公开(公告)号：JP2008293012A

公开(公告)日：2008-12-04

申请号：JP2008129058

申请日：2008-05-16

Applicant: Asml Netherlands Bv ,  エーエスエムエル ネザーランズ ビー.ブイ.

Inventor： DICKER GERALD

IPC: G03F1/08 ,  G03F7/20 ,  H01L21/027

CPC classification number: G03F7/70441 ,  G03F1/36 ,  G03F7/70433

Abstract: PROBLEM TO BE SOLVED: To provide a method of improving the imaging of patterns having a small exposure latitude and/or improving exposure latitude without detriment to DOF (depth of focus). SOLUTION: In a lithographic device manufacturing method, sub-resolution assist features are provided to equalize the intensities of the diffraction orders that form the image of the pattern on a substrate. In the case of bright lines against a dark field used with a positive tone resist for forming trenches at or near resolution, the assist features may comprise narrow lines equidistantly between the feature lines. In this way, an improvement of exposure latitude may be obtained without reduction of DOF. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供一种改善具有小曝光宽容度和/或改善曝光宽容度的图案的成像的方法，而不损害DOF（深度聚焦）。 解决方案：在光刻设备制造方法中，提供了次分辨率辅助特征以均衡在基板上形成图案的图像的衍射级的强度。 在与用于以分辨率或近分辨率形成沟槽的正色调抗蚀剂一起使用的暗场的亮线的情况下，辅助特征可以包括在特征线之间等距的窄线。 以这种方式，可以获得曝光宽容度的改善而不减少自由度。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：NL2009853A

公开(公告)日：2013-06-26

申请号：NL2009853

申请日：2012-11-21

Applicant: ASML NETHERLANDS BV

Inventor： ELINGS WOUTER ,  BILSEN FRANCISCUS ,  MOL CHRISTIANUS ,  MOS EVERHARDUS ,  TOLSMA HOITE ,  BERGE PETER TEN ,  WIJNEN PAUL ,  VERSTAPPEN LEONARDUS ,  DICKER GERALD ,  JUNGBLUT REINER ,  CHUNG-HSUN LI

IPC: G03F7/20

Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked to at least partially recompose the measurement results according to the sample plan.