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1.发明申请
公开(公告)号：WO2021073921A1
公开(公告)日：2021-04-22
申请号：PCT/EP2020/077807
申请日：2020-10-05
Applicant: ASML NETHERLANDS B.V.
Inventor： KEYVANI JANBAHAN, Aliasghar , SPIERING, Frans, Reinier , WILDENBERG, Jochem, Sebastiaan , MOS, Everhardus, Cornelis
Abstract: Disclosed is a method of fitting measurement data to a model. The method comprises obtaining measurement data relating to a performance parameter for at least a portion of a substrate; and fitting the measurement data to the model by minimizing a complexity metric applied to fitting parameters of the model while not allowing the deviation between the measurement data and the fitted model to exceed a threshold value.
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Patent Agency Ranking2.发明申请
公开(公告)号：WO2022214267A1
公开(公告)日：2022-10-13
申请号：PCT/EP2022/056091
申请日：2022-03-09
Applicant: ASML NETHERLANDS B.V.
Inventor： KARA, Dogacan , JENSEN, Erik , WILDENBERG, Jochem, Sebastiaan , DECKERS, David, Frans, Simon , GULER, Sila , ASTUDILLO RENGIFO, Reinaldo, Antonio , YUDHISTIRA, Yasri , HILHORST, Gijs , CAICEDO FERNANDEZ, David, Ricardo , SPIERING, Frans, Reinier , KHO, Sinatra, Canggih , BLOM, Herman, Martin , KIM, Sang Uk , KIM, Hyun-Su
Abstract: A method for determining a substrate model for describing a first measurement dataset and a second measurement dataset relating to a performance parameter. The method comprises obtaining candidate basis functions for a plurality of substrate models. Steps 1 to 4 are performed iteratively for said first measurement dataset and said second measurement dataset until at least one stopping criterion is met so as to determine said substrate model, said steps comprising: 1. selecting a candidate basis function from said candidate basis functions; 2. updating a substrate model by adding the candidate basis function into this substrate model to obtain an updated substrate model; 3. evaluating the updated substrate model based on at least one of said first measurement dataset and said second measurement dataset; and 4. determining whether to include the basis function within the substrate model based on 10 the evaluation.
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公开(公告)号：WO2021043519A1
公开(公告)日：2021-03-11
申请号：PCT/EP2020/071954
申请日：2020-08-05
Applicant: ASML NETHERLANDS B.V.
Inventor： WERKMAN, Roy , LAM, Pui, Leng , MINGHETTI, Blandine, Marie, Andree, Richit , BASTANI, Vahid , HAJIAHMADI, Mohammadreza , VERGAIJ-HUIZER, Lydia, Marianna , SPIERING, Frans, Reinier
IPC: G03F7/20
Abstract: A method and apparatus for determining a performance of a lithographic patterning process, the apparatus or method configured for or comprising: receiving an image of a portion of a substrate, the portion of the substrate comprising a first region comprising a first feature associated with a first lithographic exposure of the substrate at a first time, and a second region comprising a second feature associated with a second lithographic exposure of the substrate at a second time, wherein the first and second regions do not overlap and wherein the first feature and the second feature form a single feature extending along at least part of the first region and at least part of the second region; and determining the performance of the lithographic patterning process based on a feature characteristic of the first and/or second exposed feature associated with a boundary between the first region and the second region.
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公开(公告)号：WO2018177659A1
公开(公告)日：2018-10-04
申请号：PCT/EP2018/054360
申请日：2018-02-22
Applicant: ASML NETHERLANDS B.V.
Inventor： NIJE, Jelle , YPMA, Alexander , GKOROU, Dimitra , TSIROGIANNIS, Georgios , VAN WIJK, Robert Jan , CHEN, Tzu-Chao , SPIERING, Frans, Reinier , ROY, Sarathi , GROUWSTRA, Cédric, Désiré
Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method comprising: (a) receiving object data (210, 230) representing one or more parameters measured (206, 208) across wafers (204, 224) and associated with different stages of processing of the wafers; (b) determining fingerprints (213, 234) of variation of the object data across the wafers, the fingerprints being associated with different respective stages of processing of the wafers. The fingerprints may be determined by decomposing (212, 232) the object data into components using principal component analysis for each different respective stage; (c) analyzing (246) commonality of the fingerprints through the different stages to produce commonality results; and (d) optimizing (250- 258) an apparatus for processing (262) product units based on the commonality results.
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5.发明公开
公开(公告)号：EP4320483A1
公开(公告)日：2024-02-14
申请号：EP22710625.9
申请日：2022-03-09
Applicant: ASML Netherlands B.V.
Inventor： KARA, Dogacan , JENSEN, Erik , WILDENBERG, Jochem, Sebastiaan , DECKERS, David, Frans, Simon , GULER, Sila , ASTUDILLO RENGIFO, Reinaldo, Antonio , YUDHISTIRA, Yasri , HILHORST, Gijs , CAICEDO FERNANDEZ, David, Ricardo , SPIERING, Frans, Reinier , KHO, Sinatra, Canggih , BLOM, Herman, Martin , KIM, Sang Uk , KIM, Hyun-Su
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6.发明公开
公开(公告)号：EP4045976A1
公开(公告)日：2022-08-24
申请号：EP20786520.5
申请日：2020-10-05
Applicant: ASML Netherlands B.V.
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