank

IPC: H05K7/14 ,  H05K9/00

CPC classification number: H05K7/1432 ,  H05K9/0062

Abstract: An enclosure (10) for an electronic device (20) is provided. The enclosure comprises an enclosure wall (30) comprising a dielectric material, a first conductive layer (40) abutting an inner face (50) of the enclosure wall (30), and a second conductive layer (60) abutting an outer face (70) of the enclosure wall (30), wherein the first and the second conductive layers (40, 60) are electrically insulated from each other and are electrically connectable to predefined electric potentials, so that the electric field in the enclosure wall (30) can be homogenized in an operational state of the enclosure (10). Further, an electronic device and electronic system are provided, comprising such enclosures and electronic circuits located therein.

Abstract translation: 提供了一种用于电子设备（20）的外壳（10）。 所述外壳包括包含绝缘材料的封闭壁（30），邻接所述封闭壁（30）的内​​表面（50）的第一导电层（40）和邻接外壁（70）的第二导电层（60） ），其中所述第一和第二导电层（40,60）彼此电绝缘并且可电连接到预定电位，使得所述封闭壁（30）中的电场可以 在外壳（10）的操作状态下被均化。 此外，提供了一种电子设备和电子系统，其包括位于其中的这种外壳和电子电路。