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    EXPOSURE APPARATUS
    1.
    发明申请
    EXPOSURE APPARATUS 审中-公开
    曝光装置

    公开(公告)号：WO2008072641A8

    公开(公告)日：2008-08-28

    申请号：PCT/JP2007073888

    申请日：2007-12-05

    Applicant: CANON KK ,  YONEKAWA MASAMI

    Inventor： YONEKAWA MASAMI

    IPC: G03F7/20

    CPC classification number: G03F7/70866 ,  G03F7/70925

    Abstract: An exposure apparatus for exposing a substrate to radiant energy in a vacuum is disclosed. The apparatus comprises a chamber in which the vacuum is generated, a blowing device including a supply nozzle (17a) located in the chamber and configured to blow, through said supply nozzle, a gas to an object (2) arranged in the chamber in which the vacuum is generated, and a recovery device including a recovery nozzle (17b) located in the chamber and configured to recover, through the recovery nozzle, the gas blown into the chamber through said supply nozzle, wherein the apparatus is configured so that the object moves in a direction opposite to a direction from the supply nozzle to the recover nozzle, parallel to blowing by the blowing device.

    Abstract translation: 公开了一种用于将基板暴露于真空中的辐射能的曝光装置。 该装置包括产生真空的室，吹风装置，其包括位于室中的供应喷嘴（17a），并且构造成通过所述供应喷嘴将气体吹送到布置在室中的物体（2） 产生真空，以及回收装置，其包括位于室内的回收喷嘴（17b），其构造成通过回收喷嘴将通过所述供给喷嘴吹入室内的气体回收，其中，所述装置被构造成使得所述物体 与吹送装置的吹送平行，从与供给喷嘴到回收喷嘴的方向相反的方向移动。

    EXPOSURE APPARATUS
    2.
    发明申请
    EXPOSURE APPARATUS 审中-公开
    曝光装置

    公开(公告)号：WO2008072641A9

    公开(公告)日：2009-06-25

    申请号：PCT/JP2007073888

    申请日：2007-12-05

    Applicant: CANON KK ,  YONEKAWA MASAMI

    Inventor： YONEKAWA MASAMI

    IPC: G03F7/20

    CPC classification number: G03F7/70866 ,  G03F7/70925

    Abstract: An exposure apparatus for exposing a substrate to radiant energy in a vacuum is disclosed. The apparatus comprises a chamber in which the vacuum is generated, a blowing device including a supply nozzle (17a) located in the chamber and configured to blow, through said supply nozzle, a gas to an object (2) arranged in the chamber in which the vacuum is generated, and a recovery device including a recovery nozzle (17b) located in the chamber and configured to recover, through the recovery nozzle, the gas blown into the chamber through said supply nozzle, wherein the apparatus is configured so that the object moves in a direction opposite to a direction from the supply nozzle to the recover nozzle, parallel to blowing by the blowing device.

    Abstract translation: 公开了一种用于将基板暴露于真空中的辐射能的曝光装置。 该装置包括产生真空的室，吹风装置，其包括位于室中的供应喷嘴（17a），并且构造成通过所述供应喷嘴将气体吹送到布置在室中的物体（2） 产生真空，以及回收装置，其包括位于室内的回收喷嘴（17b），其构造成通过回收喷嘴将通过所述供给喷嘴吹入室内的气体回收，其中，所述装置被构造成使得所述物体 与吹送装置的吹送平行，从与供给喷嘴到回收喷嘴的方向相反的方向移动。

