公开(公告)号：EP2693622A1

公开(公告)日：2014-02-05

申请号：EP12179010.9

申请日：2012-08-02

Applicant: ABB Technology AG

Inventor： Baumann, David ,  Cottet, Didier ,  Cimino, Mikael ,  Steiner, Reto ,  Stevanovic, Ivica

IPC: H02M7/00 ,  H02J5/00

CPC classification number: H02M7/003 ,  H02J5/005 ,  H02J50/12 ,  H02J50/40 ,  H02M2001/0006 ,  H05K7/1432

Abstract: A power electronics device 10 comprises at least one power module 16 comprising power semiconductors 20, a controller 22 for controlling the power semiconductors 20, and an auxiliary power supply 22 for powering the controller 22; and a rack 14 for supporting the power module 16. The power module 16 comprises a first inductor 40 attached to the power module 16 and electrically connected to the auxiliary power supply 22. The power electronics device 10 comprises a second inductor 42 attached to the rack 14, such that the second inductor 42 is galvanically separated from the first inductor 40. In an installation position of the power module 16 in the rack 14, the first inductor 40 and the second inductor 42 are inductively coupled, such that electrical power is transferable from the second inductor 42 to the first inductor 40. The power module 16 is removable from the installation position, such that the inductive coupling between the first inductor 40 and the second inductor 42 is interrupted.

Abstract translation: 电力电子设备10包括至少一个功率模块16，功率模块16包括功率半导体20，用于控制功率半导体20的控制器22和用于为控制器22供电的辅助电源22; 以及用于支撑功率模块16的机架14.功率模块16包括附接到功率模块16并电连接到辅助电源22的第一电感器40.功率电子设备10包括附接到机架的第二电感器42 14，使得第二电感器42与第一电感器40电流分离。在功率模块16在机架14中的安装位置，第一电感器40和第二电感器42感应耦合，使得电力可转移 从第二电感器42到第一电感器40.功率模块16可从安装位置移除，使得第一电感器40和第二电感器42之间的电感耦合被中断。

公开(公告)号：EP3168873A1

公开(公告)日：2017-05-17

申请号：EP15194110.1

申请日：2015-11-11

Applicant: ABB Technology AG

Inventor： Cottet, Didier ,  Traub, Felix

IPC: H01L25/07 ,  H01L23/00 ,  H01L23/051

CPC classification number: H01L25/072 ,  H01L23/051 ,  H01L23/48 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/73 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2224/73201 ,  H01L2224/73251 ,  H01L2224/73265 ,  H01L2224/8384 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2224/48 ,  H01L2224/72 ,  H01L2924/014 ,  H01L2224/32 ,  H01L2924/00

Abstract: A power semiconductor module (10) comprises an electrical conducting base plate (14) and an electrically conducting top plate (35); a plurality of power semiconductor chips (12), which are arranged between the base plate (14) and the top plate (35) and which are attached with a collector face (16) to the base plate (14); a plurality of press elements (34), wherein each press element (34) is pressed by the top plate (35) with a foot (36) against an emitter area (18) on a power semiconductor chip (12) and wherein each press element (34) electrically connects the top plate (35) with the emitter area (18); at least two gate conductors (32) electrically insulated from the top plate (35), wherein each gate conductor (32) runs from the top plate (35) towards the base plate (14) and contacts at least one power semiconductor chip (12) in a gate area (24); and an electrically conducting emitter connection element (48), which is arranged between the base plate (14) and the top plate (35) and which electrically interconnects the feet (36) of the press elements (34).

