公开(公告)号：KR20200142123A

公开(公告)日：2020-12-21

申请号：KR20207035949

申请日：2015-06-12

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： GHOSHAL SHAMIK ,  KUMAR V SATHISH ,  VISHWANATH PAVAN ,  PANDHER RANJIT S ,  CHANDRAN REMYA ,  MUKHERJEE SUTAPA ,  SARKAR SIULI ,  SINGH BAWA ,  BHATKAL RAVINDRA MOHAN

IPC: B22F3/10 ,  B22F3/22 ,  B22F5/00 ,  B22F7/04 ,  H01L21/683 ,  H01L23/00

Abstract: 멀티칩및 플립(flip) 칩들을포함하는단일구성요소들의다이부착을위한방법들은소결페이스트를기판상에또는다이의뒷면상에프린팅하는단계를포함할수 있다. 프린팅은스텐실프린팅, 스크린프린팅, 또는디스펜싱(dispensing) 프로세스를포함할수 있다. 페이스트는다이싱(dicing) 이전에전체웨이퍼(wafer)의뒷면상에, 또는개별적인다이의뒷면상에프린팅될수 있다. 소결막들이또한, 제작되고웨이퍼, 다이또는기판으로이동될수 있다. 후소결단계는처리량을증가시킬수 있다.

公开(公告)号：KR20200142115A

公开(公告)日：2020-12-21

申请号：KR20207035792

申请日：2015-07-14

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： PUJARI NARAHARI ,  SINGH BAWA ,  BHATKAL RAVI ,  SARKAR SIULI ,  RUSTOGI ANUBHAV

IPC: H01B1/22 ,  B25J19/00 ,  B64C1/00 ,  G06F1/16 ,  G06F3/044 ,  H01B1/02 ,  H05K1/09 ,  H05K1/18

Abstract: 유기매질에분산되어있는전도성입자를포함하는전도성페이스트로서, 상기유기매질이용매, 및폴리에스테르를포함하는결합제를포함하는, 전도성페이스트.

公开(公告)号：KR20210008568A

公开(公告)日：2021-01-22

申请号：KR20217001255

申请日：2012-08-02

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： PANDHER RANJIT ,  SINGH BAWA ,  SARKAR SIULI ,  CHEGUDI SUJATHA ,  KUMAR ANIL K N ,  CHATTOPADHYAY KAMANIO ,  LODGE DOMINIC ,  DE AVILA RIBAS MORGANA

IPC: B23K35/26 ,  C22C12/00 ,  C22C13/02

Abstract: 고충격인성합금이개시된다. 본발명은합금, 바람직하게는무연땜납합금을제공하며, 이는 35 내지 59 wt% Bi, 0 내지 1.0 wt% Ag, 0 내지 1.0 wt% Au, 0 내지 1.0 wt% Cr, 0 내지 2.0 wt% In, 0 내지 1.0 wt% P, 0 내지 1.0 wt% Sb, 0 내지 1.0 wt% Sc, 0 내지 1.0 wt% Y, 0 내지 1.0 wt% Zn, 및 0 내지 1.0 wt% 희토류원소를포함하고, 0보다크고 1.0 wt%까지의 Al, 0.01 내지 1.0 wt% Ce, 0보다크고 1.0 wt%까지의 Co, 0보다크고 1.0 wt%까지의 Cu, 0.001 내지 1.0 wt% Ge, 0보다크고 1.0 wt%까지의 Mg, 0보다크고 1.0 wt%까지의 Mn, 0.01 내지 1.0 wt% Ni, 및 0보다크고 1.0 wt%까지의 Ti 중하나이상과, 임의의불가피한불순물과함께잔여부 Sn을포함한다.

