公开(公告)号：KR20210008568A

公开(公告)日：2021-01-22

申请号：KR20217001255

申请日：2012-08-02

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： PANDHER RANJIT ,  SINGH BAWA ,  SARKAR SIULI ,  CHEGUDI SUJATHA ,  KUMAR ANIL K N ,  CHATTOPADHYAY KAMANIO ,  LODGE DOMINIC ,  DE AVILA RIBAS MORGANA

IPC: B23K35/26 ,  C22C12/00 ,  C22C13/02

Abstract: 고충격인성합금이개시된다. 본발명은합금, 바람직하게는무연땜납합금을제공하며, 이는 35 내지 59 wt% Bi, 0 내지 1.0 wt% Ag, 0 내지 1.0 wt% Au, 0 내지 1.0 wt% Cr, 0 내지 2.0 wt% In, 0 내지 1.0 wt% P, 0 내지 1.0 wt% Sb, 0 내지 1.0 wt% Sc, 0 내지 1.0 wt% Y, 0 내지 1.0 wt% Zn, 및 0 내지 1.0 wt% 희토류원소를포함하고, 0보다크고 1.0 wt%까지의 Al, 0.01 내지 1.0 wt% Ce, 0보다크고 1.0 wt%까지의 Co, 0보다크고 1.0 wt%까지의 Cu, 0.001 내지 1.0 wt% Ge, 0보다크고 1.0 wt%까지의 Mg, 0보다크고 1.0 wt%까지의 Mn, 0.01 내지 1.0 wt% Ni, 및 0보다크고 1.0 wt%까지의 Ti 중하나이상과, 임의의불가피한불순물과함께잔여부 Sn을포함한다.

公开(公告)号：WO2016156853A8

公开(公告)日：2018-01-25

申请号：PCT/GB2016050910

申请日：2016-03-31

Applicant: ALPHA ASSEMBLY SOLUTIONS INC ,  ROHAN SETNA

Inventor： VENKATAGIRIYAPPA RAMAKRISHNA HOSUR ,  DE AVILA RIBAS MORGANA ,  DAS BARUN ,  SIDDAPPA HARISH HANCHINA ,  MUKHERJEE SUTAPA ,  SARKAR SIULI ,  SINGH BAWA ,  RAUT RAHUL ,  PANDHER RANJIT

IPC: B23K1/00 ,  B23K35/00 ,  C08K3/00 ,  C08K3/04 ,  C08K5/00 ,  C08K7/02 ,  C08L83/04 ,  H01L21/00 ,  H01L23/00

CPC classification number: C08K3/04 ,  B23K1/0016 ,  B23K1/20 ,  B23K35/00 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3602 ,  B23K2201/42 ,  C08K3/013 ,  C08K3/042 ,  C08K5/00 ,  C08K7/02 ,  H01L23/295 ,  H01L23/296 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/1131 ,  H01L2224/11312 ,  H01L2224/1132 ,  H01L2224/1141 ,  H01L2224/11418 ,  H01L2224/11422 ,  H01L2224/1301 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13311 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13386 ,  H01L2224/13387 ,  H01L2224/13393 ,  H01L2224/13439 ,  H01L2224/13444 ,  H01L2224/13447 ,  H01L2224/13486 ,  H01L2224/13487 ,  H01L2224/1349 ,  H01L2224/13499 ,  H01L2224/2731 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/2741 ,  H01L2224/27418 ,  H01L2224/27422 ,  H01L2224/27436 ,  H01L2224/27602 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29386 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29486 ,  H01L2224/29487 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/73204 ,  H01L2224/8184 ,  H01L2224/81856 ,  H01L2224/81862 ,  H01L2224/81874 ,  H01L2224/8321 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2924/12041 ,  H01L2924/3841 ,  C08L63/00 ,  C08L83/04 ,  C08K5/092 ,  C08K5/18 ,  C08K5/49 ,  C08L2205/025 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01006 ,  H01L2924/00012 ,  H01L2924/05341 ,  H01L2924/07001 ,  H01L2924/0715 ,  H01L2924/0675 ,  H01L2924/0665 ,  H01L2924/06 ,  H01L2924/01079 ,  H01L2924/053 ,  H01L2924/01102 ,  H01L2924/01103 ,  H01L2924/01109 ,  H01L2924/01009 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/066 ,  H01L2924/0635 ,  H01L2924/061 ,  H01L2924/05432 ,  H01L2924/04642 ,  H01L2924/05032 ,  H01L2924/05442 ,  H01L2924/0542 ,  H01L2924/0103

Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalised graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminium oxide, zinc oxide, aluminium nitride, boron nitride, silver, nano fibres, carbon fibres, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt.% of the filler based on the total weight of the composition.