Abstract translation: 功率半导体模块（10）包括导电底板（14）和导电顶板（35）; 多个功率半导体芯片（12），其布置在所述基板（14）和所述顶板（35）之间并且通过集电面（16）附接到所述基板（14）。 多个按压元​​件（34），其中每个按压元件（34）被顶板（35）用脚（36）按压在功率半导体芯片（12）上的发射器区域（18）上，并且其中每个按压 元件（34）将顶板（35）与发射极区域（18）电连接; 至少两个与顶板（35）电绝缘的栅极导体（32），其中每个栅极导体（32）从顶板（35）朝向底板（14）延伸并且接触至少一个功率半导体芯片（12 ）在门区域（24）中; 和布置在基板（14）和顶板（35）之间并且电气互连压力元件（34）的脚（36）的导电的发射极连接元件（48）。

公开(公告)号：EP2587906A1

公开(公告)日：2013-05-01

申请号：EP12188559.4

申请日：2012-10-15

Applicant: ABB Technology AG

Inventor： Cottet, Didier ,  Agostini, Francesco ,  Gradinger, Thomas ,  Vögeli, Andreas

IPC: H05K7/20

Abstract: The present invention relates to the cooling of electric and/or electronic components, in particular to an electric and/or electronic system (200) with a cabinet (400), which comprises a cabinet housing (406) comprising a first aperture for receiving a stream of cooling air. The cabinet housing (406) comprises a second aperture for releasing the cooling air thereafter in an operating state of the cabinet. At least two modules (102), each comprising a guiding structure with an inlet and an outlet are provided in the cabinet. The at least two modules (102) are arranged in the cabinet housing (406) such that a branch of the major portion of cooling air flowing through the first aperture of said cabinet housing (406) is enabled to flow into each module (102) via the inlet guided by the guiding structure through the dedicated module (102) to the outlet and thereafter through the second aperture out of the cabinet housing (406).

Abstract translation: 本发明涉及电气和/或电子部件的冷却，特别是涉及具有机柜（400）的电气和/或电子系统（200）的冷却，所述电气和/或电子系统（200）包括机壳外壳（406），所述机壳外壳包括用于接收 冷却空气流。 橱柜壳体（406）包括用于在机柜的操作状态之后释放冷却空气的第二孔。 在机柜中设置至少两个模块（102），每个模块（102）包括具有入口和出口的引导结构。 所述至少两个模块（102）布置在所述机壳壳体（406）中，使得流过所述机壳壳体（406）的所述第一孔的主要部分冷却空气的分支能够流入每个模块（102） 通过引导结构引导的入口通过专用模块（102）到出口，然后通过第二孔从机壳外壳（406）中取出。

公开(公告)号：EP2587907A1

公开(公告)日：2013-05-01

申请号：EP12188563.6

申请日：2012-10-15

Applicant: ABB Technology AG

Inventor： Cottet, Didier ,  Agostini, Francesco ,  Gradinger, Thomas ,  Vögeli, Andreas

IPC: H05K7/20

CPC classification number: H05K7/20672 ,  F28D15/0266 ,  H02M7/003 ,  H02M2007/4835 ,  H05K7/20936

Abstract: The present invention relates to the cooling of electric and/or electronic components, in particular to a module (102) of an electric and/or electronic system. The module (102) comprising a guiding structure (615) and an inlet (614) for receiving a stream of cooling air and with an outlet (616) for releasing cooling air thereafter in an operating state of the module (102). The guiding structure (615) being provided for guiding the cooling air entering through the inlet (614) and leaving the module through the outlet (616) in an operating state of the module (102). The module (102) comprises a thermosiphon cooler (600) with an evaporator (604) and a condenser (602) for transferring a majority of a heat load to said cooling air in an operating state of the module (102). The evaporator (604) is tilted with respect to the condenser (602) wherein the condenser (602) is arranged such that a major portion of said cooling air flows through the condenser (602).

