Abstract:
PROBLEM TO BE SOLVED: To provide a substrate holder, a lithographic apparatus, a device manufacturing method, and a method of manufacturing the substrate holder.SOLUTION: A method of manufacturing a substrate holder for use in a lithographic apparatus includes: providing a main body having a surface, and a plurality of burls projecting from the surface and having end surfaces to support a substrate; providing a carrier surface adjacent to the main body surface; and forming a conductive layer on at least a part of the main body surface and an integral part on at least a part of the carrier surface.
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate table or substrate holder on which one or more electronic components, such as one or more thin-film components, are to be formed.SOLUTION: A substrate holder for a lithographic apparatus has a planarization layer provided on a surface thereof. The planarization layer provides a smooth surface for formation of a thin film stack forming an electronic component. The planarization layer is of substantially uniform thickness, and/or its outer surface has a peak-to-valley distance of less than 10 μm. The planarization layer may be formed by applying two solutions of different concentration. A surface treatment may be applied to burls to repel a solution of material of the planarization layer.
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate table or substrate holder on which one or more electronic components, such as one or more thin-film components, are formed.SOLUTION: A substrate holder for a lithographic apparatus has a planarization layer provided on a surface thereof. The planarization layer provides a smooth surface for the formation of a thin film stack forming an electronic component. The thin film stack comprises an (optional) isolation layer, a metal layer forming an electrode, a sensor, a heater, a transistor or a logic device, and a top isolation layer.
Abstract:
A substrate holder for a lithographic apparatus has a planarization layer provided on a surface thereof. The planarization layer provides a smooth surface for the formation of a thin film stack forming an electronic component. The thin film stack comprises an (optional) isolation layer, a metal layer forming an electrode, a sensor, a heater, a transistor or a logic device, and a top isolation layer. Fig. 20