公开(公告)号：WO2016014648A2

公开(公告)日：2016-01-28

申请号：PCT/US2015/041505

申请日：2015-07-22

Applicant: BREWER SCIENCE INC.

Inventor： LIU, Xiao ,  BAI, Dongshun ,  FLAIM, Tony D. ,  ZHONG, Xing-Fu ,  WU, Qi

CPC classification number: B32B7/06 ,  B05D3/007 ,  B32B27/06 ,  B32B37/14 ,  B32B2255/26 ,  B32B2307/412 ,  B32B2405/00 ,  B32B2457/00 ,  C08G73/1014 ,  C08G73/1039 ,  C08G73/1067 ,  C09D179/08 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1158 ,  Y10T156/1917

Abstract: The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250°C to about 350°C for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.

Abstract translation: 本发明广泛涉及在微电子制造期间能够实现薄晶片处理的释放层组合物。 优选的剥离层由包含溶解或分散在溶剂体系中的聚酰胺酸或聚酰亚胺的组合物形成，然后在约250℃至约350℃下固化和/或除去溶剂少于约10分钟，产生薄膜 。 该方法将释放组合物形成为可用于临时粘合工艺的聚酰亚胺剥离层，并且在进行所需的加工之后进行激光剥离。

公开(公告)号：WO2012057893A2

公开(公告)日：2012-05-03

申请号：PCT/US2011/046751

申请日：2011-08-05

Applicant: BREWER SCIENCE INC. ,  PULIGADDA, Rama ,  ZHONG, Xing-Fu ,  FLAIM, Tony, D. ,  MCCUTCHEON, Jeremy

Inventor： PULIGADDA, Rama ,  ZHONG, Xing-Fu ,  FLAIM, Tony, D. ,  MCCUTCHEON, Jeremy

IPC: H01L21/20

CPC classification number: H01L21/6835 ,  B32B38/0008 ,  B32B38/10 ,  B32B43/006 ,  H01L21/2007 ,  H01L21/6836 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/351 ,  Y10T156/10 ,  Y10T156/11 ,  Y10T156/1126 ,  Y10T428/24942 ,  Y10T428/26 ,  Y10T428/31511 ,  Y10T428/31551 ,  Y10T428/31663 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31935 ,  Y10T428/31938 ,  H01L2924/00

Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.

Abstract translation: 提供临时连接半导体衬底的多个结合层方案。 在本发明的接合方案中，至少一个层直接与半导体衬底接触，且该方案中的至少两个层彼此直接接触。 本发明提供了多个处理选择，因为多层结构内的不同层执行特定的功能。 更重要的是，它将通过提供更高的热稳定性，与苛刻的背面处理步骤的更大兼容性，通过封装保护晶片正面的凸块，在脱粘步骤中降低应力和减少剥离步骤来提高薄晶片处理解决方案的性能 正面的缺陷。

公开(公告)号：WO2022035734A1

公开(公告)日：2022-02-17

申请号：PCT/US2021/045164

申请日：2021-08-09

Applicant: BREWER SCIENCE, INC.

Inventor： ZHONG, Xing-Fu ,  HUANG, Runhui ,  XU, Gu ,  SIMMONS, Sean ,  SWEAT, Daniel ,  KOZA, Jakub

IPC: G03F7/11 ,  C08L79/08 ,  C08K5/13 ,  C08K5/053 ,  C08K5/49 ,  C08G73/10 ,  H01L21/033 ,  H01L21/02

Abstract: A high-temperature-stable spin-on-carbon ("SOC") material that fills topography features on a substrate while planarizing the surface in a one-step, thin layer coating process is provided. The material comprises low molecular weight polyimides or diimides that are pre-imidized in solution rather than on the wafer. The SOC layers can survive harsh CVD conditions and are also SCI resistant, especially on TiN and SiOx surfaces.

公开(公告)号：WO2016209828A1

公开(公告)日：2016-12-29

申请号：PCT/US2016/038554

申请日：2016-06-21

Applicant: BREWER SCIENCE INC.

Inventor： ZHONG, Xing-Fu ,  HUANG, Runhui ,  ZHANG, Boyu

IPC: H01L21/027 ,  H01L21/768 ,  G03F1/22 ,  G03F1/48 ,  G03F7/26 ,  G03F7/004

CPC classification number: H01L21/0337 ,  C09D125/08 ,  C09D131/02 ,  C09D179/08 ,  H01L21/02118 ,  H01L21/02282

Abstract: Planarizing and spin-on-carbon (SOC) compositions that fill vias and/or trenches on a substrate while planarizing the surface in a single thin layer coating process are provided. The compositions can planarize wide ranges of substrates with vias or trenches of from about 20 nm to about 220 nm wide, and up to about 700 nm deep. These extraordinary properties come from the low molecular weight of the polymers used in the materials, thermally-labile protecting groups on the polymers, and a delayed crosslinking reaction.

