公开(公告)号：WO2020114692A1

公开(公告)日：2020-06-11

申请号：PCT/EP2019/080129

申请日：2019-11-04

Applicant: ASML NETHERLANDS B.V.

Inventor： LIN, Chenxi ,  TABERY, Cyrus, Emil ,  CEKLI, Hakki, Ergun ,  HASTINGS, Simon, Philip, Spencer ,  MENCHTCHIKOV, Boris ,  ZOU, Yi ,  CHENG, Yana ,  GENIN, Maxime, Philippe, Frederic ,  CHEN, Tzu-Chao ,  HARUTYUNYAN, Davit ,  ZHANG, Youping

IPC: G03F7/20 ,  H01L21/66

Abstract: Described is a method for determining a root cause affecting yield in a process for manufacturing devices on a substrate, the method comprising; obtaining yield distribution data comprising the distribution of a yield parameter across the substrate or part thereof; obtaining sets of metrology data, each set comprising a spatial variation of a process parameter over the substrate or part thereof corresponding to a different layer of the substrate; comparing the yield distribution data and metrology data based on a similarity metric describing a spatial similarity between the yield distribution data and an individual set out of the sets of the metrology data; and determining a first similar set of metrology data out of the sets of metrology data, being the first set of metrology data in terms of processing order for the corresponding layers, which is determined to be similar to the yield distribution data.

公开(公告)号：WO2020094286A1

公开(公告)日：2020-05-14

申请号：PCT/EP2019/075531

申请日：2019-09-23

Applicant: ASML NETHERLANDS B.V.

Inventor： TEL, Wim, Tjibbo ,  KIERS, Antoine, Gaston, Marie ,  TIMOSHKOV, Vadim Yourievich ,  DILLEN, Hermanus, Adrianus ,  ZHANG, Yichen ,  WANG, Te-Sheng ,  CHEN, Tzu-Chao

IPC: G03F7/20

Abstract: Disclosed herein is a method for determining an image-metric of features on a substrate, the method comprising: obtaining a first image of a plurality of features on a substrate; obtaining one or more further images of a corresponding plurality of features on the substrate, wherein at least one of the one or more further images is of a different layer of the substrate than the first image; generating aligned versions of the first and one or more further images by performing an alignment process on the first and one or more further images; and calculating an image-metric in dependence on a comparison of the features in the aligned version of the first image and the corresponding features in the aligned versions of the one or more further images.

公开(公告)号：WO2018177659A1

公开(公告)日：2018-10-04

申请号：PCT/EP2018/054360

申请日：2018-02-22

Applicant: ASML NETHERLANDS B.V.

Inventor： NIJE, Jelle ,  YPMA, Alexander ,  GKOROU, Dimitra ,  TSIROGIANNIS, Georgios ,  VAN WIJK, Robert Jan ,  CHEN, Tzu-Chao ,  SPIERING, Frans, Reinier ,  ROY, Sarathi ,  GROUWSTRA, Cédric, Désiré

IPC: G06K9/62 ,  G03F7/20

Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method comprising: (a) receiving object data (210, 230) representing one or more parameters measured (206, 208) across wafers (204, 224) and associated with different stages of processing of the wafers; (b) determining fingerprints (213, 234) of variation of the object data across the wafers, the fingerprints being associated with different respective stages of processing of the wafers. The fingerprints may be determined by decomposing (212, 232) the object data into components using principal component analysis for each different respective stage; (c) analyzing (246) commonality of the fingerprints through the different stages to produce commonality results; and (d) optimizing (250- 258) an apparatus for processing (262) product units based on the commonality results.

公开(公告)号：EP3382606A1

公开(公告)日：2018-10-03

申请号：EP17163147.6

申请日：2017-03-27

Applicant: ASML Netherlands B.V.

Inventor： NIJE, Jelle ,  YPMA, Alexander ,  GKOROU, Dimitra ,  TSIROGIANNIS, Georgios ,  VAN WIJK, Robert Jan ,  CHEN, Tzu-Chao ,  SPIERING, Frans Reinier

IPC: G06K9/62 ,  G03F7/20

CPC classification number: G06K9/6247 ,  G03F7/70616 ,  G03F7/70633

Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method comprising: (a) receiving object data 210, 230 representing one or more parameters measured 206, 208 across wafers 204, 224 and associated with different stages of processing of the wafers; (b) determining fingerprints 213, 234 of variation of the object data across the wafers, the fingerprints being associated with different respective stages of processing of the wafers. The fingerprints may be determined by decomposing 212, 232 the object data into components using principal component analysis for each different respective stage; (c) analyzing 246 commonality of the fingerprints through the different stages to produce commonality results; and (d) optimizing 250-258 an apparatus for processing 262 product units based on the commonality results.

公开(公告)号：EP3877812A1

公开(公告)日：2021-09-15

申请号：EP19770103.0

申请日：2019-09-23

Applicant: ASML Netherlands B.V.

Inventor： TEL, Wim, Tjibbo ,  KIERS, Antoine, Gaston, Marie ,  TIMOSHKOV, Vadim Yourievich ,  DILLEN, Hermanus, Adrianus ,  ZHANG, Yichen ,  WANG, Te-Sheng ,  CHEN, Tzu-Chao

IPC: G03F7/20

公开(公告)号：EP4449483A1

公开(公告)日：2024-10-23

申请号：EP22818066.7

申请日：2022-11-18

Applicant: ASML Netherlands B.V.

Inventor： CHEN, Tzu-Chao ,  WANG, Te-Sheng

IPC: H01L21/66 ,  G03F1/86 ,  G03F7/20 ,  G06T7/00 ,  H01J37/22

公开(公告)号：EP3891559A1

公开(公告)日：2021-10-13

申请号：EP19798274.7

申请日：2019-11-04

Applicant: ASML Netherlands B.V.

Inventor： LIN, Chenxi ,  TABERY, Cyrus Emil ,  CEKLI, Hakki Ergun ,  HASTINGS, Simon Philip Spencer ,  MENCHTCHIKOV, Boris ,  ZOU, Yi ,  CHENG, Yana ,  GENIN, Maxime Philippe Frederic ,  CHEN, Tzu-Chao ,  HARUTYUNYAN, Davit ,  ZHANG, Youping

IPC: G03F7/20 ,  H01L21/66