Abstract translation: 本发明涉及电气和/或电子部件的冷却，特别涉及电气和/或电子系统的模块（102）。 模块（102）包括用于接收冷却空气流的引导结构（615）和入口（614），并且具有用于在模块（102）的操作状态下释放冷却空气的出口（616）。 引导结构（615）被设置用于引导通过入口（614）进入的冷却空气并且在模块（102）的操作状态下使模块通过出口（616）。 模块（102）包括具有蒸发器（604）的热虹吸管冷却器（600）和用于在模块（102）的操作状态下将大部分热负荷转移到所述冷却空气的冷凝器（602）。 蒸发器（604）相对于冷凝器（602）倾斜，其中冷凝器（602）被布置成使得大部分的冷却空气流过冷凝器（602）。

公开(公告)号：EP3104507A1

公开(公告)日：2016-12-14

申请号：EP15171929.1

申请日：2015-06-12

Applicant: ABB Technology AG

Inventor： Traub, Felix ,  Skibin, Stanislav ,  Mohn, Fabian ,  Cottet, Didier ,  Schuderer, Jürgen ,  Kicin, Slavo ,  Hartmann, Samuel

IPC: H02M1/44 ,  H02M7/00

CPC classification number: H01L23/552 ,  H01L25/072 ,  H01R13/719

Abstract: The present invention relates to a terminal arrangement for externally contacting an electronic circuit of a power semiconductor module, the terminal arrangement comprising a first external terminal (10), a second external terminal (12) and at least one shield member (26) for at least partly shielding an electromagnetic field (15) originated from said first external terminal (10) and said second external terminal (12), wherein in a shielding region (11) of the first external terminal (10) at least one shield member (26) is located at a distance to the first external terminal (10) in a direction perpendicular to a longitudinal extension of first external terminal (10) and wherein and in a shielding region (13) of the second external terminal (12) at least one shield member (26) is located at a distance to the second external terminal (12) in a direction perpendicular to a longitudinal extension of second external terminal (12), wherein the distance is equal or less than at least one of the maximum width (30) of the first external terminal (10) and the second external terminal (12) in said shielding region (11, 13) of the first external terminal (10) and the second external terminal (12), and the maximum distance between the first external terminal (10) and the second external terminal (12) in said shielding region (11, 13) of the first external terminal (10) and the second external terminal (12). Such a terminal arrangement provides a low stray inductance and/or may be built easily.

Abstract translation: 本发明涉及用于外部接触功率半导体模块的电子电路的端子装置，该端子装置包括第一外部端子（10），第二外部端子（12）和至少一个屏蔽构件（26） 至少部分地屏蔽来自所述第一外部端子（10）和所述第二外部端子（12）的电磁场（15），其中在所述第一外部端子（10）的屏蔽区域（11）中至少一个屏蔽构件 ）位于与第一外部端子（10）的纵向延伸方向垂直的方向上与第一外部端子（10）相距一定距离处，并且在第二外部端子（12）的屏蔽区域（13）中至少一个 屏蔽构件（26）在垂直于第二外部端子（12）的纵向延伸的方向上位于与第二外部端子（12）一定距离处，其中该距离等于或小于 第一外部端子（10）和第二外部端子（12）的所述屏蔽区域（11,13）中的第一外部端子（10）和第二外部端子（12）的最大宽度（30） 第一外部端子（10）和第二外部端子（12）的所述屏蔽区域（11,13）中的第一外部端子（10）和第二外部端子（12）之间的最大距离。 这样的端子装置提供了低杂散电感和/或可容易地构建。

公开(公告)号：EP2701477A1

公开(公告)日：2014-02-26

申请号：EP12181155.8

申请日：2012-08-21

Applicant: ABB Technology AG

Inventor： Cottet, Didier ,  Agostini, Francesco ,  Cimino, Mikael ,  Velthuis, Rudi ,  Gradinger, Thomas ,  Kuhn, Erich ,  Grünig, Frank

IPC: H05K7/14 ,  H05K9/00

CPC classification number: H05K7/1432 ,  H05K9/0062

Abstract: An enclosure (10) for an electronic device (20) is provided. The enclosure comprises an enclosure wall (30) comprising a dielectric material, a first conductive layer (40) abutting an inner face (50) of the enclosure wall (30), and a second conductive layer (60) abutting an outer face (70) of the enclosure wall (30), wherein the first and the second conductive layers (40, 60) are electrically insulated from each other and are electrically connectable to predefined electric potentials, so that the electric field in the enclosure wall (30) can be homogenized in an operational state of the enclosure (10). Further, an electronic device and electronic system are provided, comprising such enclosures and electronic circuits located therein.

