公开(公告)号：NL2009853A

公开(公告)日：2013-06-26

申请号：NL2009853

申请日：2012-11-21

Applicant: ASML NETHERLANDS BV

Inventor： ELINGS WOUTER ,  BILSEN FRANCISCUS ,  MOL CHRISTIANUS ,  MOS EVERHARDUS ,  TOLSMA HOITE ,  BERGE PETER TEN ,  WIJNEN PAUL ,  VERSTAPPEN LEONARDUS ,  DICKER GERALD ,  JUNGBLUT REINER ,  CHUNG-HSUN LI

IPC: G03F7/20

Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked to at least partially recompose the measurement results according to the sample plan.