Abstract translation: 提供了在单个薄层涂覆工艺中平坦化表面的同时在基板上填充过孔和/或沟槽的平面化和旋涂碳（SOC）组合物。 组合物可以通过具有约20nm至约220nm宽和高达约700nm深的通孔或沟槽来平坦化宽范围的衬底。 这些非凡的性质来自材料中使用的聚合物的低分子量，聚合物上的热不稳定保护基团和延迟的交联反应。

公开(公告)号：WO2014062843A1

公开(公告)日：2014-04-24

申请号：PCT/US2013/065303

申请日：2013-10-16

Applicant: BREWER SCIENCE INC.

Inventor： MALHOTRA, Jyoti K. ,  ZHONG, Xing-Fu

IPC: H01L23/28

CPC classification number: H01L23/296 ,  C08G77/12 ,  C08G77/20 ,  C08K5/11 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  H01L21/56 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Novel compositions and methods of using those compositions to form high refractive index coatings are provided. The compositions comprise a mixture of two silicone polymers, a catalyst, and an inhibitor for the catalyst. The preferred catalyst comprises platinum. Unlike prior art silicone systems, the inventive composition can be provided in a one-part form due to a substantially improved pot life. The compositions can be spin- or spray-applied, followed by baking to crosslink the polymers and form a cured layer. The inventive cured layers have high refractive indices and light transmissions.

Abstract translation: 提供了使用这些组合物形成高折射率涂层的新型组合物和方法。 组合物包含两种硅氧烷聚合物，催化剂和用于催化剂的抑制剂的混合物。 优选的催化剂包括铂。 与现有技术的有机硅系统不同，由于适用期大大提高，本发明组合物可以以一部分形式提供。 可以旋涂或喷涂组合物，然后烘烤以交联聚合物并形成固化层。 本发明的固化层具有高折射率和光透射。

公开(公告)号：WO2011022087A1

公开(公告)日：2011-02-24

申请号：PCT/US2010/027937

申请日：2010-03-19

Applicant: BREWER SCIENCE INC. ,  TANG, Tingji ,  XU, Gu ,  ZHONG, Xing-Fu ,  HONG, Wenbin ,  FLAIM, Tony, D. ,  YESS, Kimberly

Inventor： TANG, Tingji ,  XU, Gu ,  ZHONG, Xing-Fu ,  HONG, Wenbin ,  FLAIM, Tony, D. ,  YESS, Kimberly

IPC: H01L21/312

CPC classification number: B81C1/00801 ,  B81C2201/053 ,  C08G61/08 ,  C08G2261/3324 ,  C08G2261/418 ,  G03F7/033 ,  G03F7/094 ,  H01L21/0274 ,  H01L21/3081 ,  Y10T428/31645 ,  Y10T428/31667 ,  Y10T428/31692 ,  Y10T428/31855 ,  Y10T428/31909

Abstract: New compositions and methods of using those compositions as protective layers during the production of semiconductor and MEMS devices are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to form layers that protect a substrate during acid etching and other processing and handling. The protective layer can be photosensitive or non-photosensitive, and can be used with or without a primer layer beneath the protective layer. Preferred primer layers comprise a basic polymer in a solvent system.

Abstract translation: 提供了在制造半导体和MEMS器件期间使用这些组合物作为保护层的新组合物和方法。 组合物包含分散或溶解在溶剂体系中的环烯烃共聚物，并且可以用于在酸蚀刻和其它加工和处理期间形成保护基材的层。 保护层可以是光敏的或非感光的，并且可以在保护层下面使用或不使用底漆层。 优选的底漆层在溶剂体系中包含碱性聚合物。

公开(公告)号：EP3172762A2

公开(公告)日：2017-05-31

申请号：EP15824894.8

申请日：2015-07-22

Applicant: Brewer Science, Inc.

