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公开(公告)号:NL2003294A
公开(公告)日:2010-03-09
申请号:NL2003294
申请日:2009-07-27
Applicant: ASML NETHERLANDS BV
Inventor: KERKHOF MARCUS , VERSTAPPEN LEONARDUS
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公开(公告)号:NL2009853A
公开(公告)日:2013-06-26
申请号:NL2009853
申请日:2012-11-21
Applicant: ASML NETHERLANDS BV
Inventor: ELINGS WOUTER , BILSEN FRANCISCUS , MOL CHRISTIANUS , MOS EVERHARDUS , TOLSMA HOITE , BERGE PETER TEN , WIJNEN PAUL , VERSTAPPEN LEONARDUS , DICKER GERALD , JUNGBLUT REINER , CHUNG-HSUN LI
IPC: G03F7/20
Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked to at least partially recompose the measurement results according to the sample plan.
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公开(公告)号:NL2005332A
公开(公告)日:2011-04-14
申请号:NL2005332
申请日:2010-09-08
Applicant: ASML NETHERLANDS BV
Inventor: VERSTAPPEN LEONARDUS , BOEF ARIE
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公开(公告)号:NL2003990A
公开(公告)日:2010-07-01
申请号:NL2003990
申请日:2009-12-21
Applicant: ASML NETHERLANDS BV
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