CONFIGURATION OF AN IMPUTER MODEL
    1.
    发明申请

    公开(公告)号:WO2021213746A1

    公开(公告)日:2021-10-28

    申请号:PCT/EP2021/057211

    申请日:2021-03-22

    Abstract: Apparatus and methods of configuring an imputer model for imputing a second parameter. The method comprises inputting a first data set comprising values of a first parameter to the imputer model, and evaluating the imputer model to obtain a second data set comprising imputed values of the second parameter. The method further comprises obtaining a third data set comprising measured values of a third parameter, wherein the third parameter is correlated to the second parameter; obtaining a prediction model configured to infer values of the third parameter based on inputting values of the second parameter; inputting the second data set to the prediction model, and evaluating the prediction model to obtain inferred values of the third parameter; and configuring the imputer model based on a comparison of the inferred values and the measured values of the third parameter.

    MAINTAINING A SET OF PROCESS FINGERPRINTS
    2.
    发明申请

    公开(公告)号:WO2018192789A1

    公开(公告)日:2018-10-25

    申请号:PCT/EP2018/058997

    申请日:2018-04-09

    Abstract: A method of maintaining a set of fingerprints (316) representing variation of one or more process parameters across wafers, has the steps: (a) receiving measurement data (324) of one or more parameters measured on wafers; (b) updating (320) the set of fingerprints based on an expected evolution (322) of the one or more process parameters; and (c) evaluation of the updated set of fingerprints based on decomposition of the received measurement data in terms of the updated set of fingerprints. Each fingerprint may have a stored likelihood of occurrence (316), and the decomposition may involve: estimating, based the received measurement data (324), likelihoods of occurrence of the set of fingerprints in the received measurement data; and updating the stored likelihoods of occurrence based on the estimated likelihoods.

    A METHOD OF MONITORING A LITHOGRAPHIC PROCESS AND ASSOCIATED APPARATUSES

    公开(公告)号:WO2023036526A1

    公开(公告)日:2023-03-16

    申请号:PCT/EP2022/071985

    申请日:2022-08-04

    Abstract: Disclosed is a computer implemented method of determining a placement metric relating to placement of one or more features on a substrate in a lithographic process. The method comprises obtaining setup data comprising placement error contributor data relating to a plurality of placement error contributor parameters and yield data representative of yield and defining a statistical model for predicting a yield metric, the statistical model being based on a placement metric, the placement metric being a function of said placement error contributor parameters, and associated model coefficients. The model coefficients are fitted based on said setup data; and the placement metric determined from said fitted model coefficients.

    METHOD AND APPARATUS FOR DETERMINING FEATURE CONTRIBUTION TO PERFORMANCE

    公开(公告)号:WO2021001114A1

    公开(公告)日:2021-01-07

    申请号:PCT/EP2020/065619

    申请日:2020-06-05

    Abstract: A method of determining a contribution of a process feature to the performance of a process of patterning substrates. The method may comprise obtaining a first model trained on first process data and first performance data. One or more substrates may be identified based on a quality of prediction of the first model when applied to process data associated with the one or more substrates. A second model may be trained on second process data and second performance data associated with the identified one or more substrates. The second model may be used to determine the contribution of a process feature of the second process data to the second performance data associated with the one or more substrates.

    METHOD TO LABEL SUBSTRATES BASED ON PROCESS PARAMETERS

    公开(公告)号:WO2019149562A1

    公开(公告)日:2019-08-08

    申请号:PCT/EP2019/051424

    申请日:2019-01-22

    Abstract: Substrates to be processed (402) are partitioned based on pre-processing data (404) that is associated with substrates before a process step. The data is partitioned using a partition rule (410, 412, 414) and the substrates are partitioned into subsets (G1-G4) in accordance with subsets of the data obtained by the partitioning. Corrections (COR1-COR4) are applied, specific to each subset. The partition rule is obtained (Fig 5) using decision tree analysis on a training set of substrates (502). The decision tree analysis uses pre-processing data (256, 260) associated with the training substrates before they were processed, and post-processing data (262) associated with the training substrates after being subject to the process step. The partition rule (506) that defines the decision tree is selected from a plurality of partition rules (512) based on a characteristic of subsets of the post-processing data. The associated corrections (508) are obtained implicitly at the same time.

    METHOD AND APPARATUS FOR LITHOGRAPHIC PROCESS PERFORMANCE DETERMINATION

    公开(公告)号:WO2021043519A1

    公开(公告)日:2021-03-11

    申请号:PCT/EP2020/071954

    申请日:2020-08-05

    Abstract: A method and apparatus for determining a performance of a lithographic patterning process, the apparatus or method configured for or comprising: receiving an image of a portion of a substrate, the portion of the substrate comprising a first region comprising a first feature associated with a first lithographic exposure of the substrate at a first time, and a second region comprising a second feature associated with a second lithographic exposure of the substrate at a second time, wherein the first and second regions do not overlap and wherein the first feature and the second feature form a single feature extending along at least part of the first region and at least part of the second region; and determining the performance of the lithographic patterning process based on a feature characteristic of the first and/or second exposed feature associated with a boundary between the first region and the second region.

Patent Agency Ranking