公开(公告)号：WO2016156853A8

公开(公告)日：2018-01-25

申请号：PCT/GB2016050910

申请日：2016-03-31

Applicant: ALPHA ASSEMBLY SOLUTIONS INC ,  ROHAN SETNA

Inventor： VENKATAGIRIYAPPA RAMAKRISHNA HOSUR ,  DE AVILA RIBAS MORGANA ,  DAS BARUN ,  SIDDAPPA HARISH HANCHINA ,  MUKHERJEE SUTAPA ,  SARKAR SIULI ,  SINGH BAWA ,  RAUT RAHUL ,  PANDHER RANJIT

IPC: B23K1/00 ,  B23K35/00 ,  C08K3/00 ,  C08K3/04 ,  C08K5/00 ,  C08K7/02 ,  C08L83/04 ,  H01L21/00 ,  H01L23/00

CPC classification number: C08K3/04 ,  B23K1/0016 ,  B23K1/20 ,  B23K35/00 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3602 ,  B23K2201/42 ,  C08K3/013 ,  C08K3/042 ,  C08K5/00 ,  C08K7/02 ,  H01L23/295 ,  H01L23/296 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/1131 ,  H01L2224/11312 ,  H01L2224/1132 ,  H01L2224/1141 ,  H01L2224/11418 ,  H01L2224/11422 ,  H01L2224/1301 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13311 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13386 ,  H01L2224/13387 ,  H01L2224/13393 ,  H01L2224/13439 ,  H01L2224/13444 ,  H01L2224/13447 ,  H01L2224/13486 ,  H01L2224/13487 ,  H01L2224/1349 ,  H01L2224/13499 ,  H01L2224/2731 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/2741 ,  H01L2224/27418 ,  H01L2224/27422 ,  H01L2224/27436 ,  H01L2224/27602 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29386 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29486 ,  H01L2224/29487 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/73204 ,  H01L2224/8184 ,  H01L2224/81856 ,  H01L2224/81862 ,  H01L2224/81874 ,  H01L2224/8321 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2924/12041 ,  H01L2924/3841 ,  C08L63/00 ,  C08L83/04 ,  C08K5/092 ,  C08K5/18 ,  C08K5/49 ,  C08L2205/025 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01006 ,  H01L2924/00012 ,  H01L2924/05341 ,  H01L2924/07001 ,  H01L2924/0715 ,  H01L2924/0675 ,  H01L2924/0665 ,  H01L2924/06 ,  H01L2924/01079 ,  H01L2924/053 ,  H01L2924/01102 ,  H01L2924/01103 ,  H01L2924/01109 ,  H01L2924/01009 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/066 ,  H01L2924/0635 ,  H01L2924/061 ,  H01L2924/05432 ,  H01L2924/04642 ,  H01L2924/05032 ,  H01L2924/05442 ,  H01L2924/0542 ,  H01L2924/0103

Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalised graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminium oxide, zinc oxide, aluminium nitride, boron nitride, silver, nano fibres, carbon fibres, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt.% of the filler based on the total weight of the composition.

Abstract translation: 一种用于电子装配过程的组合物，该组合物包含分散在有机介质中的填料，其中：有机介质包含聚合物; 填料包括石墨烯，官能化石墨烯，氧化石墨烯，多面体低聚倍半硅氧烷，石墨，2D材料，氧化铝，氧化锌，氮化铝，氮化硼，银，纳米纤维，碳纤维，金刚石，碳纳米管中的一种或多种 ，二氧化硅和金属包覆颗粒，并且所述组合物包含基于组合物总重量的0.001至40重量％的填料。

公开(公告)号：SI2739432T1

公开(公告)日：2022-04-29

申请号：SI201231983

申请日：2012-08-02

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： PANDHER RANJIT ,  SINGH BAWA ,  SARKAR SIULI ,  CHEGUDI SUJATHA ,  KUMAR ANIL K N ,  CHATTOPADHYAY KAMANIO ,  LODGE DOMINIC ,  DE AVILA RIBAS MORGANA

IPC: B23K35/00 ,  C22C12/00 ,  C22C13/00

公开(公告)号：PL2739432T3

公开(公告)日：2022-04-11

申请号：PL12756540

申请日：2012-08-02

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： PANDHER RANJIT ,  SINGH BAWA ,  SARKAR SIULI ,  CHEGUDI SUJATHA ,  KUMAR ANIL K N ,  CHATTOPADHYAY KAMANIO ,  LODGE DOMINIC ,  DE AVILA RIBAS MORGANA

