-
公开(公告)号：WO2022189082A1
公开(公告)日：2022-09-15
申请号：PCT/EP2022/052892
申请日：2022-02-07
Applicant: ASML NETHERLANDS B.V.
Inventor： KLEIN KOERKAMP, Niek, Willem , HAUPTMANN, Marc , KEYVANI JANBAHAN, Aliasghar , WANG, Jingchao
Abstract: Methods and apparatus for characterizing a semiconductor manufacturing process performed on a substrate. First data is obtained associated with fingerprint data of the substrate measured after a first process step. Second data is obtained associated with fingerprint data of the substrate measured after a second processing step. A statistical model is used to decompose the first and second data into a first class of fingerprint components mutually correlating between the first and second data and a second class of fingerprint components not mutually correlating between the first and second data. At least one of the first class fingerprint of components and the second class of fingerprint components are used to characterize the semiconductor manufacturing process.
-
Patent Agency Ranking2.发明申请
公开(公告)号：WO2021073921A1
公开(公告)日：2021-04-22
申请号：PCT/EP2020/077807
申请日：2020-10-05
Applicant: ASML NETHERLANDS B.V.
Inventor： KEYVANI JANBAHAN, Aliasghar , SPIERING, Frans, Reinier , WILDENBERG, Jochem, Sebastiaan , MOS, Everhardus, Cornelis
Abstract: Disclosed is a method of fitting measurement data to a model. The method comprises obtaining measurement data relating to a performance parameter for at least a portion of a substrate; and fitting the measurement data to the model by minimizing a complexity metric applied to fitting parameters of the model while not allowing the deviation between the measurement data and the fitted model to exceed a threshold value.
-
公开(公告)号：EP4057069A1
公开(公告)日：2022-09-14
申请号：EP21162049.7
申请日：2021-03-11
Applicant: ASML Netherlands B.V.
Inventor： KLEIN KOERKAMP, Niek Willem , HAUPTMANN, Marc , KEYVANI JANBAHAN, Aliasghar , WANG, Jingchao
Abstract: Methods and apparatus for characterizing a semiconductor manufacturing process performed on a substrate. First data is obtained associated with fingerprint data of the substrate measured after a first process step. Second data is obtained associated with fingerprint data of the substrate measured after a second processing step. The first and second data are decomposed into a first class of fingerprint components mutually correlating between the first and second data and a second class of fingerprint components not mutually correlating between the first and second data. At least one of the first class fingerprint of components and the second class of fingerprint components are used to characterize the semiconductor manufacturing process.
-
公开(公告)号：EP4305494A1
公开(公告)日：2024-01-17
申请号：EP22703410.5
申请日：2022-02-07
Applicant: ASML Netherlands B.V.
-
5.发明公开
公开(公告)号：EP4045976A1
公开(公告)日：2022-08-24
申请号：EP20786520.5
申请日：2020-10-05
Applicant: ASML Netherlands B.V.
-
6.发明公开
公开(公告)号：EP3809203A1
公开(公告)日：2021-04-21
申请号：EP19203752.1
申请日：2019-10-17
Applicant: ASML Netherlands B.V.
Abstract: Disclosed is a method of fitting measurement data to a model. The method comprises obtaining measurement data relating to a performance parameter for at least a portion of a substrate; and fitting the measurement data to the model by minimizing a complexity metric applied to fitting parameters of the model while not allowing the deviation between the measurement data and the fitted model to exceed a threshold value.
-
-
-
-
-
Search Results
6
records
(took 0.02 seconds)
