Abstract:
Disclosed herein is a bulk metallic glasses (BMG) comprising 0.0001 wt% to 0.7 wt% of Be, 0.0001 wt% to 0.2 wt% of Be, or 0.06 wt% to 0.08 wt% of Be. Be may have the effect of reducing a liquidus temperature of the BMG relative to melting temperatures of individual alloying elements of the BMG.
Abstract:
The disclosure is directed to aluminum alloys made from recycled components. The alloys have copper (Cu) from 0.051 to 0.10 wt%, chromium (Cr) from 0.01 to 0.10 wt%, zinc (Zn) from 0.02 to 0.20 wt%, manganese (Mn) from 0.03 to 0.10 wt%, iron (Fe) in an amount of at least 0.10 wt%, silicon (Si) in an amount of at least 0.35 wt%, magnesium (Mg) in amount of at least 0.45 wt%, and the remaining wt% being Al and incidental impurities. In other aspects, the disclosure is directed to aluminum alloys having copper (Cu) from 0.010 to 0.050 wt%, chromium (Cr) from 0.01 to 0.10 wt%, zinc (Zn) from 0.01 to 0.20 wt%, manganese (Mn) from 0.03 to 0.10 wt%, iron (Fe) in an amount of at least 0.10 wt%, silicon (Si) in an amount of at least 0.35 wt%, magnesium (Mg) in amount of at least 0.45 wt%, and the remaining wt% being Al and incidental impurities. The b* color of the alloys ranges from -2 to 2, and the L* color ranges from 70 to 100.
Abstract:
The disclosure provides an aluminum alloy may include iron (Fe) of at least 0.10 wt%, silicon (Si) of at least 0.35 wt%, and magnesium (Mg) of at least 0.45 wt%, manganese (Mn) in amount of at least 0.005 wt%, and additional elements, the remaining wt% being Al and incidental impurities.
Abstract:
This application relates to an enclosure for a portable electronic device is described. The enclosure can include metal bands included along the enclosure and a support structure. The support structure can include a thermally conductive core that is capable of conducting thermal energy generated by the operational components and rails that are bound between the metal bands and the thermally conductive core, where the rails are characterized as having a rate of thermal conductivity that is less than a rate of thermal conductivity of the thermally conductive core so that the thermal energy generated by the operational component is directed away from the operational component and away from the metal bands.
Abstract:
This application relates to an enclosure for a portable electronic device is described. The enclosure can include metal bands included along the enclosure and a support structure. The support structure can include a thermally conductive core that is capable of conducting thermal energy generated by the operational components and rails that are bound between the metal bands and the thermally conductive core, where the rails are characterized as having a rate of thermal conductivity that is less than a rate of thermal conductivity of the thermally conductive core so that the thermal energy generated by the operational component is directed away from the operational component and away from the metal bands.
Abstract:
The disclosure provides an aluminum alloy may include iron (Fe) of at least 0.10 wt%, silicon (Si) of at least 0.35 wt%, and magnesium (Mg) of at least 0.45 wt%, manganese (Mn) in amount of at least 0.005 wt%, and additional elements, the remaining wt% being Al and incidental impurities.