公开(公告)号：US12204252B2

公开(公告)日：2025-01-21

申请号：US18212334

申请日：2023-06-21

Applicant: ASML NETHERLANDS B.V.

Inventor： Arnaud Hubaux ,  Johan Franciscus Maria Beckers ,  Dylan John David Davies ,  Johan Gertrudis Cornelis Kunnen ,  Willem Richard Pongers ,  Ajinkya Ravindra Daware ,  Chung-Hsun Li ,  Georgios Tsirogiannis ,  Hendrik Cornelis Anton Borger ,  Frederik Eduard De Jong ,  Juan Manuel Gonzalez Huesca ,  Andriy Hlod ,  Maxim Pisarenco

IPC: G03F1/70 ,  G03F7/00 ,  G06F30/392

Abstract: A method for categorizing a substrate subject to a semiconductor manufacturing process including multiple operations, the method including: obtaining values of functional indicators derived from data generated during one or more of the multiple operations on the substrate, the functional indicators characterizing at least one operation; applying a decision model including one or more threshold values to the values of the functional indicators to obtain one or more categorical indicators; and assigning a category to the substrate based on the one or more categorical indicators.

公开(公告)号：US11994848B2

公开(公告)日：2024-05-28

申请号：US17601503

申请日：2020-03-12

Applicant: ASML NETHERLANDS B.V.

Inventor： Johannes Onvlee ,  Arnaud Hubaux

IPC: G05B19/418

CPC classification number: G05B19/41885 ,  G05B2219/32335 ,  G05B2219/45031

Abstract: A method for configuring a semiconductor manufacturing process, the method including: providing an initial prediction model including a plurality of model parameters to one or more remote locations; receiving at least one updated model parameter from the one or more remote locations, the at least one model parameter is updated by training the initial prediction model with local data at the one or more remote locations; determining aggregated model parameters based on the at least one updated model parameter received from the one or more remote locations; and adjusting the initial prediction model based on the aggregated model parameters, the adjusted prediction model being operable to configure the semiconductor manufacturing process.

公开(公告)号：US11687007B2

公开(公告)日：2023-06-27

申请号：US17423325

申请日：2020-01-09

Applicant: ASML NETHERLANDS B.V.

Inventor： Arnaud Hubaux ,  Johan Franciscus Maria Beckers ,  Dylan John David Davies ,  Johan Gertrudis Cornelis Kunnen ,  Willem Richard Pongers ,  Ajinkya Ravindra Daware ,  Chung-Hsun Li ,  Georgios Tsirogiannis ,  Hendrik Cornelis Anton Borger ,  Frederik Eduard De Jong ,  Juan Manuel Gonzalez Huesca ,  Andriy Hlod ,  Maxim Pisarenco

IPC: G03F1/70 ,  G03F7/30 ,  G03F7/00 ,  G06F30/392

CPC classification number: G03F7/70508 ,  G03F1/70 ,  G03F7/70616 ,  G06F30/392 ,  G05B2219/45028 ,  G05B2219/45031

Abstract: A method for categorizing a substrate subject to a semiconductor manufacturing process including multiple operations, the method including: obtaining values of functional indicators derived from data generated during one or more of the multiple operations on the substrate, the functional indicators characterizing at least one operation; applying a decision model including one or more threshold values to the values of the functional indicators to obtain one or more categorical indicators; and assigning a category to the substrate based on the one or more categorical indicators.