Enclosure for an electronic device
    1.
    发明公开
    Enclosure for an electronic device 审中-公开
    Gehäusefüreine elektronische Vorrichtung

    公开(公告)号:EP2701477A1

    公开(公告)日:2014-02-26

    申请号:EP12181155.8

    申请日:2012-08-21

    CPC classification number: H05K7/1432 H05K9/0062

    Abstract: An enclosure (10) for an electronic device (20) is provided. The enclosure comprises an enclosure wall (30) comprising a dielectric material, a first conductive layer (40) abutting an inner face (50) of the enclosure wall (30), and a second conductive layer (60) abutting an outer face (70) of the enclosure wall (30), wherein the first and the second conductive layers (40, 60) are electrically insulated from each other and are electrically connectable to predefined electric potentials, so that the electric field in the enclosure wall (30) can be homogenized in an operational state of the enclosure (10). Further, an electronic device and electronic system are provided, comprising such enclosures and electronic circuits located therein.

    Abstract translation: 提供了一种用于电子设备(20)的外壳(10)。 所述外壳包括包含绝缘材料的封闭壁(30),邻接所述封闭壁(30)的内​​表面(50)的第一导电层(40)和邻接外壁(70)的第二导电层(60) ),其中所述第一和第二导电层(40,60)彼此电绝缘并且可电连接到预定电位,使得所述封闭壁(30)中的电场可以 在外壳(10)的操作状态下被均化。 此外,提供了一种电子设备和电子系统,其包括位于其中的这种外壳和电子电路。

    Electronic module and modular electronic system using the same
    2.
    发明公开
    Electronic module and modular electronic system using the same 审中-公开
    Elektronisches Modul und modulares Elektroniksystem,das dieses verwendet

    公开(公告)号:EP2701476A1

    公开(公告)日:2014-02-26

    申请号:EP12181136.8

    申请日:2012-08-21

    CPC classification number: H05K7/1432 H05K9/0045 H05K9/0062

    Abstract: A modular electronic system for medium and high voltages is provided. The system includes a cabinet (160) having a number of slots (120) arranged in an array, at least one electronic module (130) provided in a slot (120) of the cabinet, the module including an enclosure (10) with a three dimensional shape, having an enclosure wall (30) comprising a dielectric material, and a field shaping conductive layer (60) abutting a face (70) of the enclosure wall (30), and an electronic device (20) located in the enclosure (10), wherein the field shaping conductive layer (60) is electrically connectable to a predefined electric potential in an operating state of the modular electronic system (100).

    Abstract translation: 提供了用于中高压的模块化电子系统。 该系统包括具有排列成阵列的多个狭槽(120)的柜(160),设置在机柜的狭槽(120)中的至少一个电子模块(130),该模块包括具有 具有包括电介质材料的外壳壁(30)的三维形状以及邻接所述外壳壁(30)的表面(70)的场整形导电层(60)和位于所述外壳中的电子设备(20) (10),其中所述场整形导电层(60)在所述模块化电子系统(100)的操作状态下可电连接到预定电位。

    INDUCTIVE POWER TRANSFER SYSTEM
    4.
    发明公开
    INDUCTIVE POWER TRANSFER SYSTEM 审中-公开
    INDUKTIVESSTROMÜBERTRAGUNGSSYSTEM

    公开(公告)号:EP3118867A1

    公开(公告)日:2017-01-18

    申请号:EP15177312.4

    申请日:2015-07-17

    CPC classification number: H02J17/00 H01F27/365 H01F38/14

    Abstract: The present invention is concerned with an inductive power transfer system for providing power to a gate drive on medium or high electrical potential. The inductive power transfer System has a first spiral coil (11) having a front side facing an axially displaced second coil (12) magnetically coupled to the first coil. Inner or central turns of the first coil are arranged in and define a first coil plane (110), while outer turns of the first coil extend axially out of the first coil plane and are bent away from the second coil. The geometric field grading achieved by this arrangement decreases a maximum electric field strength at the surface of the coil conductors, and thus simplifies the insulation tasks.

    Abstract translation: 本发明涉及用于向中等或高电位的栅极驱动器提供电力的感应功率传输系统。 感应功率传输系统具有第一螺旋线圈(11),其具有面向磁耦合到第一线圈的轴向移位的第二线圈(12)的前侧。 第一线圈的内圈或中心圈被布置在并限定第一线圈平面(110),而第一线圈的外圈匝轴向延伸出第一线圈平面并且被弯曲远离第二线圈。 通过该布置实现的几何场分级降低了线圈导体表面处的最大电场强度,从而简化了绝缘任务。

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