Abstract translation: 提供了一种用于电子设备（20）的外壳（10）。 所述外壳包括包含绝缘材料的封闭壁（30），邻接所述封闭壁（30）的内​​表面（50）的第一导电层（40）和邻接外壁（70）的第二导电层（60） ），其中所述第一和第二导电层（40,60）彼此电绝缘并且可电连接到预定电位，使得所述封闭壁（30）中的电场可以 在外壳（10）的操作状态下被均化。 此外，提供了一种电子设备和电子系统，其包括位于其中的这种外壳和电子电路。

公开(公告)号：EP2701476A1

公开(公告)日：2014-02-26

申请号：EP12181136.8

申请日：2012-08-21

Applicant: ABB Technology AG

Inventor： Kuhn, Erich ,  Grünig, Frank ,  Cottet, Didier ,  Agostini, Francesco ,  Cimino, Mikael ,  Velthuis, Rudi ,  Gradinger, Thomas

IPC: H05K7/14 ,  H05K9/00

CPC classification number: H05K7/1432 ,  H05K9/0045 ,  H05K9/0062

Abstract: A modular electronic system for medium and high voltages is provided. The system includes a cabinet (160) having a number of slots (120) arranged in an array, at least one electronic module (130) provided in a slot (120) of the cabinet, the module including an enclosure (10) with a three dimensional shape, having an enclosure wall (30) comprising a dielectric material, and a field shaping conductive layer (60) abutting a face (70) of the enclosure wall (30), and an electronic device (20) located in the enclosure (10), wherein the field shaping conductive layer (60) is electrically connectable to a predefined electric potential in an operating state of the modular electronic system (100).

Abstract translation: 提供了用于中高压的模块化电子系统。 该系统包括具有排列成阵列的多个狭槽（120）的柜（160），设置在机柜的狭槽（120）中的至少一个电子模块（130），该模块包括具有 具有包括电介质材料的外壳壁（30）的三维形状以及邻接所述外壳壁（30）的表面（70）的场整形导电层（60）和位于所述外壳中的电子设备（20） （10），其中所述场整形导电层（60）在所述模块化电子系统（100）的操作状态下可电连接到预定电位。

公开(公告)号：EP2595302A1

公开(公告)日：2013-05-22

申请号：EP11189931.6

申请日：2011-11-21

Applicant: ABB Technology AG

Inventor： Cottet, Didier ,  Riedel, Gernot ,  Kalland, Lars

IPC: H02M7/49 ,  H02M1/32

CPC classification number: H02M7/49 ,  H02M1/32 ,  H02M2001/325 ,  H02M2007/4835

Abstract: A method of maintaining a power module (20) of a power electronics device (10), the power electronics device (10) comprising a plurality of power modules (20), comprises the following steps: switching to a service mode of the power module (20) by activating a bypass element (42) of the power module (20) such that the power module (20) is bypassed and by redistributing an operation voltage and/or current to other power modules (20) of the plurality of power modules (20); performing a maintenance action on the power module (20); and switching to a normal mode of the power module (20) by deactivating the bypass element (42) and by redistributing the operation voltage and/or current back to the power module and the other power modules.

Abstract translation: 维护一个功率电子装置（10）的功率模块（20）的一种方法，包括功率模块有多个（20）的功率电子装置（10）包括以下步骤：在切换到电源模块的服务模式 （20）通过激活所述电源模块的旁路元件（42）（20）检测所做的功率模块（20）被旁路，通过重新分配到操作电压和/或电流，以电力的多个其它的电源模块（20） 模块（20）; 执行电源模块上的维护动作（20）; 和由停用旁路元件（42）和通过重新分配的工作电压和/或电流返回到电源模块和其它电源模块切换到所述功率模块（20）的正常模式。