公开(公告)号：WO2018177659A1

公开(公告)日：2018-10-04

申请号：PCT/EP2018/054360

申请日：2018-02-22

Applicant: ASML NETHERLANDS B.V.

Inventor： NIJE, Jelle ,  YPMA, Alexander ,  GKOROU, Dimitra ,  TSIROGIANNIS, Georgios ,  VAN WIJK, Robert Jan ,  CHEN, Tzu-Chao ,  SPIERING, Frans, Reinier ,  ROY, Sarathi ,  GROUWSTRA, Cédric, Désiré

IPC: G06K9/62 ,  G03F7/20

Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method comprising: (a) receiving object data (210, 230) representing one or more parameters measured (206, 208) across wafers (204, 224) and associated with different stages of processing of the wafers; (b) determining fingerprints (213, 234) of variation of the object data across the wafers, the fingerprints being associated with different respective stages of processing of the wafers. The fingerprints may be determined by decomposing (212, 232) the object data into components using principal component analysis for each different respective stage; (c) analyzing (246) commonality of the fingerprints through the different stages to produce commonality results; and (d) optimizing (250- 258) an apparatus for processing (262) product units based on the commonality results.

公开(公告)号：WO2018192789A1

公开(公告)日：2018-10-25

申请号：PCT/EP2018/058997

申请日：2018-04-09

Applicant: ASML NETHERLANDS B.V.

Inventor： YPMA, Alexander ,  BASTANI, Vahid ,  SONNTAG, Dag ,  NIJE, Jelle ,  CEKLI, Hakki, Ergun ,  TSIROGIANNIS, Georgios ,  VAN WIJK, Robert Jan

IPC: G03F7/20

Abstract: A method of maintaining a set of fingerprints (316) representing variation of one or more process parameters across wafers, has the steps: (a) receiving measurement data (324) of one or more parameters measured on wafers; (b) updating (320) the set of fingerprints based on an expected evolution (322) of the one or more process parameters; and (c) evaluation of the updated set of fingerprints based on decomposition of the received measurement data in terms of the updated set of fingerprints. Each fingerprint may have a stored likelihood of occurrence (316), and the decomposition may involve: estimating, based the received measurement data (324), likelihoods of occurrence of the set of fingerprints in the received measurement data; and updating the stored likelihoods of occurrence based on the estimated likelihoods.

公开(公告)号：EP3392711A1

公开(公告)日：2018-10-24

申请号：EP17167117.5

申请日：2017-04-19

Applicant: ASML Netherlands B.V.

Inventor： YPMA, Alexander ,  BASTANI, Vahid ,  SONNTAG, DAG ,  NIJE, Jelle ,  CEKLI, Hakki, Ergun ,  TSIROGIANNIS, Georgios ,  VAN WIJK, Robert Jan

IPC: G03F7/20

CPC classification number: G03F7/70616 ,  G03F7/70491

Abstract: A method of maintaining a set of fingerprints (316) representing variation of one or more process parameters across wafers, has the steps: (a) receiving measurement data (324) of one or more parameters measured on wafers; (b) updating (320) the set of fingerprints based on an expected evolution (322) of the one or more process parameters; and (c) evaluation of the updated set of fingerprints based on decomposition of the received measurement data in terms of the updated set of fingerprints. Each fingerprint may have a stored likelihood of occurrence (316), and the decomposition may involve: estimating, based the received measurement data (324), likelihoods of occurrence of the set of fingerprints in the received measurement data; and updating the stored likelihoods of occurrence based on the estimated likelihoods.

公开(公告)号：EP3382606A1

公开(公告)日：2018-10-03

申请号：EP17163147.6

申请日：2017-03-27

Applicant: ASML Netherlands B.V.

Inventor： NIJE, Jelle ,  YPMA, Alexander ,  GKOROU, Dimitra ,  TSIROGIANNIS, Georgios ,  VAN WIJK, Robert Jan ,  CHEN, Tzu-Chao ,  SPIERING, Frans Reinier

IPC: G06K9/62 ,  G03F7/20

CPC classification number: G06K9/6247 ,  G03F7/70616 ,  G03F7/70633

Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method comprising: (a) receiving object data 210, 230 representing one or more parameters measured 206, 208 across wafers 204, 224 and associated with different stages of processing of the wafers; (b) determining fingerprints 213, 234 of variation of the object data across the wafers, the fingerprints being associated with different respective stages of processing of the wafers. The fingerprints may be determined by decomposing 212, 232 the object data into components using principal component analysis for each different respective stage; (c) analyzing 246 commonality of the fingerprints through the different stages to produce commonality results; and (d) optimizing 250-258 an apparatus for processing 262 product units based on the commonality results.