DETERMINING A MARK LAYOUT ACROSS A PATTERNING DEVICE OR SUBSTRATE

    公开(公告)号:WO2020108861A1

    公开(公告)日:2020-06-04

    申请号:PCT/EP2019/078529

    申请日:2019-10-21

    Abstract: A method for determining a layout of mark positions across a patterning device or substrate, the method comprising: a) obtaining (502) a model configured to model data associated with measurements performed on the patterning device or substrate at one or more mark positions; b) obtaining (504) an initial mark layout (506) comprising initial mark positions; c) reducing (508) the initial mark layout by removal of one or more mark positions to obtain a plurality of reduced mark layouts (510), each reduced mark layout obtained by removal of a different mark position from the initial mark layout; d) determining (512) a model uncertainty metric associated with usage of the model for each reduced mark layout out of said plurality of reduced mark layouts; and e) selecting (514) one or more reduced mark layouts (516) based on its associated model uncertainty metric.

    METHOD AND APPARATUS FOR IDENTIFYING CONTAMINATION IN A SEMICONDUCTOR FAB

    公开(公告)号:EP3961303A1

    公开(公告)日:2022-03-02

    申请号:EP20193101.1

    申请日:2020-08-27

    Abstract: Methods and associated apparatus for identifying contamination in a semiconductor fab are disclosed. The methods comprise determining contamination map data for a plurality of semiconductor wafers clamped to a wafer table after being processed in the semiconductor fab. Combined contamination map data is determined based, at least in part, on a combination of the contamination map data of the plurality of semiconductor wafers. The combined contamination map data is combined to reference data. The reference data comprises one or more values for the combined contamination map data that are indicative of contamination in one or more tools in the semiconductor fab.

    CLASSIFYING PRODUCT UNITS
    5.
    发明公开

    公开(公告)号:EP4343472A1

    公开(公告)日:2024-03-27

    申请号:EP22196685.6

    申请日:2022-09-20

    Abstract: One embodiment relates to a method of classifying product units subject to a process performed by an apparatus, the method comprising: receiving KPI data, the KPI data associated with a plurality of components of the apparatus and comprising data associated with a plurality of KPIs; clustering the KPI data to identify a plurality of clusters; analyzing the plurality of clusters to identify a plurality of failure modes associated with the apparatus, for each identified failure mode assigning a threshold to each KPI associated with the failure mode; and for each of the plurality of product units: determining the likelihood of each of the plurality of failure modes based on KPI data of the product unit and the thresholds assigned to each KPI associated with one of the plurality of failure modes; and performing a classification based on the likelihoods of each of the plurality of failure modes.

    DETERMINING A MARK LAYOUT ACROSS A PATTERNING DEVICE OR SUBSTRATE

    公开(公告)号:EP3734363A1

    公开(公告)日:2020-11-04

    申请号:EP19171485.6

    申请日:2019-04-29

    Abstract: A method for determining a layout of mark positions across a patterning device or substrate, the method comprising: a) obtaining 502 a model configured to model data associated with measurements performed on the patterning device or substrate at one or more mark positions; b) obtaining 504 an initial mark layout 506 comprising initial mark positions; c) reducing 508 the initial mark layout by removal of one or more mark positions to obtain a plurality of reduced mark layouts 510, each reduced mark layout obtained by removal of a different mark position from the initial mark layout; d) determining 512 a model uncertainty metric associated with usage of the model for each reduced mark layout out of said plurality of reduced mark layouts; and e) selecting 514 one or more reduced mark layouts 516 based on its associated model uncertainty metric.

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