公开(公告)号：US20140062619A1

公开(公告)日：2014-03-06

申请号：US13674440

申请日：2012-11-12

Applicant: BAOLAB MICROSYSTEMS SL

Inventor： Josep Montanya Silvestre ,  Marco Antonio Llamas Morote

IPC: H01P11/00 ,  H01P1/20

CPC classification number: H01P11/006 ,  B81B2201/0242 ,  B81B2201/0271 ,  B81C1/00246 ,  B81C2203/0714 ,  B81C2203/0771 ,  H01L28/40 ,  H01P1/2002 ,  Y10T29/49016

Abstract: Systems and methods for manufacturing a chip comprising a MEMS-based radio frequency filter arranged in an integrated circuit are provided. In one aspect, the systems and methods provide for a chip including electronic elements formed on a semiconductor material substrate. The chip further includes a stack of interconnection layers including layers of conductor material separated by layers of dielectric material. A radio frequency filter is formed within the stack of interconnection layers by applying gaseous HF to the interconnection layers. The radio frequency filter includes a plurality of mechanically decoupled resonator elements.

Abstract translation: 提供了一种用于制造包括布置在集成电路中的基于MEMS的射频滤波器的芯片的系统和方法。 在一个方面，所述系统和方法提供了包括形成在半导体材料基板上的电子元件的芯片。 该芯片还包括一叠互连层，包括由电介质材料层隔开的导体材料层。 通过向互连层施加气态HF，在互连层的堆叠内形成射频滤波器。 射频滤波器包括多个机械去耦谐振元件。

公开(公告)号：US20140225250A1

公开(公告)日：2014-08-14

申请号：US14079041

申请日：2013-11-13

Applicant: Baolab Microsystems SL

Inventor： Josep Montanya Silvestre ,  Marco Antonio Llamas Morote ,  Daniel Fernandez Martinez ,  Juan José Valle Fraga ,  Albert Mola

IPC: B81B7/02 ,  H01L23/522

CPC classification number: B81C1/00246 ,  B81B2201/0235 ,  B81B2207/015 ,  B81C2203/0735 ,  H01L23/522 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A MEMS integrated circuit including a plurality of layers where a portion includes one or more electronic elements on a semiconductor material substrate. The circuit includes a structure of interconnection layers having a bottom layer of conductor material and a top layer of conductor material where the layers are separated by at least one layer of dielectric material. The bottom layer may be formed above and in contact with an Inter Dielectric Layer. The circuit also includes a hollow space within the structure of interconnection layers and a MEMS device in communication with the structure of interconnection layers.

Abstract translation: 一种MEMS集成电路，包括多个层，其中一部分包括半导体材料基底上的一个或多个电子元件。 电路包括具有导体材料的底层和导体材料的顶层的互连层的结构，其中层被至少一层电介质材料隔开。 底层可以形成在介电层之上并与之互相接触。 该电路还包括互连层结构内的中空空间和与互连层结构通信的MEMS器件。