公开(公告)号：EP2701477A1

公开(公告)日：2014-02-26

申请号：EP12181155.8

申请日：2012-08-21

Applicant: ABB Technology AG

Inventor： Cottet, Didier ,  Agostini, Francesco ,  Cimino, Mikael ,  Velthuis, Rudi ,  Gradinger, Thomas ,  Kuhn, Erich ,  Grünig, Frank

IPC: H05K7/14 ,  H05K9/00

CPC classification number: H05K7/1432 ,  H05K9/0062

Abstract: An enclosure (10) for an electronic device (20) is provided. The enclosure comprises an enclosure wall (30) comprising a dielectric material, a first conductive layer (40) abutting an inner face (50) of the enclosure wall (30), and a second conductive layer (60) abutting an outer face (70) of the enclosure wall (30), wherein the first and the second conductive layers (40, 60) are electrically insulated from each other and are electrically connectable to predefined electric potentials, so that the electric field in the enclosure wall (30) can be homogenized in an operational state of the enclosure (10). Further, an electronic device and electronic system are provided, comprising such enclosures and electronic circuits located therein.

Abstract translation: 提供了一种用于电子设备（20）的外壳（10）。 所述外壳包括包含绝缘材料的封闭壁（30），邻接所述封闭壁（30）的内​​表面（50）的第一导电层（40）和邻接外壁（70）的第二导电层（60） ），其中所述第一和第二导电层（40,60）彼此电绝缘并且可电连接到预定电位，使得所述封闭壁（30）中的电场可以 在外壳（10）的操作状态下被均化。 此外，提供了一种电子设备和电子系统，其包括位于其中的这种外壳和电子电路。

公开(公告)号：EP2701476A1

公开(公告)日：2014-02-26

申请号：EP12181136.8

申请日：2012-08-21

Applicant: ABB Technology AG

Inventor： Kuhn, Erich ,  Grünig, Frank ,  Cottet, Didier ,  Agostini, Francesco ,  Cimino, Mikael ,  Velthuis, Rudi ,  Gradinger, Thomas

IPC: H05K7/14 ,  H05K9/00

CPC classification number: H05K7/1432 ,  H05K9/0045 ,  H05K9/0062

Abstract: A modular electronic system for medium and high voltages is provided. The system includes a cabinet (160) having a number of slots (120) arranged in an array, at least one electronic module (130) provided in a slot (120) of the cabinet, the module including an enclosure (10) with a three dimensional shape, having an enclosure wall (30) comprising a dielectric material, and a field shaping conductive layer (60) abutting a face (70) of the enclosure wall (30), and an electronic device (20) located in the enclosure (10), wherein the field shaping conductive layer (60) is electrically connectable to a predefined electric potential in an operating state of the modular electronic system (100).

Abstract translation: 提供了用于中高压的模块化电子系统。 该系统包括具有排列成阵列的多个狭槽（120）的柜（160），设置在机柜的狭槽（120）中的至少一个电子模块（130），该模块包括具有 具有包括电介质材料的外壳壁（30）的三维形状以及邻接所述外壳壁（30）的表面（70）的场整形导电层（60）和位于所述外壳中的电子设备（20） （10），其中所述场整形导电层（60）在所述模块化电子系统（100）的操作状态下可电连接到预定电位。