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6 records (took 0.022 seconds)

    1.
    发明专利
    未知

    公开(公告)号：DK76580A

    公开(公告)日：1980-08-24

    申请号：DK76580

    申请日：1980-02-22

    Applicant: AMP INC

    Inventor： GRABBE D G ,  PATTERSON R

    IPC: H01L23/50 ,  H01L23/04 ,  H01L23/047 ,  H01L23/48 ,  H01L23/495 ,  H05K

    Abstract: A lead frame and chip carrier housing are disclosed which can be used in packaging integrated circuit chips of a range of sizes and requiring varying numbers of leads in the lead frame. The lead frame comprises a centrally located square support portion having simple leads extending from its side edges and having composite leads extending from its corners. Each of the composite leads comprises a trunk lead and branch leads which extend from the side edges of the trunk lead. A relatively small integrated circuit chip can be used with the lead frame by removing only the support portion, locating the chip adjacent to the opening and connecting the simple leads only to the terminal areas of the chip. The lead frame can be used with larger chips having greater numbers of terminal pads by removing the support portion, removing inner end portions of the simple leads, and removing inner end portions of the composite leads so that some or all of the branch leads become available for establishing electrical connections to the chip. The chip carrier housing comprises an open frame member of insulating material molded onto intermediate portions of all of the leads. The inner ends of the leads are imbedded in a thin web which extends from the molded frame inwardly towards the center of the lead frame. Portions of this web are removed when the central opening is formed in the lead frame for the chip.

    3.
    发明专利
    未知

    公开(公告)号：SE423846B

    公开(公告)日：1982-06-07

    申请号：SE7708156

    申请日：1977-07-13

    Applicant: AMP INC

    Inventor： GRABBE D G

    IPC: H01L21/52 ,  H01L21/60 ,  H01L23/08 ,  H01L23/04 ,  H01L23/057 ,  H01L23/24 ,  H01L23/28 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01L23/10

    Abstract: An assembly line method for fabricating hermetically sealed integrated circuit chips with externally extending terminal leads comprising the steps of securing at least one integrated circuit chip upon a spider assembly; stamping a strip of iterative lead frame assemblies from a strip of flat stock metal; encapsulating each of said lead frame assemblies with plastic in a configuration which leaves a window space in the center thereof or defined elsewhere therein, with the convergent ends of the individual conductive paths of the lead frame extending out of the plastic and into said window space, and the divergent ends of such conductive paths extending out of the plastic and away from the window space; mounting the terminal chip holding spider assembly onto the convergent ends of the conductive paths of the lead frame; inserting a first cap over the window space on one side of the encapsulating plastic; filling the window space with a sealant to completely immerse said spider bearing chip therein and having the properties of being electrically insulative and virtually completely resistant to the passage of moisture therethrough; and inserting a second cap over said window space on the other side of said encapsulating plastic to completely seal said spider bearing chip therebetween in said sealant.

    4.
    发明专利
    未知

    公开(公告)号：SE7708156L

    公开(公告)日：1978-01-31

    申请号：SE7708156

    申请日：1977-07-13

    Applicant: AMP INC

    Inventor： GRABBE D G

    IPC: H01L21/52 ,  H01L21/60 ,  H01L23/08 ,  H01L23/04 ,  H01L23/057 ,  H01L23/24 ,  H01L23/28 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01L23/02 ,  H01L23/10

    Abstract: An assembly line method for fabricating hermetically sealed integrated circuit chips with externally extending terminal leads comprising the steps of securing at least one integrated circuit chip upon a spider assembly; stamping a strip of iterative lead frame assemblies from a strip of flat stock metal; encapsulating each of said lead frame assemblies with plastic in a configuration which leaves a window space in the center thereof or defined elsewhere therein, with the convergent ends of the individual conductive paths of the lead frame extending out of the plastic and into said window space, and the divergent ends of such conductive paths extending out of the plastic and away from the window space; mounting the terminal chip holding spider assembly onto the convergent ends of the conductive paths of the lead frame; inserting a first cap over the window space on one side of the encapsulating plastic; filling the window space with a sealant to completely immerse said spider bearing chip therein and having the properties of being electrically insulative and virtually completely resistant to the passage of moisture therethrough; and inserting a second cap over said window space on the other side of said encapsulating plastic to completely seal said spider bearing chip therebetween in said sealant.

