Abstract:
An alkoxide compound of formula (I) suitable as a material for thin film formation used in thin film formation involving vaporization of a material such as CVD, a material for thin film formation including the alkoxide compound, and a process for thin film formation using the material. The process includes vaporizing the material for thin film formation, introducing the resulting vapor containing the alkoxide compound, onto a substrate, and causing the vapor to decompose and/or chemically react to form a thin film on the substrate. wherein one of R1 and R2 represents an alkyl group having 1-4 carbon atoms, the other representing a hydrogen atom or an alkyl group having 1-4 carbon atoms; R3 and R4 each represent an alkyl group having 1-4 carbon atoms; A represents an alkanediyl group having 1-8 carbon atoms; M represents a silicon atom or a hafnium atom; and n represents 4.
Abstract:
Titanium, zirconium and hafnium alkenoxides (I) are new. Metal alkenoxides of formula (I) are new. M(OR) 4 (I) R : 2-propen-1-yl, 1-methyl-2-propen-1-yl or 1,1-dimethyl-2-propen-1-yl. Independent claims are also included for: (1) material (M1) for forming a thin film, comprising a compound (I); (2) producing a thin film by vaporizing M1 over a substrate to form a (I)-containing vapor and forming a thin film on the substrate by decomposing (I) or subjecting (I) to a chemical reaction; (3) producing a thin film by vaporizing M1 over a substrate to form a (I)-containing vapor and forming a thin metal oxide film on the substrate by decomposing (I) or subjecting (I) to a chemical reaction in the presence of a reactive gas containing oxygen or ozone; (4) thin film produced as above.
Abstract:
The cobalt compound of this invention is represented by general formula (I) below. In general formula (I), R 1 to R 3 independently represent a straight chain or branched alkyl group having 1 to 5 carbon atoms. In addition, the thin film-forming raw material of this invention contains the cobalt compound represented by general formula (I). According to this invention, it is possible to provide a cobalt compound which can be transported in the form of a liquid due to having a low melting point, which can be decomposed at a low temperature and which can be easily vaporized due to having a high vapor pressure; and a thin film-forming raw material that uses this cobalt compound.
Abstract:
The present invention provides a metal alkoxide compound having physical properties suitable for a material for forming thin films by CVD, and particularly, a metal alkoxide compound having physical properties suitable for a material for forming metallic-copper thin films. Specifically, the present invention provides a metal alkoxide compound represented by general formula (I), and a thin-film-forming material including the metal alkoxide compound. (In the formula, R 1 represents a methyl group or an ethyl group, R 2 represents a hydrogen atom or a methyl group, R 3 represents a C 1-3 linear or branched alkyl group, M represents a metal atom or a silicon atom, and n represents the valence of the metal atom or silicon atom.
Abstract:
A metal compound represented by the following general formula (I): [wherein R , R , R , and R each represent an alkyl group having one to four carbon atoms, A represents an alkanediyl group having one to eight carbon atoms, M represents a lead atom, a titanium atom or a zirconium atom, and n represents 2 when M is a lead atom and represents 4 when M is a titanium or zirconium atom]. The above metal compound has a low melting point and thus can be transported in a liquid state, has a high vapor pressure and thus is easy to vaporize, and is free from the change in its quality due to the exchange of ligands or a chemical reaction also when mixed with another metal compound, and thus it is suitable as a material for use in a method for preparing a thin film, such as the CVD method forming a thin film through the vaporization of a metal compound.
Abstract:
This invention provides a copper compound represented by General Formula (I) below. In General Formula (I), R 1 to R 3 independently represent a linear or branched alkyl group with a carbon number of 1 to 5; provided that R 1 and R 2 are a methyl group, R 3 represents a linear or branched alkyl group with a carbon number of 2 to 5; and provided that R 1 is a methyl group and R 2 is an ethyl group, R 3 represents a methyl group or a linear or branched alkyl group with a carbon number of 3 to 5. A starting material for forming a thin film of the present invention includes the copper compound represented by General Formula (I). The present invention can provide a copper compound which has a low melting point, can be conveyed in a liquid state, has a high vapor pressure, and is easily vaporizable, and also a starting material for forming a thin film which uses such a copper compound.
Abstract:
PROBLEM TO BE SOLVED: To provide a raw material for depositing a thin film, which is a precursor which is used for supplying hafnium to the thin film and to which the properties coincident with those of a CVD raw material are imparted. SOLUTION: The raw material for depositing the thin film contains a new hafnium compound shown by general formula (1) (wherein R 1 is a methyl group; R 2 is a group selected from a methyl group, an ethyl group and an isopropyl group; and n is 1). In the formula, R 1 is a 1-3C alkyl group and can be the same or different; R 2 is a 1-4C alkyl group and can be the same or different; and n is a numeral of 1-5. COPYRIGHT: (C)2008,JPO&INPIT
Abstract translation:要解决的问题:提供一种用于沉积薄膜的原料,该薄膜是用于向薄膜供应铪的前体,并且赋予与CVD原料的性质一致的特性。 解决方案:用于沉积薄膜的原材料含有通式(1)所示的新的铪化合物(其中R 1 SP>是甲基; R 2 SP / 是选自甲基,乙基和异丙基的基团,n为1)。 在该式中,R 1是一个1-3C的烷基,可以相同或不同; R 2是1-4C烷基,可以相同或不同; n为1-5的数字。 版权所有(C)2008,JPO&INPIT