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1.
公开(公告)号:WO2020234028A1
公开(公告)日:2020-11-26
申请号:PCT/EP2020/063077
申请日:2020-05-11
Applicant: ASML NETHERLANDS B.V.
Inventor: SMORENBERG, Pieter, Gerardus, Jacobus , SAPUTRA, Putra , ELBATTAY, Khalid , DERWIN, Paul , WERKMAN, Roy , JENSEN, Erik , YU, Hyun-Woo , SARMA, Gautam
IPC: G03F7/20
Abstract: The invention provides a method for determining a sampling scheme, which method comprises: - obtaining a first fingerprint model relating to a first spatial distribution of a performance parameter over a first portion of a semiconductor substrate and a second fingerprint model relating to a second spatial distribution of said performance parameter over a second portion of the semiconductor substrate; and - determining a sampling point corresponding to a measuring location on the semiconductor substrate for generating measurement data based on an expected reduction of a first uncertainty metric associated with evaluation of the first fingerprint model over the first portion and an expected reduction of a second uncertainty metric associated with evaluation of the second fingerprint model over the second portion.
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公开(公告)号:WO2018153711A1
公开(公告)日:2018-08-30
申请号:PCT/EP2018/053412
申请日:2018-02-12
Applicant: ASML NETHERLANDS B.V.
Inventor: TEL, Wim, Tjibbo , SEGERS, Bart, Peter, Bert , MOS, Everhardus, Cornelis , SCHMITT-WEAVER, Emil, Peter , ZHANG, Yichen , LIU, Xing, Lan , JUNGBLUT, Reiner, Maria , YU, Hyun-Woo , VAN RHEE, Petrus, Gerardus , KILITZIRAKI, Maria
Abstract: A method, involving determining a first distribution of a first parameter associated with an error or residual in performing a device manufacturing process; determining a second distribution of a second parameter associated with an error or residual in performing the device manufacturing process; and determining a distribution of a parameter of interest associated with the device manufacturing process using a function operating on the first and second distributions. The function may comprise a correlation.
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公开(公告)号:WO2018197143A1
公开(公告)日:2018-11-01
申请号:PCT/EP2018/057926
申请日:2018-03-28
Applicant: ASML NETHERLANDS B.V.
Inventor: HAUPTMANN, Marc , MOS, Everhardus, Cornelis , KOU, Weitian , YPMA, Alexander , KUPERS, Michiel , YU, Hyun-Woo , HAN, Min-Sub
IPC: G03F7/20 , G05B19/418
CPC classification number: G03F7/70633 , G03F7/70525 , G05B19/41875
Abstract: A lithographic process is performed on a set of semiconductor substrates consisting of a plurality of substrates. As part of the process, the set of substrates is partitioned into a number of subsets. The partitioning may be based on a set of characteristics associated with a first layer on the substrates. A fingerprint of a performance parameter is then determined for at least one substrate of the set of substrates. Under some circumstances, the fingerprint is determined for one substrate of each subset of substrates. The fingerprint is associated with at least the first layer. A correction for the performance parameter associated with an application of a subsequent layer is then derived, the derivation being based on the determined fingerprint and the partitioning of the set of substrates.
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4.
公开(公告)号:EP4235306A2
公开(公告)日:2023-08-30
申请号:EP23173939.2
申请日:2020-05-11
Applicant: ASML Netherlands B.V.
Inventor: SMORENBERG, Pieter, Gerardus, Jacobus , SAPUTRA, Putra , ELBATTAY, Khalid , DERWIN, Paul , WERKMAN, Roy , JENSEN, Erik , YU, Hyun-Woo , SARMA, Gautam
IPC: G03F7/20
Abstract: The invention provides a method of obtaining a fingerprint model for modelling a spatial distribution of a performance parameter over a portion of a substrate, the method comprising: defining an initial fingerprint model related to the spatial distribution of the performance parameter over the portion as a parameterized combination of basis functions; determining parameter values for the parameterized combination of basis functions based on pre-knowledge, and determining the fingerprint model for modelling the spatial distribution of the performance parameter over the portion of the substrate, based on a measurement set representing the performance parameter over the portion of a set of one or more semiconductor substrates and the initial fingerprint model, whereby a ratio of at least two parameter values of the basis functions as determined in the initial fingerprint model is kept constant or at least part of the shape of the initial fingerprint model is maintained in the fingerprint model.
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5.
公开(公告)号:EP4235306A3
公开(公告)日:2023-09-20
申请号:EP23173939.2
申请日:2020-05-11
Applicant: ASML Netherlands B.V.
Inventor: SMORENBERG, Pieter, Gerardus, Jacobus , SAPUTRA, Putra , ELBATTAY, Khalid , DERWIN, Paul , WERKMAN, Roy , JENSEN, Erik , YU, Hyun-Woo , SARMA, Gautam
Abstract: The invention provides a method of obtaining a fingerprint model for modelling a spatial distribution of a performance parameter over a portion of a substrate, the method comprising: defining an initial fingerprint model related to the spatial distribution of the performance parameter over the portion as a parameterized combination of basis functions; determining parameter values for the parameterized combination of basis functions based on pre-knowledge, and determining the fingerprint model for modelling the spatial distribution of the performance parameter over the portion of the substrate, based on a measurement set representing the performance parameter over the portion of a set of one or more semiconductor substrates and the initial fingerprint model, whereby a ratio of at least two parameter values of the basis functions as determined in the initial fingerprint model is kept constant or at least part of the shape of the initial fingerprint model is maintained in the fingerprint model.
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6.
公开(公告)号:EP3973358A1
公开(公告)日:2022-03-30
申请号:EP20725523.3
申请日:2020-05-11
Applicant: ASML Netherlands B.V.
Inventor: SMORENBERG, Pieter, Gerardus, Jacobus , SAPUTRA, Putra , ELBATTAY, Khalid , DERWIN, Paul , WERKMAN, Roy , JENSEN, Erik , YU, Hyun-Woo , SARMA, Gautam
IPC: G03F7/20
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公开(公告)号:EP3396458A1
公开(公告)日:2018-10-31
申请号:EP17168801.3
申请日:2017-04-28
Applicant: ASML Netherlands B.V.
Inventor: HAUPTMANN, Marc , MOS, Everhardus, Cornelis , KOU, Weitian , YPMA, Alexander , KUPERS, Michiel , YU, Hyun-Woo , HAN, Min-Sub
IPC: G03F7/20 , G05B19/418
CPC classification number: G03F7/70633 , G03F7/70525 , G05B19/41875
Abstract: A lithographic process is performed on a set of semiconductor substrates consisting of a plurality of substrates. As part of the process, the set of substrates is partitioned into a number of subsets. The partitioning may be based on a set of characteristics associated with a first layer on the substrates. A fingerprint of a performance parameter is then determined for at least one substrate of the set of substrates. Under some circumstances, the fingerprint is determined for one substrate of each subset of substrates. The fingerprint is associated with at least the first layer. A correction for the performance parameter associated with an application of a subsequent layer is then derived, the derivation being based on the determined fingerprint and the partitioning of the set of substrates.
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