Abstract translation: 一种用于电子装配过程的组合物，该组合物包含分散在有机介质中的填料，其中：有机介质包含聚合物; 填料包括石墨烯，官能化石墨烯，氧化石墨烯，多面体低聚倍半硅氧烷，石墨，2D材料，氧化铝，氧化锌，氮化铝，氮化硼，银，纳米纤维，碳纤维，金刚石，碳纳米管中的一种或多种 ，二氧化硅和金属包覆颗粒，并且所述组合物包含基于组合物总重量的0.001至40重量％的填料。

公开(公告)号：SI2739432T1

公开(公告)日：2022-04-29

申请号：SI201231983

申请日：2012-08-02

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： PANDHER RANJIT ,  SINGH BAWA ,  SARKAR SIULI ,  CHEGUDI SUJATHA ,  KUMAR ANIL K N ,  CHATTOPADHYAY KAMANIO ,  LODGE DOMINIC ,  DE AVILA RIBAS MORGANA

IPC: B23K35/00 ,  C22C12/00 ,  C22C13/00

公开(公告)号：PL2739432T3

公开(公告)日：2022-04-11

申请号：PL12756540

申请日：2012-08-02

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： PANDHER RANJIT ,  SINGH BAWA ,  SARKAR SIULI ,  CHEGUDI SUJATHA ,  KUMAR ANIL K N ,  CHATTOPADHYAY KAMANIO ,  LODGE DOMINIC ,  DE AVILA RIBAS MORGANA

IPC: B23K35/26 ,  B23K35/02 ,  C22C12/00 ,  C22C13/02

公开(公告)号：MY179941A

公开(公告)日：2020-11-19

申请号：MYPI2015000887

申请日：2013-10-09

Applicant: ALPHA METALS ,  ALPHA ASSEMBLY SOLUTIONS INC

Inventor： CHOUDHURY PRITHA ,  DE AVILA RIBAS MORGANA ,  MUKHERJEE SUTAPA ,  KUMAR ANIL ,  SARKAR SIULI ,  PANDHER RANJIT ,  BHATKAL RAVI ,  SINGH BAWA

IPC: B23K1/00 ,  B23K3/06 ,  B23K35/02 ,  B23K35/26

Abstract: A lead-free, antimony-free solder alloy comprising: (a) 10 wt.% or less of silver (b) 10 wt.% or less of bismuth (c) 3 wt.% or less of copper (d) at least one of the following elements up to 1 wt.% of nickel up to 1 wt.% of titanium up to 1 wt.% of cobalt up to 3.5 wt.% of indium up to 1 wt.% of zinc up to 1 wt.% of arsenic (e) optionally one or more of the following elements 0 to 1 wt.% of manganese,0 to 1 wt. % of chromium 0 to 1 wt.% of germanium, 0 to 1 wt.% of iron, 0 to 1 wt.% of aluminum, 0 to 1 wt.% of phosphorus, 0 to 1 wt.% of gold, 0 to 1 wt.% of gallium, 0 to 1 wt.% of tellurium, 0 to 1 wt.% of selenium, 0 to 1 wt.% of calcium, 0 to 1 wt.% of vanadium, 0 to 1 wt.% of molybdenum, 0 to 1 wt.% of platinum, 0 to 1 wt.% of magnesium, 0 to 1 wt.% of rare earths, (f) the balance tin, together with any unavoidable impurities. (Fig.1)

公开(公告)号：ES2628028T3

公开(公告)日：2017-08-01

申请号：ES13777315

申请日：2013-10-09

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： CHOUDHURY PRITHA ,  DE AVILA RIBAS MORGANA ,  MUKHERJEE SUTAPA ,  KUMAR ANIL ,  SARKAR SIULI ,  PANDHER RANJIT ,  BHATKAL RAVI ,  SINGH BAWA

IPC: B23K35/26 ,  B23K1/002 ,  B23K1/012 ,  B23K1/19 ,  B23K35/02 ,  C22C13/00 ,  C22C13/02

Abstract: Una aleación de soldadura libre de plomo y antimonio que consta: del 3 al 5 % en peso de plata del 2 al 5 % en peso de bismuto del 0,3 al 3 % en peso de cobre del 0,03 al 1 % en peso de níquel al menos uno de los siguientes elementos del 0,005 al 1 % en peso de manganeso del 0,005 al 1 % en peso de titanio del 0,01 al 1 % en peso de cobalto el resto de estaño, junto con cualquier impureza inevitable.

