公开(公告)号：WO2022212075A1

公开(公告)日：2022-10-06

申请号：PCT/US2022/020702

申请日：2022-03-17

Applicant: APPLE INC.

Inventor： BALARAM, Haran ,  BOHNEY, Nathan J. ,  WANG, Pengchuan ,  YANG, Jicheng ,  CHEN, Wyeman ,  GOOCH, Scott Lawson ,  LINKE, Kevin Robert ,  CHANG, Alvin Thomas

IPC: H01M10/42 ,  H01M50/569 ,  H01M10/425

Abstract: Battery systems according to embodiments of the present technology may include a battery. The battery may include a first electrode terminal and a second electrode terminal accessible along a first surface of the battery. The systems may include a module electrically coupled with the battery. The module may include a circuit board characterized by a first surface and a second surface opposite the first surface. The module may include a mold extending from the first surface of the circuit board toward the battery. The module may include a first conductive tab electrically coupling the module with the first electrode terminal. The module may include a second conductive tab electrically coupling the module with the second electrode terminal. The second conductive tab may extend across the mold substantially parallel to the first surface of the circuit board.

公开(公告)号：WO2014051848A1

公开(公告)日：2014-04-03

申请号：PCT/US2013/052389

申请日：2013-07-26

Applicant: APPLE INC.

Inventor： LI, Xingqun ,  RIBAS, Carlos ,  PYPER, Dennis, R. ,  FOSTER, James, H. ,  FISHER, Joseph, R., Jr. ,  MULLINS, Scott, P. ,  MAYO, Sean, A. ,  CHEN, Wyeman

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/46 ,  H05K3/28

CPC classification number: H05K1/181 ,  H01L2224/16235 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19103 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/11 ,  H05K1/115 ,  H05K1/183 ,  H05K1/185 ,  H05K3/284 ,  H05K3/303 ,  H05K3/4614 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10378 ,  H05K2201/10454 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10537 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2203/1316 ,  H05K2203/1327 ,  Y02P70/611 ,  Y10T29/49146

Abstract: Electronic devices may contain electrical systems in which electrical components are mounted on a substrate such as a printed circuit board. The electrical components may include surface mount technology components. Multiple surface mount technology components may be stacked on top of each other and beside each other to form an electrical component that minimizes the amount of area that is consumed on a printed circuit board. Noise suppression circuits and other circuits may be implemented using stacked surface mount technology components. Surface mount technology components placed on the printed circuit board may be pushed together and subsequently injection molded to form packed component groups. An integrated circuit may be mounted to the printed circuit board via an interposer and may cover components mounted to the printed circuit board. An integrated circuit may be mounted over a recessed portion of the printed circuit board on which components are mounted.

Abstract translation: 电子设备可以包含其中电气部件安装在诸如印刷电路板的基板上的电气系统。 电气部件可以包括表面贴装技术部件。 多个表面贴装技术部件可以堆叠在彼此的顶部并且彼此相邻以形成使得在印刷电路板上消耗的面积的量最小化的电气部件。 噪声抑制电路和其他电路可以使用堆叠的表面贴装技术部件来实现。 放置在印刷电路板上的表面贴装技术部件可以一起推入并随后注射成型以形成包装的部件组。 集成电路可以经由插入器安装到印刷电路板，并且可以覆盖安装到印刷电路板的部件。 集成电路可以安装在印刷电路板的安装组件的凹部上。