公开(公告)号：EP3144293A4

公开(公告)日：2018-01-03

申请号：EP15793276

申请日：2015-04-08

Applicant: ADEKA CORP

Inventor： YOSHINO TOMOHARU ,  ENZU MASAKI ,  SAKURAI ATSUSHI ,  NISHIDA AKIHIRO ,  OKABE MAKOTO

IPC: C07C215/08 ,  C07F1/08 ,  C23C16/18 ,  C23C16/455 ,  H01L21/28 ,  H01L21/285

CPC classification number: C07F1/08 ,  C07C215/08 ,  C09D1/00 ,  C09D5/24 ,  C23C16/06 ,  C23C16/18 ,  C23C16/45525 ,  C23C16/45542 ,  C23C16/45553

Abstract: This invention provides a copper compound represented by General Formula (I) below. In General Formula (I), R 1 to R 3 independently represent a linear or branched alkyl group with a carbon number of 1 to 5; provided that R 1 and R 2 are a methyl group, R 3 represents a linear or branched alkyl group with a carbon number of 2 to 5; and provided that R 1 is a methyl group and R 2 is an ethyl group, R 3 represents a methyl group or a linear or branched alkyl group with a carbon number of 3 to 5. A starting material for forming a thin film of the present invention includes the copper compound represented by General Formula (I). The present invention can provide a copper compound which has a low melting point, can be conveyed in a liquid state, has a high vapor pressure, and is easily vaporizable, and also a starting material for forming a thin film which uses such a copper compound.