IPC: B23K35/26 ,  B23K35/02 ,  C22C12/00 ,  C22C13/02

公开(公告)号：ES2833274T3

公开(公告)日：2021-06-14

申请号：ES11782731

申请日：2011-11-02

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： KHASELEV OSCAR ,  SINGH BAWA ,  MO BIN ,  MARCZI MICHAEL ,  BOUREGHDA MONNIR

IPC: H01B1/02

Abstract: Una película de sinterización para la fijación de componentes en un proceso de ensamblaje de sinterización, la película de sinterización que comprende una capa de una composición que comprende: un polvo metálico que tiene un rango d50 de 0,001 a 10 micrómetros, el polvo metálico que comprende del 30 al 95 % en peso de la composición; un aglutinante que tiene un punto de ablandamiento entre 50 y 170 °C, el aglutinante que comprende de 0,1 a 5 % en peso de la composición; y un solvente en una cantidad suficiente para disolver al menos el aglutinante, la capa de composición que tiene un grosor en seco de 5 a 300 micras, en donde la capa de composición está sobre un sustrato polimérico que comprende un recubrimiento de liberación.

公开(公告)号：SG10201705882UA

公开(公告)日：2017-08-30

申请号：SG10201705882U

申请日：2013-10-09

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： CHOUDHURY PRITHA ,  DE AVILA RIBAS MORGANA ,  MUKHERJEE SUTAPA ,  KUMAR ANIL ,  SARKAR SIULI ,  PANDHER RANJIT ,  BHATKAL RAVI ,  SINGH BAWA

Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities.

公开(公告)号：CA3116600A1

公开(公告)日：2020-04-30

申请号：CA3116600

申请日：2019-10-23

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： RAUT RAHUL ,  CHAKI NIRMALYAKUMAR ,  SINGH BAWA ,  PANDHER RANJIT ,  SARKAR SIULI

IPC: B23K35/26 ,  B23K35/02 ,  B23K35/36 ,  B23K35/362 ,  C22C13/00 ,  C22C13/02

Abstract: A solder alloy comprising: from 40 to 65 wt.% bismuth; from 1 to 10 wt.% indium; at least one of: from 0.1 to 5 wt.% gallium, from 0.1 to 5 wt.% zinc, from 0.1 to 2 w.% copper, from 0.01 to 0.1 wt.% cobalt, from 0.1 to 2 wt.% silver, from 0.005 to 0.05 wt.% titanium, and from 0.01 to 1 wt.% nickel; optionally one or more of: up to 1 wt.% vanadium, up to 1 wt.% rare earth metals, up to 1 wt.% neodymium, up to 1 wt.% chromium, up to 1 wt.% iron, up to 1 wt.% aluminium, up to 1 wt.% phosphorus, up to 1 wt.% gold, up to 1 wt.% tellurium, up to 1 wt.% selenium, up to 1 wt.% calcium, up to 1 wt.% vanadium, up to 1 wt.% molybdenum, up to 1 wt.% platinum, up to 1 wt.% magnesium, up to 1 wt.% silicon, and up to 1 wt.% manganese; and the balance tin together with any unavoidable impurities.

公开(公告)号：MY173832A

公开(公告)日：2020-02-24

申请号：MYPI2015000905

申请日：2013-10-29

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： MUKHERJEE SUTAPA ,  SARKAR SIULI ,  PANDHER RANJIT ,  BHATKAL RAVI ,  SINGH BAWA ,  GHOSAL SHAMIK ,  KHASELEV OSCAR ,  RAUT RAHUL ,  RIBAS MORGANA ,  KUMAR SATHISH ,  CHANDRAN REMYA ,  VISHWANATH PAVAN ,  PACHAMUTHU ASHOK ,  BOUREGHDA MONNIR ,  DESAI NITIN ,  LIFTON ANNA ,  CHAKI NIRMALYA KUMAR

Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent.