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    METHODS & APPARATUS FOR CONTROLLING AN INDUSTRIAL PROCESS
    1.
    发明申请
    METHODS & APPARATUS FOR CONTROLLING AN INDUSTRIAL PROCESS 审中-公开
    用于控制工业过程的方法和设备

    公开(公告)号：WO2018072962A1

    公开(公告)日：2018-04-26

    申请号：PCT/EP2017/073868

    申请日：2017-09-21

    Applicant: ASML NETHERLANDS B.V.

    Inventor： KOU, Weitian ,  YPMA, Alexander ,  HAUPTMANN, Marc ,  KUPERS, Michiel ,  HAN, Min-Sub

    IPC: G05B19/418

    Abstract: A lithographic process is performed on a plurality of semiconductor wafers (900; 1020). The method includes selecting one or more of the wafers as sample wafers (910-914; 1030-1034). Metrology steps (922; 1042) are performed only on the selected sample wafers. Based on metrology results (924; 046) of the selected sample product units corrections are defined for use in controlling processing of the wafers or future wafers. The selection of sample product units is based at least partly on statistical analysis of object data (902; 1006) measured in relation to the wafers. The same object data or other data can be used for grouping wafers into groups. Selecting of sample wafers can include selecting wafers (910-914; 1030-1034) that are identified by said statistical analysis as most representative of the wafers in their group. The selecting of sample wafers can include elimination of product units (916; 036) that are identified as unrepresentative.

    Abstract translation: 在多个半导体晶片（900; 1020）上执行光刻工艺。 该方法包括选择一个或多个晶片作为样品晶片（910-914; 1030-1034）。 度量步骤（922; 1042）仅在所选样品晶圆上执行。 基于所选择的样品产品单元的计量结果（924; 046），定义校正用于控制晶片或未来晶片的处理。 样本产品单元的选择至少部分基于对晶片测量的对象数据（902; 1006）的统计分析。 可以使用相同的对象数据或其他数据将晶圆分组成组。 选择样本晶片可以包括选择由所述统计分析确定为最具代表性的晶片组的晶片（910-914; 1030-1034）。 选择样品晶片可以包括消除被确定为不具代表性的产品单元（916; 036）。

    METHODS & APPARATUS FOR CONTROLLING AN INDUSTRIAL PROCESS
    3.
    发明公开
    METHODS & APPARATUS FOR CONTROLLING AN INDUSTRIAL PROCESS 审中-公开
    用于控制工业过程的方法和设备

    公开(公告)号：EP3312693A1

    公开(公告)日：2018-04-25

    申请号：EP16195049.8

    申请日：2016-10-21

    Applicant: ASML Netherlands B.V.

    Inventor： KOU, Weitian ,  YPMA, Alexander ,  HAUPTMANN, Marc ,  KUPERS, Michiel ,  HAN, Min-Sub

    IPC: G05B19/418

    CPC classification number: G05B19/41875 ,  G05B2219/2602 ,  G05B2219/32191 ,  G05B2219/32206 ,  G05B2219/37224 ,  G05B2219/42001 ,  G05B2219/45031 ,  Y02P90/22

    Abstract: A lithographic process is performed on a plurality of semiconductor wafers (900; 1020). The method includes selecting one or more of the wafers as sample wafers (910-914; 1030-1034). Metrology steps (922; 1042) are performed only on the selected sample wafers. Based on metrology results (924; 1046) of the selected sample product units corrections are defined for use in controlling processing of the wafers or future wafers. The selection of sample product units is based at least partly on statistical analysis of object data (902; 1006) measured in relation to the wafers. The same object data or other data can be used for grouping wafers into groups. Selecting of sample wafers can include selecting wafers (910-914; 1030-1034) that are identified by said statistical analysis as most representative of the wafers in their group. The selecting of sample wafers can include elimination of product units (916; 1036) that are identified as unrepresentative.

    Abstract translation: 在多个半导体晶片（900; 1020）上执行光刻工艺。 该方法包括选择一个或多个晶片作为样品晶片（910-914; 1030-1034）。 度量步骤（922; 1042）仅在所选样品晶圆上执行。 基于所选择的样本产品单元的计量结果（924; 1046），定义校正用于控制晶片或未来晶片的处理。 样本产品单元的选择至少部分基于对晶片测量的对象数据（902; 1006）的统计分析。 可以使用相同的对象数据或其他数据将晶圆分组成组。 选择样本晶片可以包括选择由所述统计分析确定为最具代表性的晶片组的晶片（910-914; 1030-1034）。 选择样品晶片可以包括消除被识别为不具代表性的产品单元（916; 1036）。

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