Abstract:
PROBLEM TO BE SOLVED: To improve focus spot observation in a lithographic projection apparatus comprising a level sensor to measure the height of a wafer at a plurality of points. SOLUTION: Height information is sent to a processor (8) which is arranged to create a measured height map (50) using input from the level sensor. The processor (8) uses the measured height map (50) to calculate an average die structure (40), subtracts the average die structure (40) from the measured height map (50) with respect to a die (52) on the wafer to create an unworked height map (56) on the surface of the wafer, and uses the unworked height map (56) to detect an arbitrary focus spot on the surface of the wafer. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To solve the problem that the dependency on the critical dimension (CD) pitch of a lithographic pattern printing process is associated with the spectrum intensity distribution of radiation used for projecting a pattern and therefore changes from system to system, which is a cause of mismatching of iso-dense bias among systems. SOLUTION: The problem is solved by providing lithographic equipment which comprises a lighting system for supplying a projection beam of radiation, a projection system for projecting a patterned beam on a target position of a substrate, a substrate table for holding the substrate, and a controller for adjusting the spectrum distribution of radiation intensity of the projection beam. The adjustment of the spectrum intensity distribution is based on the data associated with iso-dense bias, and the spectrum intensity distribution is adjusted by widening the spectrum band width or by changing the shape of the spectrum intensity distribution. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a method and a device for cleaning a component of a lithographic apparatus in situ. SOLUTION: In a low-pressure environment, by applying a voltage between a tool tip in close proximity to a surface and that surface, contaminants on the surface are attracted and adhered to a tool. Also, a laser is used and each component of a lithographic projection apparatus is cleaned in situ. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To avoid the need to relate the origins of apparatuses which measure heights of substrates or masks on a plurality of stations in a lithographic projection apparatus having a plurality of substrate tables or mask tables. SOLUTION: A substrate W is mounted on a substrate table WT; then, vertical positions of a physical reference surface and vertical positions Z LS of the substrate surface are measured at a plurality of points on a measurement station (at the right of figure 8) using a level sensor 10; simultaneously, vertical positions Z IF of the substrate table are measured at the same points using a Z-interferometer Z IF ; and the substrate surface height, Z Wafer =Z LS +Z IF , is mapped. Then, the substrate table carrying the substrate is moved to an exposure station (to the left of figure 8) and vertical positions of the physical reference surface is again determined. Then, when the substrate is positioned at a right vertical position during the exposure process, the height map is referenced. This process can be applied to a mask. COPYRIGHT: (C)2008,JPO&INPIT
Abstract translation:要解决的问题:为了避免在具有多个基板台或掩模台的光刻投影设备中将测量基板或掩模高度的设备的起点与多个台站相关联的需要。 解决方案:将衬底W安装在衬底台WT上; 然后使用液位传感器10在测量站(图8右侧)的多个点测量基板表面的物理基准表面和垂直位置Z LS SB>的垂直位置; 同时,使用Z型干涉仪Z SB,在同一点测量衬底台的垂直位置Z IF SB>; 并且映射基板表面高度Z Wafer SB> = Z LS SB> + Z IF SB>。 然后,承载基板的基板台移动到曝光站(图8的左侧),再次确定物理基准面的垂直位置。 然后,当曝光处理期间基板位于右垂直位置时,参考高度图。 该过程可以应用于掩模。 版权所有(C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a lithography apparatus which corrects an undesirable bend of a patterning device using an improved bending mechanism of the patterning device. SOLUTION: The lithography apparatus includes a support that is structured to support the patterning device. The patterning device can give a pattern to the section of an radiation beam to form a patterned radiation beam, and the support has a support clamp structured to clamp the patterning device onto the support. The lithography apparatus also includes the bending mechanism structured to add a bending torque to the clamped patterning device, and this bending mechanism has a force/torque actuator structured to cause a clamp force added to the patterning device by the support clamp to act on the clamped patterning device with virtually no reduction of the force. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an article support which allows every kind of deformation induced by a heat load or the like of an article supported by itself during a lithography process. SOLUTION: The article support which is constructed for supporting a reticle (a first article) or a wafer (a second article) includes several protrusions for support on each of which the article is set when in use and which is constructed in such a way as to demarcate a support region for providing a flat surface on which they support the article, to enable the expansion and contraction of at least a part of the article by the support region when the article is subjected to the heat load in this way and to reduce the accumulation of mechanical stress in the article and a position sensor which is constructed in such a way as to determine a displacement position offset in one direction of the article on a flat surface of its support region for a certain period. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
A method and apparatus make use of data representing changes in wavelength of a radiation source to provide control of focal plane position or to provide correction of senso data. In the first aspect, the wavelength variation data is provided to control systems that control focus by moving apparatus components including, for example, the mask table (MT), the substrate table (WT) or optical elements of the projection optical system (PS). In the second aspect, variation data is used in correcting, e.g., focal plane position data measured by an inboard sensor, such as a transmitted image sensor. The two aspects may be combined in a single apparatus or may be used separately.
Abstract:
A lithographic projection apparatus and method of manufacturing devices using such an apparatus is presented. The apparatus includes a level sensor to measure the height of a wafer in a plurality of points. The height info is sent to a processor which is arranged to create a measured height map using input from the level sensor. In one embodiment of the invention, the processor is also arranged to calculate an average die topology using the measured height map in order to produce a raw height map of the surface of the substrate, and to detect any focus spots on said surface of said substrate using the raw height map. By subtracting the average die topology, focus spots can be located more accurately than before.
Abstract:
A position measuring apparatus includes a radiation source mounted on an isolated reference frame and a two-dimensional radiation detector mounted adjacent the radiation source. The object whose position is to be detected has a retro-reflector mounted on it so as to reflect light emitted from the radiation source along a return path that is parallel to but displaced from the incident light path. The amount of displacement is dependent on the position of the object and is measured by the two-dimensional detector. Three such apparatus can be combined in a system to measure the position of the object in all six degrees of freedom.
Abstract:
In a low-pressure environment, a voltage is applied between a tool tip in close proximity to a surface and that surface. Contaminants on the surface are attracted and adhere to the tool.