Inventor： LIU, Xiao ,  BAI, Dongshun ,  FLAIM, Tony D. ,  ZHONG, Xing-Fu ,  WU, Qi

IPC: H01L21/58

CPC classification number: B32B7/06 ,  B05D3/007 ,  B32B27/06 ,  B32B37/14 ,  B32B2255/26 ,  B32B2307/412 ,  B32B2405/00 ,  B32B2457/00 ,  C08G73/1014 ,  C08G73/1039 ,  C08G73/1067 ,  C09D179/08 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1158 ,  Y10T156/1917

Abstract: The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250° C. to about 350° C. for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.

Abstract translation: 本发明广泛地涉及在微电子制造过程中能够进行薄晶片处理的剥离层组合物。 优选的释放层由包含溶解或分散在溶剂体系中的聚酰胺酸或聚酰亚胺的组合物形成，随后在约250℃至约350℃下固化和/或除去溶剂少于约10分钟，产生 薄膜。 该过程将释放组合物形成聚酰亚胺释放层，其可以用于临时粘合过程，并且在期望的处理已经进行之后激光剥离。

公开(公告)号：EP2601676A2

公开(公告)日：2013-06-12

申请号：EP11836791.1

申请日：2011-08-05

Applicant: Brewer Science, Inc.

Inventor： PULIGADDA, Rama ,  ZHONG, Xing-Fu ,  FLAIM, Tony, D. ,  MCCUTCHEON, Jeremy

IPC: H01L21/20

CPC classification number: H01L21/6835 ,  B32B38/0008 ,  B32B38/10 ,  B32B43/006 ,  H01L21/2007 ,  H01L21/6836 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/351 ,  Y10T156/10 ,  Y10T156/11 ,  Y10T156/1126 ,  Y10T428/24942 ,  Y10T428/26 ,  Y10T428/31511 ,  Y10T428/31551 ,  Y10T428/31663 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31935 ,  Y10T428/31938 ,  H01L2924/00

Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.

公开(公告)号：EP3311393A1

公开(公告)日：2018-04-25

申请号：EP16815145.4

申请日：2016-06-21

Applicant: Brewer Science Inc.

Inventor： ZHONG, Xing-Fu ,  HUANG, Runhui ,  ZHANG, Boyu

IPC: H01L21/027 ,  H01L21/768 ,  G03F1/22 ,  G03F1/48 ,  G03F7/26 ,  G03F7/004

CPC classification number: H01L21/0337 ,  C09D125/08 ,  C09D131/02 ,  C09D179/08 ,  H01L21/02118 ,  H01L21/02282

Abstract: Planarizing and spin-on-carbon (SOC) compositions that fill vias and/or trenches on a substrate while planarizing the surface in a single thin layer coating process are provided. The compositions can planarize wide ranges of substrates with vias or trenches of from about 20 nm to about 220 nm wide, and up to about 700 nm deep. These extraordinary properties come from the low molecular weight of the polymers used in the materials, thermally-labile protecting groups on the polymers, and a delayed crosslinking reaction.

公开(公告)号：EP2419926A1

公开(公告)日：2012-02-22

申请号：EP10810300.3

申请日：2010-03-19

Applicant: Brewer Science, Inc.

Inventor： TANG, Tingji ,  XU, Gu ,  ZHONG, Xing-Fu ,  HONG, Wenbin ,  FLAIM, Tony, D. ,  YESS, Kimberly ,  TRICHUR, Ramachandran, K.

IPC: H01L21/312

CPC classification number: B81C1/00801 ,  B81C2201/053 ,  C08G61/08 ,  C08G2261/3324 ,  C08G2261/418 ,  G03F7/033 ,  G03F7/094 ,  H01L21/0274 ,  H01L21/3081 ,  Y10T428/31645 ,  Y10T428/31667 ,  Y10T428/31692 ,  Y10T428/31855 ,  Y10T428/31909

Abstract: New compositions and methods of using those compositions as protective layers during the production of semiconductor and MEMS devices are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to form layers that protect a substrate during acid etching and other processing and handling. The protective layer can be photosensitive or non-photosensitive, and can be used with or without a primer layer beneath the protective layer. Preferred primer layers comprise a basic polymer in a solvent system.

Abstract translation: 提供了在生产半导体和MEMS器件期间使用这些组合物作为保护层的新组合物和方法。 该组合物包含分散或溶解在溶剂体系中的环烯烃共聚物，并且可用于形成在酸蚀刻和其他处理和处理期间保护基材的层。 保护层可以是光敏或非光敏的，并且可以在保护层下具有或不具有底漆层的情况下使用。 优选的底漆层在溶剂体系中包含碱性聚合物。