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公开(公告)号:WO2021213746A1
公开(公告)日:2021-10-28
申请号:PCT/EP2021/057211
申请日:2021-03-22
Applicant: ASML NETHERLANDS B.V.
Inventor: SAHRAEIAN, Reza , BASTANI, Vahid , GKOROU, Dimitra , DOS SANTOS GUZELLA, Thiago
Abstract: Apparatus and methods of configuring an imputer model for imputing a second parameter. The method comprises inputting a first data set comprising values of a first parameter to the imputer model, and evaluating the imputer model to obtain a second data set comprising imputed values of the second parameter. The method further comprises obtaining a third data set comprising measured values of a third parameter, wherein the third parameter is correlated to the second parameter; obtaining a prediction model configured to infer values of the third parameter based on inputting values of the second parameter; inputting the second data set to the prediction model, and evaluating the prediction model to obtain inferred values of the third parameter; and configuring the imputer model based on a comparison of the inferred values and the measured values of the third parameter.
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公开(公告)号:WO2018192789A1
公开(公告)日:2018-10-25
申请号:PCT/EP2018/058997
申请日:2018-04-09
Applicant: ASML NETHERLANDS B.V.
Inventor: YPMA, Alexander , BASTANI, Vahid , SONNTAG, Dag , NIJE, Jelle , CEKLI, Hakki, Ergun , TSIROGIANNIS, Georgios , VAN WIJK, Robert Jan
IPC: G03F7/20
Abstract: A method of maintaining a set of fingerprints (316) representing variation of one or more process parameters across wafers, has the steps: (a) receiving measurement data (324) of one or more parameters measured on wafers; (b) updating (320) the set of fingerprints based on an expected evolution (322) of the one or more process parameters; and (c) evaluation of the updated set of fingerprints based on decomposition of the received measurement data in terms of the updated set of fingerprints. Each fingerprint may have a stored likelihood of occurrence (316), and the decomposition may involve: estimating, based the received measurement data (324), likelihoods of occurrence of the set of fingerprints in the received measurement data; and updating the stored likelihoods of occurrence based on the estimated likelihoods.
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公开(公告)号:WO2023036526A1
公开(公告)日:2023-03-16
申请号:PCT/EP2022/071985
申请日:2022-08-04
Applicant: ASML NETHERLANDS B.V.
Inventor: BASTANI, Vahid , ZHANG, Yichen , DE ATHAYDE COSTA E SILVA, Marsil , DILLEN, Hermanus, Adrianus , VAN WIJK, Robert Jan
IPC: G03F7/20
Abstract: Disclosed is a computer implemented method of determining a placement metric relating to placement of one or more features on a substrate in a lithographic process. The method comprises obtaining setup data comprising placement error contributor data relating to a plurality of placement error contributor parameters and yield data representative of yield and defining a statistical model for predicting a yield metric, the statistical model being based on a placement metric, the placement metric being a function of said placement error contributor parameters, and associated model coefficients. The model coefficients are fitted based on said setup data; and the placement metric determined from said fitted model coefficients.
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公开(公告)号:WO2022012873A1
公开(公告)日:2022-01-20
申请号:PCT/EP2021/066813
申请日:2021-06-21
Applicant: ASML NETHERLANDS B.V.
Inventor: GKOROU, Dimitra , BASTANI, Vahid , SAHRAEIAN, Reza , TABERY, Cyrus, Emil
IPC: H01L21/66 , G03F7/20 , G05B19/418 , G05B23/02 , G03F7/70491 , G03F7/705 , G05B2219/45031 , G05B23/024 , G05B23/0243 , H01L21/67271 , H01L22/12 , H01L22/14 , H01L22/20
Abstract: Methods and apparatus for classifying semiconductor wafers. The method comprises: sorting a set of semiconductor wafers, using a model, into a plurality of sub-sets based on parameter data corresponding to one or more parameters of the set of semiconductor wafers, wherein the parameter data for semiconductor wafers in a sub-set include one or more common characteristics; identifying one or more semiconductor wafers within a sub-set based on a probability of the one or more semiconductor wafers being correctly allocated to the sub-set; comparing the parameter data of the one or more identified semiconductor wafers to reference parameter data; and reconfiguring the model based on the comparison. The comparison is undertaken by a human to provide constraints for the model. The apparatus is configured to undertake the method.
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公开(公告)号:WO2022179773A1
公开(公告)日:2022-09-01
申请号:PCT/EP2022/051299
申请日:2022-01-21
Applicant: ASML NETHERLANDS B.V.
Inventor: DOS SANTOS GUZELLA, Thiago , ISHIBASHI, Masashi , SANNO, Noriaki , BASTANI, Vahid , SAHRAEIAN, Reza , SAPUTRA, Putra
IPC: G01N21/956 , G03F7/20 , G05B19/418 , G06N20/00 , H01L21/66
Abstract: Described is a method for determining a spatially varying process offset for a lithographic process, the spatially varying process offset (MTD) varying over a substrate subject to the lithographic process to form one or more structures thereon. The method comprises obtaining a trained model (MOD), having been trained to predict first metrology data based on second metrology data, wherein the first metrology data (OV) is spatially varying metrology data which relates to a first type of measurement of said structures being a measure of yield and said second metrology data (PB) is spatially varying metrology data which relates to a second type of measurement of said structures and correlates with said first metrology data; and using said model to obtain said spatially varying process offset (MTD).
