公开(公告)号：NL2005044A

公开(公告)日：2011-01-31

申请号：NL2005044

申请日：2010-07-07

Applicant: ASML NETHERLANDS BV

Inventor： WANG JIUN-CHENG ,  HAREN RICHARD ,  SCHAAR MAURITS ,  LEE HYUN-WOO ,  JUNGBLUT REINER

IPC: G01N21/47 ,  G03F7/20

Abstract: A mark used in the determination of overlay error comprises sub-features, the sub-features having a smallest pitch approximately equal to the smallest pitch of the product features. The sensitivity to distortions and aberrations is similar as that for the product features. When the mark is developed the sub-features merge and the outline of the larger feature is developed.

公开(公告)号：NL2009853A

公开(公告)日：2013-06-26

申请号：NL2009853

申请日：2012-11-21

Applicant: ASML NETHERLANDS BV

Inventor： ELINGS WOUTER ,  BILSEN FRANCISCUS ,  MOL CHRISTIANUS ,  MOS EVERHARDUS ,  TOLSMA HOITE ,  BERGE PETER TEN ,  WIJNEN PAUL ,  VERSTAPPEN LEONARDUS ,  DICKER GERALD ,  JUNGBLUT REINER ,  CHUNG-HSUN LI

IPC: G03F7/20

Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked to at least partially recompose the measurement results according to the sample plan.

公开(公告)号：NL2004234A

公开(公告)日：2010-08-30

申请号：NL2004234

申请日：2010-02-12

Applicant: ASML NETHERLANDS BV

Inventor： HINNEN PAUL ,  KERKHOF ANTONIUS ,  JUNGBLUT REINER ,  SCHREEL KOENRAAD

IPC: G03F7/20