    임프린트 장치 및 물품 제조 방법
    3.
    发明公开
    임프린트 장치 및 물품 제조 방법 审中-公开

    公开(公告)号：KR20180056372A

    公开(公告)日：2018-05-28

    申请号：KR20170149266

    申请日：2017-11-10

    Applicant: CANON KK

    Inventor： YONEKAWA MASAMI ,  EMOTO KEIJI ,  MAEDA TOSHIHIRO

    IPC: G03F7/00 ,  G03F7/20

    Abstract: 파티클에기인하여발생할수 있는패턴결함이나기판및/또는형의파손을저감하기위해유리한기술을제공한다. 임프린트장치는, 기판상의임프린트재에형을접촉시켜해당임프린트재를경화시킴으로써해당기판상에패턴을형성한다. 임프린트장치는, 기판을보유지지하는기판보유지지수단과, 형을보유지지하는형 보유지지부와, 상기형 보유지지부의주변에배치된형 주변부재와, 상기기판보유지지수단과상기형 주변부재사이에전압을공급하는전원을구비한다. 상기기판보유지지부는, 기판을흡착하는기판흡착부와, 상기기판흡착부의주변에배치된기판주변부를포함한다. 상기임프린트장치는, 상기기판보유지지수단을클리닝하는제1 모드와, 상기형 주변부재를클리닝하는제2 모드를갖는다. 상기제1 모드에서상기전원이상기형 주변부재와상기기판보유지지수단사이에공급하는전압의극성과, 상기제2 모드에서상기전원이상기형 주변부재와상기기판보유지지수단사이에공급하는전압의극성이반대이다.

    5.
    发明专利
    未知

    公开(公告)号：DE69127335T2

    公开(公告)日：1998-01-15

    申请号：DE69127335

    申请日：1991-10-01

    Applicant: CANON KK

    Inventor： UNNO YASUYUKI ,  ORII SEIJI ,  YONEKAWA MASAMI

    IPC: G03F7/20 ,  G03F7/207

    Abstract: A projection exposure apparatus which images a pattern (26) formed on an original (2) onto a substrate (4) at a predetermined magnification to form a pattern image on the substrate, includes an original support member (25), a substrate support member (5), and a projection lens (3) disposed between these support members for imaging the pattern onto the substrate. In the projection exposure apparatus, a partial deviation of positions of portions of the pattern image from regular positions are obtained in at least one of directions along and perpendicular to a surface of the pattern image, and the partial deviation is eliminated by deforming at least one of the original and the substrate based on the thus obtained result.

    6.
    发明专利
    未知

    公开(公告)号：DE69127335D1

    公开(公告)日：1997-09-25

    申请号：DE69127335

    申请日：1991-10-01

    Applicant: CANON KK

    Inventor： UNNO YASUYUKI ,  ORII SEIJI ,  YONEKAWA MASAMI

    IPC: G03F7/20 ,  G03F7/207

    Abstract: A projection exposure apparatus which images a pattern (26) formed on an original (2) onto a substrate (4) at a predetermined magnification to form a pattern image on the substrate, includes an original support member (25), a substrate support member (5), and a projection lens (3) disposed between these support members for imaging the pattern onto the substrate. In the projection exposure apparatus, a partial deviation of positions of portions of the pattern image from regular positions are obtained in at least one of directions along and perpendicular to a surface of the pattern image, and the partial deviation is eliminated by deforming at least one of the original and the substrate based on the thus obtained result.

    SEMICONDUCTOR ALIGNER
    7.
    发明专利
    SEMICONDUCTOR ALIGNER 审中-公开

    公开(公告)号：JP2003224054A

    公开(公告)日：2003-08-08

    申请号：JP2002020272

    申请日：2002-01-29

    Applicant: CANON KK

    Inventor： YONEKAWA MASAMI

    IPC: G03F7/20 ,  B65G49/07 ,  H01L21/027 ,  H01L21/677 ,  H01L21/68 ,  H01L21/683

    Abstract: PROBLEM TO BE SOLVED: To solve the problem of a semiconductor aligner that when a wafer warped upward through various processes is corrected planarly using an electrostatic chuck, peripheral part of the wafer is attracted first and since only the central part is left while being swollen by the frictional force acting between the wafer and the chuck, plane correction of the wafer cannot be performed. SOLUTION: When a deformed wafer is adsorbed to an electrostatic chuck, the wafer is previously applied with a force in the radial direction and forcibly deformed mechanically up to an approximately planar state and then the wafer is mounted, as it is, on the electrostatic chuck and adsorbed electrostatically thus correcting the wafer up to a specified planarity. As an example of forced deforming means, the wafer is placed on a carrying hand, clamped mechanically at a plurality of points at the outer circumferential end thereof and then applied with a force in the radial direction. COPYRIGHT: (C)2003,JPO

