公开(公告)号：KR20200142123A

公开(公告)日：2020-12-21

申请号：KR20207035949

申请日：2015-06-12

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： GHOSHAL SHAMIK ,  KUMAR V SATHISH ,  VISHWANATH PAVAN ,  PANDHER RANJIT S ,  CHANDRAN REMYA ,  MUKHERJEE SUTAPA ,  SARKAR SIULI ,  SINGH BAWA ,  BHATKAL RAVINDRA MOHAN

IPC: B22F3/10 ,  B22F3/22 ,  B22F5/00 ,  B22F7/04 ,  H01L21/683 ,  H01L23/00

Abstract: 멀티칩및 플립(flip) 칩들을포함하는단일구성요소들의다이부착을위한방법들은소결페이스트를기판상에또는다이의뒷면상에프린팅하는단계를포함할수 있다. 프린팅은스텐실프린팅, 스크린프린팅, 또는디스펜싱(dispensing) 프로세스를포함할수 있다. 페이스트는다이싱(dicing) 이전에전체웨이퍼(wafer)의뒷면상에, 또는개별적인다이의뒷면상에프린팅될수 있다. 소결막들이또한, 제작되고웨이퍼, 다이또는기판으로이동될수 있다. 후소결단계는처리량을증가시킬수 있다.

公开(公告)号：SG11202012605UA

公开(公告)日：2021-01-28

申请号：SG11202012605U

申请日：2019-06-21

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： GHOSAL SHAMIK ,  CHANDRAN REMYA ,  MANOHARAN VENODH ,  SARKAR SIULI ,  SINGH BAWA ,  RAUT RAHUL

IPC: B22F1/00 ,  B22F9/24 ,  B23K35/02

Abstract: A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.

公开(公告)号：MY173832A

公开(公告)日：2020-02-24

申请号：MYPI2015000905

申请日：2013-10-29

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： MUKHERJEE SUTAPA ,  SARKAR SIULI ,  PANDHER RANJIT ,  BHATKAL RAVI ,  SINGH BAWA ,  GHOSAL SHAMIK ,  KHASELEV OSCAR ,  RAUT RAHUL ,  RIBAS MORGANA ,  KUMAR SATHISH ,  CHANDRAN REMYA ,  VISHWANATH PAVAN ,  PACHAMUTHU ASHOK ,  BOUREGHDA MONNIR ,  DESAI NITIN ,  LIFTON ANNA ,  CHAKI NIRMALYA KUMAR

Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent.