公开(公告)号：KR20200142115A

公开(公告)日：2020-12-21

申请号：KR20207035792

申请日：2015-07-14

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： PUJARI NARAHARI ,  SINGH BAWA ,  BHATKAL RAVI ,  SARKAR SIULI ,  RUSTOGI ANUBHAV

IPC: H01B1/22 ,  B25J19/00 ,  B64C1/00 ,  G06F1/16 ,  G06F3/044 ,  H01B1/02 ,  H05K1/09 ,  H05K1/18

Abstract: 유기매질에분산되어있는전도성입자를포함하는전도성페이스트로서, 상기유기매질이용매, 및폴리에스테르를포함하는결합제를포함하는, 전도성페이스트.

公开(公告)号：MY179941A

公开(公告)日：2020-11-19

申请号：MYPI2015000887

申请日：2013-10-09

Applicant: ALPHA METALS ,  ALPHA ASSEMBLY SOLUTIONS INC

Inventor： CHOUDHURY PRITHA ,  DE AVILA RIBAS MORGANA ,  MUKHERJEE SUTAPA ,  KUMAR ANIL ,  SARKAR SIULI ,  PANDHER RANJIT ,  BHATKAL RAVI ,  SINGH BAWA

IPC: B23K1/00 ,  B23K3/06 ,  B23K35/02 ,  B23K35/26

Abstract: A lead-free, antimony-free solder alloy comprising: (a) 10 wt.% or less of silver (b) 10 wt.% or less of bismuth (c) 3 wt.% or less of copper (d) at least one of the following elements up to 1 wt.% of nickel up to 1 wt.% of titanium up to 1 wt.% of cobalt up to 3.5 wt.% of indium up to 1 wt.% of zinc up to 1 wt.% of arsenic (e) optionally one or more of the following elements 0 to 1 wt.% of manganese,0 to 1 wt. % of chromium 0 to 1 wt.% of germanium, 0 to 1 wt.% of iron, 0 to 1 wt.% of aluminum, 0 to 1 wt.% of phosphorus, 0 to 1 wt.% of gold, 0 to 1 wt.% of gallium, 0 to 1 wt.% of tellurium, 0 to 1 wt.% of selenium, 0 to 1 wt.% of calcium, 0 to 1 wt.% of vanadium, 0 to 1 wt.% of molybdenum, 0 to 1 wt.% of platinum, 0 to 1 wt.% of magnesium, 0 to 1 wt.% of rare earths, (f) the balance tin, together with any unavoidable impurities. (Fig.1)

公开(公告)号：ES2628028T3

公开(公告)日：2017-08-01

申请号：ES13777315

申请日：2013-10-09

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： CHOUDHURY PRITHA ,  DE AVILA RIBAS MORGANA ,  MUKHERJEE SUTAPA ,  KUMAR ANIL ,  SARKAR SIULI ,  PANDHER RANJIT ,  BHATKAL RAVI ,  SINGH BAWA

IPC: B23K35/26 ,  B23K1/002 ,  B23K1/012 ,  B23K1/19 ,  B23K35/02 ,  C22C13/00 ,  C22C13/02

Abstract: Una aleación de soldadura libre de plomo y antimonio que consta: del 3 al 5 % en peso de plata del 2 al 5 % en peso de bismuto del 0,3 al 3 % en peso de cobre del 0,03 al 1 % en peso de níquel al menos uno de los siguientes elementos del 0,005 al 1 % en peso de manganeso del 0,005 al 1 % en peso de titanio del 0,01 al 1 % en peso de cobalto el resto de estaño, junto con cualquier impureza inevitable.

公开(公告)号：MY173832A

公开(公告)日：2020-02-24

申请号：MYPI2015000905

申请日：2013-10-29

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： MUKHERJEE SUTAPA ,  SARKAR SIULI ,  PANDHER RANJIT ,  BHATKAL RAVI ,  SINGH BAWA ,  GHOSAL SHAMIK ,  KHASELEV OSCAR ,  RAUT RAHUL ,  RIBAS MORGANA ,  KUMAR SATHISH ,  CHANDRAN REMYA ,  VISHWANATH PAVAN ,  PACHAMUTHU ASHOK ,  BOUREGHDA MONNIR ,  DESAI NITIN ,  LIFTON ANNA ,  CHAKI NIRMALYA KUMAR

Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent.

公开(公告)号：SG10201705882UA

公开(公告)日：2017-08-30

申请号：SG10201705882U

申请日：2013-10-09

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： CHOUDHURY PRITHA ,  DE AVILA RIBAS MORGANA ,  MUKHERJEE SUTAPA ,  KUMAR ANIL ,  SARKAR SIULI ,  PANDHER RANJIT ,  BHATKAL RAVI ,  SINGH BAWA

Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities.