Abstract:
PROBLEM TO BE SOLVED: To provide a method and an apparatus having high accuracy in determining a position of a movable object. SOLUTION: The method of manufacturing a device includes projecting a patterned radiation beam to a substrate wherein a position of a movable object is determined with multiple degrees of freedom using many sensors, the number of sensors is larger than the number of degrees of freedom, the position of the movable object is determined with the degrees of freedom using a signal from each of the sensors, and the signal from the sensor is weighed based on difference in noise level of each sensor. The lithography apparatus has improved accuracy in measurement of a position of the movable object and/or superposition ability and focusing ability. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an operation method in which scheduling for determining an order of many tasks that are performed using various functions in a machine involving lithography is corrected in a restorable manner when an expected situation occurs during operation. SOLUTION: In the operation method of the machine, a state resistor SR indicating a state of the machine and a database TDB of tasks executable in the machine are maintained, possible task orders are created based on conditions before and after the tasks on the state of the system (rather than a priority relation), an order confirming given start and end states of the machine is selected from the created orders. According to the method, the order of the tasks executable in the machine can be quickly created, and an optimum order can be quickly found, in addition, automatic restoration from an exception is possible. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To improve stage position measurement accuracy of a stage. SOLUTION: A position measurement system to measure a position of a movable stage includes: a reference plate; a plurality of sensors arranged such that, depending on a position of the movable stage relative to the reference plate, at least a subset of the plurality of sensors is configured to cooperate with the reference plate to provide, for each of the sensors in the subset, respective sensor signals representative of positions of the respective sensors relative to the reference plate; and a processor arranged to determine, from the sensor signals, a stage position. The processing device is configured to, when the stage is in a position where an over-determined number of sensor signals is provided by at least the subset of the sensors that are in operational cooperation with the reference plate, (a) determine the stage position from a subset of the over-determined number of sensor signals, and (b) correct a sensor signal of one or more of the sensors from a discrepancy between the determined stage position and a remainder of the sensors signals. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To improve focus spot observation in a lithographic projection apparatus comprising a level sensor to measure the height of a wafer at a plurality of points. SOLUTION: Height information is sent to a processor (8) which is arranged to create a measured height map (50) using input from the level sensor. The processor (8) uses the measured height map (50) to calculate an average die structure (40), subtracts the average die structure (40) from the measured height map (50) with respect to a die (52) on the wafer to create an unworked height map (56) on the surface of the wafer, and uses the unworked height map (56) to detect an arbitrary focus spot on the surface of the wafer. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a control system for controlling a support structure in a lithographic apparatus. SOLUTION: The control system includes a first measurement system for measuring the position of a substrate supported by the support structure, the position being measured in a first coordinate system. The control system further includes a second measurement system for measuring the position of the support structure in a second coordinate system, the first measurement system having a presumed position in the second coordinate system. The control system further comprises a controller configured to control the position of the support structure based on measurements by the second measurement system, to convert the measured position of the substrate into a converted position of the support structure in the second coordinate system, to position the support structure based on the converted position, to receive a position error signal indicative of a difference between the presumed position and an actual position of the first measurement system in the second coordinate system, and to position the support structure in a manner dependent upon the position error signal. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To calibrate the position of a substrate table in a lithography device. SOLUTION: The calibration method comprises: a step 500 of repeatedly irradiating the substrate surface with patterns to ensure that two dimensional patterns are disposed on the substrate surface, and deviating the substrate table during intervals between the continuous irradiations such that other places of the substrate surface are irradiated during the repeated irradiations; a step 510 of reading patterns in two dimensions to obtain pattern reading results; a step 520 of deriving an increment position deviation from reading results of adjacent patterns according to the position of the substrate table in the two dimensions; a step 530 of deriving the position error of the substrate table from the increment position deviation as a function of a two-dimensional position of the substrate table; and a step 540 of using position-dependent errors to calibrate the position of the substrate table. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
A lithographic projection apparatus and method of manufacturing devices using such an apparatus is presented. The apparatus includes a level sensor to measure the height of a wafer in a plurality of points. The height info is sent to a processor which is arranged to create a measured height map using input from the level sensor. In one embodiment of the invention, the processor is also arranged to calculate an average die topology using the measured height map in order to produce a raw height map of the surface of the substrate, and to detect any focus spots on said surface of said substrate using the raw height map. By subtracting the average die topology, focus spots can be located more accurately than before.
Abstract:
A lithographic projection apparatus including: an illumination system configured to provide a beam of radiation; a support configured to support a patterning device, the patterning device configured to impart the beam with a pattern in its cross section; a substrate table (WT) configured to hold a substrate (W); a projection system configured to project the patterned radiation onto a target portion of the substrate (W); a plurality of level sensors (LS) for sensing a level of a substrate carried on the substrate table (WT) at a plurality of different positions, and a system for determining the position of the substrate table (WT). Also provided is a controller that is configured to cause relative movement between the substrate (W) and the level sensor array from a first position at which a first measurement is taken to a plurality of overlapping positions at which further measurements are taken, and a calculator for calculating a measure of Z position errors and/or substrate table (WT) unflatness and/or a measure of the level sensor (LS) position/offset using the plurality of overlapping measurements.