Abstract:
Alkoxidverbindung, die durch die folgende Formel (I) dargestellt ist, und ein Rohmaterial für die Bildung eines dünnen Films, enthaltend die Alkoxidverbindung. In der Formel stellt R1 eine lineare oder verzweigte Alkylgruppe mit 2 bis 4 Kohlenstoffatomen dar, und R2 und R3 stellen jeweils eine lineare oder verzweigte Alkylgruppe mit 1 bis 4 Kohlenstoffatomen dar. In der Formel (I) ist R1 vorzugsweise eine Ethylgruppe. Es ist auch bevorzugt, dass einer der Reste R2 und R3, oder beide, eine Ethylgruppe ist/sind. Das Rohmaterial für die Bildung eines dünnen Films, beinhaltend eine Alkoxidverbindung, die durch die allgemeine Formel (I) dargestellt ist, wird vorzugsweise als ein Rohmaterial für die chemische Dampfabscheidung verwendet.
Abstract:
Alkoxidverbindung, die durch die folgende Formel (I) dargestellt ist:; in der Formel stellt R1eine lineare oder verzweigte Alkylgruppe mit 2 bis 4 Kohlenstoffatomen dar, und R2und R3stellen jeweils eine lineare oder verzweigte Alkylgruppe mit 1 bis 4 Kohlenstoffatomen dar.
Abstract:
The cobalt compound of this invention is represented by general formula (I) below. In general formula (I), R 1 to R 3 independently represent a straight chain or branched alkyl group having 1 to 5 carbon atoms. In addition, the thin film-forming raw material of this invention contains the cobalt compound represented by general formula (I). According to this invention, it is possible to provide a cobalt compound which can be transported in the form of a liquid due to having a low melting point, which can be decomposed at a low temperature and which can be easily vaporized due to having a high vapor pressure; and a thin film-forming raw material that uses this cobalt compound.
Abstract:
The present invention provides a metal alkoxide compound having physical properties suitable for a material for forming thin films by CVD, and particularly, a metal alkoxide compound having physical properties suitable for a material for forming metallic-copper thin films. Specifically, the present invention provides a metal alkoxide compound represented by general formula (I), and a thin-film-forming material including the metal alkoxide compound. (In the formula, R 1 represents a methyl group or an ethyl group, R 2 represents a hydrogen atom or a methyl group, R 3 represents a C 1-3 linear or branched alkyl group, M represents a metal atom or a silicon atom, and n represents the valence of the metal atom or silicon atom.
Abstract:
This invention provides a copper compound represented by General Formula (I) below. In General Formula (I), R 1 to R 3 independently represent a linear or branched alkyl group with a carbon number of 1 to 5; provided that R 1 and R 2 are a methyl group, R 3 represents a linear or branched alkyl group with a carbon number of 2 to 5; and provided that R 1 is a methyl group and R 2 is an ethyl group, R 3 represents a methyl group or a linear or branched alkyl group with a carbon number of 3 to 5. A starting material for forming a thin film of the present invention includes the copper compound represented by General Formula (I). The present invention can provide a copper compound which has a low melting point, can be conveyed in a liquid state, has a high vapor pressure, and is easily vaporizable, and also a starting material for forming a thin film which uses such a copper compound.
Abstract:
PROBLEM TO BE SOLVED: To provide a titanium precursor which excels in reactivity with a reactant suitable for a CVD method, an ALD method or the like, especially with an oxidant, and in which the improvement in film formation speed and the low-temperature thin film become possible.SOLUTION: The metal compound is expressed by general formula (1). In the formula, Rdenotes a hydrogen atom or a methyl group, Rdenotes a methyl group or an ethyl group, and Rdenotes a methyl group or an ethyl group.