Abstract:
An enclosure (10) for an electronic device (20) is provided. The enclosure comprises an enclosure wall (30) comprising a dielectric material, a first conductive layer (40) abutting an inner face (50) of the enclosure wall (30), and a second conductive layer (60) abutting an outer face (70) of the enclosure wall (30), wherein the first and the second conductive layers (40, 60) are electrically insulated from each other and are electrically connectable to predefined electric potentials, so that the electric field in the enclosure wall (30) can be homogenized in an operational state of the enclosure (10). Further, an electronic device and electronic system are provided, comprising such enclosures and electronic circuits located therein.
Abstract:
A modular electronic system for medium and high voltages is provided. The system includes a cabinet (160) having a number of slots (120) arranged in an array, at least one electronic module (130) provided in a slot (120) of the cabinet, the module including an enclosure (10) with a three dimensional shape, having an enclosure wall (30) comprising a dielectric material, and a field shaping conductive layer (60) abutting a face (70) of the enclosure wall (30), and an electronic device (20) located in the enclosure (10), wherein the field shaping conductive layer (60) is electrically connectable to a predefined electric potential in an operating state of the modular electronic system (100).
Abstract:
A transformer for a modular converter comprises a core (1) having a core window; a first winding (20), in particular a high-voltage winding, surrounding a first section of the core, said first winding enclosed by an encapsulation (21) made from solid, electrically insulating material; a second winding (30), in particular a low-voltage winding, surrounding the first or a second section of the core; an electrically insulating supporting structure attached to the first winding, in particular to the encapsulation, for holding the first winding in a defined position relative to the core; wherein the supporting structure is not extending into the core window.
Abstract:
The present invention is concerned with an inductive power transfer system for providing power to a gate drive on medium or high electrical potential. The inductive power transfer System has a first spiral coil (11) having a front side facing an axially displaced second coil (12) magnetically coupled to the first coil. Inner or central turns of the first coil are arranged in and define a first coil plane (110), while outer turns of the first coil extend axially out of the first coil plane and are bent away from the second coil. The geometric field grading achieved by this arrangement decreases a maximum electric field strength at the surface of the coil conductors, and thus simplifies the insulation tasks.
Abstract:
A transformer for a modular converter is disclosed, said transformer comprising a core (10); a first coil (2), said first coil comprising a first winding (20), in particular a high-voltage winding, surrounding a first section of the core, an encapsulation (21) made from solid, electrically insulating material and enclosing said first winding; a second winding (30), in particular a low-voltage winding, surrounding the first or a second section of the core; wherein that the transformer further comprises an electrically conductive coating (60) formed on at least a portion of an outer surface of the encapsulation.
Abstract:
Leistungselektronikmodul (1) mit einem ersten Leistungselektronikelement (5), welches im Betrieb des Leistungselektronikmoduls (1) einen ersten Wärmestrom (29) erzeugt, und mit einem zweiten Leistungselektronikelement (6), welches im Betrieb des Leistungselektronikmoduls (1) einen zweiten Wärmestrom (30) erzeugt, und mit einem Sekundärkühlkreislauf (25), einem ersten Kühler (10), einem zweiten Kühler (11) und einem Wärmetauscher (14). Dabei ist der erste Kühler (10) zur Aufnahme mindestens eines Teils des ersten Wärmestromes (29) thermisch mit dem ersten Leistungselektronikelement (5) verbunden, und der zweite Kühler (11) zur Aufnahme mindestens eines Teils des zweiten Wärmestromes (30) thermisch mit dem zweiten Leistungselektronikelement (6) verbunden, wobei der Wärmetauscher (14) zur Übertragung mindestens eines Teils des ersten Wärmestromes (29) und des zweiten Wärmestromes (30) an einen Primärkühlstrom (26) im Betrieb des Leistungselektronikmoduls (1) ausgebildet ist. Der Wärmetauscher (14) ist dabei thermisch für einen abführbaren Wärmestrom ausgelegt, der betragsmässig kleiner als eine aus dem maximalen ersten Wärmestrom (29) und dem maximalen zweiten Wärmestrom (30) gebildete Summe ist.
Abstract:
The present invention relates to the cooling of electric and/or electronic components, in particular to a module (102) of an electric and/or electronic system. The module (102) comprising a guiding structure (615) and an inlet (614) for receiving a stream of cooling air and with an outlet (616) for releasing cooling air thereafter in an operating state of the module (102). The guiding structure (615) being provided for guiding the cooling air entering through the inlet (614) and leaving the module through the outlet (616) in an operating state of the module (102). The module (102) comprises a thermosiphon cooler (600) with an evaporator (604) and a condenser (602) for transferring a majority of a heat load to said cooling air in an operating state of the module (102). The evaporator (604) is tilted with respect to the condenser (602) wherein the condenser (602) is arranged such that a major portion of said cooling air flows through the condenser (602).
Abstract:
The present invention is concerned with an improved electrical insulation of an Inductive Power Transfer (IPT) system. According to the invention, a flat, two-dimensional conductor trace of a first coil of the IPT system is bent or shaped in a third dimension perpendicular to a coil plane encompassing the turns of the first coil, such that the edges of the conductor point away from a second, opposite coil of the IPT system. A geometric field grading achieved by such a conductor shape moves a direction and location of the electric field peaks occurring at the conductor edges away from the opposite coil of the IPT, and thus simplifies inter-coil insulation tasks.
Abstract:
A two-phase heat exchanger for cooling at least one electronic and/or electric component with an evaporator and a condenser is provided. The evaporator is adapted to transfer heat from the electronic and/or electric component to a working fluid. The condenser comprises a roll-bonded panel, which has a first channel which has a first connection port and a second connection port. The evaporator has a second channel and first connection openings and second connection openings. The first connection port of the first channel is connected to one first connection opening of the evaporator and the second connection port of the first channel is connected to one second connection opening of the evaporator and the working fluid is provided in order to convey heat by means of convection from the evaporator to the condenser by flowing from the second channel through the first connection opening or the second connection opening of the evaporator towards the first channel.
Abstract:
The present invention relates to the cooling of electric and/or electronic components, in particular to an electric and/or electronic system (200) with a cabinet (400), which comprises a cabinet housing (406) comprising a first aperture for receiving a stream of cooling air. The cabinet housing (406) comprises a second aperture for releasing the cooling air thereafter in an operating state of the cabinet. At least two modules (102), each comprising a guiding structure with an inlet and an outlet are provided in the cabinet. The at least two modules (102) are arranged in the cabinet housing (406) such that a branch of the major portion of cooling air flowing through the first aperture of said cabinet housing (406) is enabled to flow into each module (102) via the inlet guided by the guiding structure through the dedicated module (102) to the outlet and thereafter through the second aperture out of the cabinet housing (406).