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公开(公告)号:WO2021001114A1
公开(公告)日:2021-01-07
申请号:PCT/EP2020/065619
申请日:2020-06-05
Applicant: ASML NETHERLANDS B.V.
Inventor: BASTANI, Vahid , SONNTAG, Dag , SAHRAEIAN, Reza , GKOROU, Dimitra
IPC: G03F7/20 , G05B19/418 , H01L21/66
Abstract: A method of determining a contribution of a process feature to the performance of a process of patterning substrates. The method may comprise obtaining a first model trained on first process data and first performance data. One or more substrates may be identified based on a quality of prediction of the first model when applied to process data associated with the one or more substrates. A second model may be trained on second process data and second performance data associated with the identified one or more substrates. The second model may be used to determine the contribution of a process feature of the second process data to the second performance data associated with the one or more substrates.
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公开(公告)号:WO2019149562A1
公开(公告)日:2019-08-08
申请号:PCT/EP2019/051424
申请日:2019-01-22
Applicant: ASML NETHERLANDS B.V.
Inventor: BASTANI, Vahid , YPMA, Alexander , SONNTAG, Dag , MOS, Everhardus, Cornelis , CEKLI, Hakki, Ergun , LIN, Chenxi
Abstract: Substrates to be processed (402) are partitioned based on pre-processing data (404) that is associated with substrates before a process step. The data is partitioned using a partition rule (410, 412, 414) and the substrates are partitioned into subsets (G1-G4) in accordance with subsets of the data obtained by the partitioning. Corrections (COR1-COR4) are applied, specific to each subset. The partition rule is obtained (Fig 5) using decision tree analysis on a training set of substrates (502). The decision tree analysis uses pre-processing data (256, 260) associated with the training substrates before they were processed, and post-processing data (262) associated with the training substrates after being subject to the process step. The partition rule (506) that defines the decision tree is selected from a plurality of partition rules (512) based on a characteristic of subsets of the post-processing data. The associated corrections (508) are obtained implicitly at the same time.
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公开(公告)号:WO2023072526A1
公开(公告)日:2023-05-04
申请号:PCT/EP2022/077282
申请日:2022-09-30
Applicant: ASML NETHERLANDS B.V.
Inventor: BASTANI, Vahid , KNOPS, Raoul, Maarten, Simon , THEEUWES, Thomas , URBANCZYK, Adam, Jan , WILDENBERG, Jochem, Sebastiaan , VAN WIJK, Robert Jan
IPC: G03F7/20
Abstract: 2021P00202WO 19 Confidential ABSTRACT Disclosed is a method of determining a performance parameter distribution and/or associated quantile function. The method comprises obtaining a quantile function prediction model operable to predict a quantile value for a substrate position and given quantile probability such that the predicted quantile values vary monotonically as a function of quantile probability and using the trained quantile 5 function prediction model to predict quantile values for a plurality of different quantile probabilities for one or more locations on the substrate.
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公开(公告)号:WO2022033793A1
公开(公告)日:2022-02-17
申请号:PCT/EP2021/069613
申请日:2021-07-14
Applicant: ASML NETHERLANDS B.V.
Inventor: COLLIGNON, Tijmen, Pieter , SMAL, Pavel , TABERY, Cyrus, Emil , DOS SANTOS GUZELLA, Thiago , BASTANI, Vahid
Abstract: Methods and associated apparatus for identifying contamination in a semiconductor fab are disclosed. The methods comprise determining contamination map data for a plurality of semiconductor wafers clamped to a wafer table after being processed in the semiconductor fab. Combined contamination map data is determined based, at least in part, on a combination of the contamination map data of the plurality of semiconductor wafers. The combined contamination map data is combined to reference data. The reference data comprises one or more values for the combined contamination map data that are indicative of contamination in one or more tools in the semiconductor fab.
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公开(公告)号:WO2021043519A1
公开(公告)日:2021-03-11
申请号:PCT/EP2020/071954
申请日:2020-08-05
Applicant: ASML NETHERLANDS B.V.
Inventor: WERKMAN, Roy , LAM, Pui, Leng , MINGHETTI, Blandine, Marie, Andree, Richit , BASTANI, Vahid , HAJIAHMADI, Mohammadreza , VERGAIJ-HUIZER, Lydia, Marianna , SPIERING, Frans, Reinier
IPC: G03F7/20
Abstract: A method and apparatus for determining a performance of a lithographic patterning process, the apparatus or method configured for or comprising: receiving an image of a portion of a substrate, the portion of the substrate comprising a first region comprising a first feature associated with a first lithographic exposure of the substrate at a first time, and a second region comprising a second feature associated with a second lithographic exposure of the substrate at a second time, wherein the first and second regions do not overlap and wherein the first feature and the second feature form a single feature extending along at least part of the first region and at least part of the second region; and determining the performance of the lithographic patterning process based on a feature characteristic of the first and/or second exposed feature associated with a boundary between the first region and the second region.
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