公开(公告)号：SG10201705882UA

公开(公告)日：2017-08-30

申请号：SG10201705882U

申请日：2013-10-09

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： CHOUDHURY PRITHA ,  DE AVILA RIBAS MORGANA ,  MUKHERJEE SUTAPA ,  KUMAR ANIL ,  SARKAR SIULI ,  PANDHER RANJIT ,  BHATKAL RAVI ,  SINGH BAWA

Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities.

公开(公告)号：CA3116600A1

公开(公告)日：2020-04-30

申请号：CA3116600

申请日：2019-10-23

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： RAUT RAHUL ,  CHAKI NIRMALYAKUMAR ,  SINGH BAWA ,  PANDHER RANJIT ,  SARKAR SIULI

IPC: B23K35/26 ,  B23K35/02 ,  B23K35/36 ,  B23K35/362 ,  C22C13/00 ,  C22C13/02

Abstract: A solder alloy comprising: from 40 to 65 wt.% bismuth; from 1 to 10 wt.% indium; at least one of: from 0.1 to 5 wt.% gallium, from 0.1 to 5 wt.% zinc, from 0.1 to 2 w.% copper, from 0.01 to 0.1 wt.% cobalt, from 0.1 to 2 wt.% silver, from 0.005 to 0.05 wt.% titanium, and from 0.01 to 1 wt.% nickel; optionally one or more of: up to 1 wt.% vanadium, up to 1 wt.% rare earth metals, up to 1 wt.% neodymium, up to 1 wt.% chromium, up to 1 wt.% iron, up to 1 wt.% aluminium, up to 1 wt.% phosphorus, up to 1 wt.% gold, up to 1 wt.% tellurium, up to 1 wt.% selenium, up to 1 wt.% calcium, up to 1 wt.% vanadium, up to 1 wt.% molybdenum, up to 1 wt.% platinum, up to 1 wt.% magnesium, up to 1 wt.% silicon, and up to 1 wt.% manganese; and the balance tin together with any unavoidable impurities.

公开(公告)号：MY173832A

公开(公告)日：2020-02-24

申请号：MYPI2015000905

申请日：2013-10-29

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： MUKHERJEE SUTAPA ,  SARKAR SIULI ,  PANDHER RANJIT ,  BHATKAL RAVI ,  SINGH BAWA ,  GHOSAL SHAMIK ,  KHASELEV OSCAR ,  RAUT RAHUL ,  RIBAS MORGANA ,  KUMAR SATHISH ,  CHANDRAN REMYA ,  VISHWANATH PAVAN ,  PACHAMUTHU ASHOK ,  BOUREGHDA MONNIR ,  DESAI NITIN ,  LIFTON ANNA ,  CHAKI NIRMALYA KUMAR

Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent.

公开(公告)号：SG11201707720SA

公开(公告)日：2017-10-30

申请号：SG11201707720S

申请日：2016-03-31

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： VENKATAGIRIYAPPA RAMAKRISHNA HOSUR ,  DE AVILA RIBAS MORGANA ,  DAS BARUN ,  SIDDAPPA HARISH HANCHINA ,  MUKHERJEE SUTAPA ,  SARKAR SIULI ,  SINGH BAWA ,  RAUT RAHUL ,  PANDHER RANJIT

IPC: B23K1/00 ,  B23K35/00 ,  C08K3/00 ,  C08K3/04 ,  C08K5/00 ,  C08K7/02 ,  C08L83/04 ,  H01L21/00 ,  H01L23/00

Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalised graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminium oxide, zinc oxide, aluminium nitride, boron nitride, silver, nano fibres, carbon fibres, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt.% of the filler based on the total weight of the composition.