    ALIGNER AND EXPOSURE METHOD
    8.
    发明专利
    ALIGNER AND EXPOSURE METHOD 失效

    公开(公告)号：JP2001217177A

    公开(公告)日：2001-08-10

    申请号：JP2000024286

    申请日：2000-02-01

    Applicant: CANON KK

    Inventor： YONEKAWA MASAMI

    IPC: H01L21/027 ,  G03F7/20

    Abstract: PROBLEM TO BE SOLVED: To keep rotation symmetric (magnification, distortion) and rotational asymmetric error elements generated in a circuit pattern projection image almost zero with respect to temperature rise of an original film through effective cooling during projection exposure and minimize reduction of throughput. SOLUTION: The system has a cooling unit 73 for cooling an arbitrary region of a reticle 6 as an original film, a control means 20 for controlling the cooling amount of the cooling unit 73 for the arbitrary region each, based on temperature distribution of the reticle and a temperature distribution measurement unit 71 for measuring the temperature distribution of the reticle 6. The temperature distribution measurement unit 71 is constituted as one plate, where the thermostatic part of a plurality of temperature sensors is arranged into a matrix shape whose size is equivalent to an original film, and the temperature distribution can be measured by bringing it into contact with the reticle 6 for a prescribed time at proper timing each shot, each substrate, etc.

    PROJECTION ALIGNER AND PROJECTION EXPOSURE METHOD
    9.
    发明专利
    PROJECTION ALIGNER AND PROJECTION EXPOSURE METHOD 失效

    公开(公告)号：JPH11354401A

    公开(公告)日：1999-12-24

    申请号：JP17054698

    申请日：1998-06-04

    Applicant: CANON KK

    Inventor： YONEKAWA MASAMI

    IPC: H01L21/027 ,  G03F7/20 ,  G03F9/00

    Abstract: PROBLEM TO BE SOLVED: To correct magnification component in a shot occurred in a reticle, by estimating lens magnification in the shot using a specific equation, and accordingly using a magnification correction function of a projection lens to correct the magnification in the shot. SOLUTION: When a specified magnification variation Δβ s in a shot is larger than a magnification variation permissible value Δβsc in the shot at first mark measurement using an equation Δβs=C.Ap.S .ΔβM (where C, p and q are coefficients), a sequence proceeds to a magnification correcting operation. A reticle alignment is applied to the stretched reticle, an error is assigned to each mark so that sum of squares of the error in the stretch becomes minimum, and registration in x, y and θdirection is performed in a reticle stage (S18). Subsequently, in accordance with a magnification correcting value of a projection lens according to the magnification component Δβ s in the shot occurred, a magnification correction unit of the projection lens operates and magnification on the reticle is corrected (S19). If the magnification correction is ideally performed, magnification variation is not occurred on a wafer.

    PROJECTION ALIGNER
    10.
    发明专利
    PROJECTION ALIGNER 失效

    公开(公告)号：JPH04214613A

    公开(公告)日：1992-08-05

    申请号：JP40987990

    申请日：1990-12-12

    Applicant: CANON KK

    Inventor： YONEKAWA MASAMI ,  ORII SEIJI

    IPC: G03F7/20 ,  H01L21/027 ,  H01L21/30

    Abstract: PURPOSE:To lighten the deterioration of the resolution by the image face curvature of a projecting lens by providing an image face curvature correction system. CONSTITUTION:The image curvature correction system comprises a reflection mirror 41, which is the image face position measuring means which measures the position of each image face of the detection mark being made on a reticle 10 by the exposure light passing through a projecting lens 3, a reflection mirror 41, a light receiver 50, an operating circuit 42, and a second driving circuit 43, which is the driving means for driving the curvature means of a wafer holder 20, according to the position of each image face of the detection mark measured with said image face position measuring means. Hereupon, the reflection mirror 41 is interposed between the projection lens 3 and the wafer 2 at the time of measurement of said image face position, and reflects the exposure light passing through the projecting lens 3 and enters it into a light receiver 50.

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