    5.
    发明专利
    未知

    公开(公告)号：SE418784B

    公开(公告)日：1981-06-22

    申请号：SE7714746

    申请日：1977-12-23

    Applicant: AMP INC

    Inventor： GRABBE D G

    IPC: G04G17/02 ,  G04G17/06 ,  G04G99/00 ,  H05K1/18 ,  H05K3/20 ,  H05K3/30 ,  H05K3/32 ,  H05K3/40 ,  H05K7/02 ,  H01R4/48

    Abstract: A method of making electrical devices, and the electrical devices made thereby, comprising the steps of: stamping from a sheet of metal a pattern of conductors configured to connect circuit components together in a relationship which forms a useful product, such as a watch, with the terminals of each of said circuit components being adjacent and connectable to appropriate terminating means formed in said pattern of conductors when said circuit components have predetermined positions adjacent said pattern of conductors; encapsulating said pattern of conductors with plastic having cavities and apertures formed therein, the cavities each having a configuration and a location to receive one of said circuit components therein in said predetermined positions and with said terminating means extending into said cavities to terminate the terminals of said circuit components; forming at least some of said component terminals on the surface of said components in positions to bend over the terminating means when the component is inserted in a cavity to thereby make an electrical connection between the component terminals and the terminating means, and to provide a retaining housing for the components in said cavity. In some instances, the component terminals are wire-like in shape and require the forming of the terminating means in a configuration which can be crimped therearound or, alternatively, require the forming of the terminating means into a plate with a slot therein and into which slot the wire-like terminal can be inserted. Some of the apertures in the plastic encapsulation are positioned to enable the severing of portions of the lead frame conductors which support the lead frame until it is encapsulated and others of the apertures are positioned to enable the severing of various combinations of selected conductors to produce different patterns of interconnections between the circuit components and thereby to produce various electrical devices each capable of performing different functions.

    6.
    发明专利
    未知

    公开(公告)号：SE7714746L

    公开(公告)日：1978-06-28

    申请号：SE7714746

    申请日：1977-12-23

    Applicant: AMP INC

    Inventor： GRABBE D G

    IPC: G04G17/02 ,  G04G99/00 ,  G04G17/06 ,  H05K1/18 ,  H05K3/20 ,  H05K3/30 ,  H05K3/32 ,  H05K3/40 ,  H05K7/02 ,  H01R9/12

    Abstract: A method of making electrical devices, and the electrical devices made thereby, comprising the steps of: stamping from a sheet of metal a pattern of conductors configured to connect circuit components together in a relationship which forms a useful product, such as a watch, with the terminals of each of said circuit components being adjacent and connectable to appropriate terminating means formed in said pattern of conductors when said circuit components have predetermined positions adjacent said pattern of conductors; encapsulating said pattern of conductors with plastic having cavities and apertures formed therein, the cavities each having a configuration and a location to receive one of said circuit components therein in said predetermined positions and with said terminating means extending into said cavities to terminate the terminals of said circuit components; forming at least some of said component terminals on the surface of said components in positions to bend over the terminating means when the component is inserted in a cavity to thereby make an electrical connection between the component terminals and the terminating means, and to provide a retaining housing for the components in said cavity. In some instances, the component terminals are wire-like in shape and require the forming of the terminating means in a configuration which can be crimped therearound or, alternatively, require the forming of the terminating means into a plate with a slot therein and into which slot the wire-like terminal can be inserted. Some of the apertures in the plastic encapsulation are positioned to enable the severing of portions of the lead frame conductors which support the lead frame until it is encapsulated and others of the apertures are positioned to enable the severing of various combinations of selected conductors to produce different patterns of interconnections between the circuit components and thereby to produce various electrical devices each capable of performing different functions.

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